DE69207135D1 - Ankerverfahren für Folien von Schaltungen mit Grünschichten - Google Patents

Ankerverfahren für Folien von Schaltungen mit Grünschichten

Info

Publication number
DE69207135D1
DE69207135D1 DE69207135T DE69207135T DE69207135D1 DE 69207135 D1 DE69207135 D1 DE 69207135D1 DE 69207135 T DE69207135 T DE 69207135T DE 69207135 T DE69207135 T DE 69207135T DE 69207135 D1 DE69207135 D1 DE 69207135D1
Authority
DE
Germany
Prior art keywords
foils
circuits
green layers
anchor method
anchor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69207135T
Other languages
English (en)
Other versions
DE69207135T2 (de
Inventor
Gisulfo Baccini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AFCO CV
Original Assignee
Gisulfo Baccini
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gisulfo Baccini filed Critical Gisulfo Baccini
Application granted granted Critical
Publication of DE69207135D1 publication Critical patent/DE69207135D1/de
Publication of DE69207135T2 publication Critical patent/DE69207135T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5194—Metallisation of multilayered ceramics, e.g. for the fabrication of multilayer ceramic capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
DE69207135T 1991-09-30 1992-08-14 Ankerverfahren für Folien von Schaltungen mit Grünschichten Expired - Lifetime DE69207135T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUD910156A IT1252950B (it) 1991-09-30 1991-09-30 Procedimento di bloccaggio fogli per circuiti green-tape

Publications (2)

Publication Number Publication Date
DE69207135D1 true DE69207135D1 (de) 1996-02-08
DE69207135T2 DE69207135T2 (de) 1996-05-15

Family

ID=11420914

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69207135T Expired - Lifetime DE69207135T2 (de) 1991-09-30 1992-08-14 Ankerverfahren für Folien von Schaltungen mit Grünschichten

Country Status (4)

Country Link
US (1) US6017410A (de)
EP (1) EP0535341B1 (de)
DE (1) DE69207135T2 (de)
IT (1) IT1252950B (de)

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US7785098B1 (en) 2001-06-05 2010-08-31 Mikro Systems, Inc. Systems for large area micro mechanical systems
US7141812B2 (en) 2002-06-05 2006-11-28 Mikro Systems, Inc. Devices, methods, and systems involving castings
WO2002098624A1 (en) 2001-06-05 2002-12-12 Mikro Systems Inc. Methods for manufacturing three-dimensional devices and devices created thereby
US7195840B2 (en) * 2001-07-13 2007-03-27 Kaun Thomas D Cell structure for electrochemical devices and method of making same
US8021775B2 (en) 2001-07-13 2011-09-20 Inventek Corporation Cell structure for electrochemical devices and method of making same
US6919125B2 (en) * 2003-08-01 2005-07-19 Northrop Grumman Corporation Dual composition ceramic substrate for microelectronic applications
US8734983B2 (en) * 2004-04-14 2014-05-27 Inventek Corporation Housing for electrochemical devices
US20080116584A1 (en) * 2006-11-21 2008-05-22 Arkalgud Sitaram Self-aligned through vias for chip stacking
EP2559534B1 (de) 2008-09-26 2023-10-25 Raytheon Technologies Corporation Zusammensetzung und Verfahren zur Giessverarbeitung
US8813824B2 (en) 2011-12-06 2014-08-26 Mikro Systems, Inc. Systems, devices, and/or methods for producing holes
US9238338B2 (en) * 2011-12-07 2016-01-19 The Boeing Company Method of fabricating composite laminate structures allowing ply slippage during forming

