DE69207520D1 - Elektrische Leiterplattenbaugruppe und Herstellungsverfahren für eine elektrische Leiterplattenbaugruppe - Google Patents

Elektrische Leiterplattenbaugruppe und Herstellungsverfahren für eine elektrische