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US3138514A (en) * 1960-06-20 1964-06-23 Johnson & Johnson Plural ply padding discontinuously bonded and method of manufacture
US3203823A (en) * 1961-12-04 1965-08-31 Orchard Paper Company Cellulose with adhesive spots on both sides thereof in non-registering relationship as insulating material for electrical apparatus
US3560291A (en) * 1964-03-27 1971-02-02 Mobil Oil Corp Bonding thermoplastic resin films by means of radiation from a laser source
US3405045A (en) * 1965-01-11 1968-10-08 Union Carbide Corp Method for inducing chemical reactions with lasers
US3682740A (en) * 1969-07-01 1972-08-08 Charles V Newton Method and means for pre-applying glue and reactivating it for continuous form collating
US3616200A (en) * 1970-01-19 1971-10-26 Du Pont Thermal oxidative degradation resistant structure of an aromatic polymer and certain metal compounds
US3770529A (en) * 1970-08-25 1973-11-06 Ibm Method of fabricating multilayer circuits
ES392201A1 (es) * 1970-09-04 1974-02-01 Italplastic S P A Perfeccionamientos en un elemento flexible plano para el refuerzo de tejidos.
US4025462A (en) * 1974-03-27 1977-05-24 Gte Sylvania Incorporated Ceramic cellular structure having high cell density and catalyst layer
US4069080A (en) * 1976-06-11 1978-01-17 W. R. Grace & Co. Method and apparatus of bonding superposed sheets of polymeric material in a linear weld
US4499149A (en) * 1980-12-15 1985-02-12 M&T Chemicals Inc. Siloxane-containing polymers
JPS60111778A (ja) * 1983-11-24 1985-06-18 Mitsubishi Heavy Ind Ltd 自動溶接装置の制御方法
FR2578099B1 (fr) * 1985-02-26 1987-12-04 Eurofarad Substrat monolithique pour composant electronique de puissance, et procede pour sa fabrication
US4776904A (en) * 1985-07-19 1988-10-11 Miles Inc. Multilayer analytical element and method of making, using ultrasonic or laser energy
JPS62171423A (ja) * 1986-01-22 1987-07-28 Hitachi Ltd 多層構成プリントコイル
EP0235582A3 (de) * 1986-02-27 1989-03-29 Hewlett-Packard Company Verbundenes Presspolster
US4752352A (en) * 1986-06-06 1988-06-21 Michael Feygin Apparatus and method for forming an integral object from laminations
JPH0788456B2 (ja) * 1986-07-23 1995-09-27 三井サイテック株式会社 水溶性高分子組成物の製造方法
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US4816036A (en) * 1986-12-15 1989-03-28 Allied-Signal Inc. Fabrication of ceramic trilayers for a monolithic solid oxide fuel cell
JPS63305594A (ja) * 1987-06-05 1988-12-13 Sumitomo Bakelite Co Ltd 多層プリント回路板の製造方法
JPS6442198A (en) * 1987-08-10 1989-02-14 Sumitomo Bakelite Co Manufacture of multilayer printed circuit board
JPH01136709A (ja) * 1987-11-24 1989-05-30 Fujitsu Ltd プリント基板の積層方法
JPH01220890A (ja) * 1988-02-29 1989-09-04 Toshiba Corp 多層基板
US4957577A (en) * 1988-04-04 1990-09-18 Plascore, Inc. Method for making welded honeycomb core
JPH02241091A (ja) * 1989-03-15 1990-09-25 Matsushita Electric Works Ltd 多層積層板の積層方法
JPH02254789A (ja) * 1989-03-28 1990-10-15 Matsushita Electric Works Ltd 多層積層用積層板のスポット溶着装置
US5089455A (en) * 1989-08-11 1992-02-18 Corning Incorporated Thin flexible sintered structures
JPH07120603B2 (ja) * 1989-10-30 1995-12-20 株式会社村田製作所 セラミックグリーンシートの積層方法および装置
JP2811486B2 (ja) * 1989-12-22 1998-10-15 昭和飛行機工業株式会社 耐熱構造体の製造方法および耐熱構造体
US5217656A (en) * 1990-07-12 1993-06-08 The C. A. Lawton Company Method for making structural reinforcement preforms including energetic basting of reinforcement members
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JP2852805B2 (ja) * 1990-10-31 1999-02-03 昭和飛行機工業株式会社 耐熱構造体の製造方法、および耐熱構造体
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US5219673A (en) * 1991-08-23 1993-06-15 Kaun Thomas D Cell structure for electrochemical devices and method of making same
JPH0870886A (ja) * 1994-09-09 1996-03-19 Kobe Tennenbutsu Kagaku Kk 光学活性体の製造方法

Also Published As

Publication number Publication date
DE69207135T2 (de) 1996-05-15
ITUD910156A0 (it) 1991-09-30
EP0535341B1 (de) 1995-12-27
US6017410A (en) 2000-01-25
IT1252950B (it) 1995-07-06
EP0535341A1 (de) 1993-04-07
ITUD910156A1 (it) 1993-03-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AFCO C.V., AMSTERDAM, NL

8381 Inventor (new situation)

Inventor name: BACCINI, GISULFO, I-31030 MIGNAGOLA DI CARBONE, IT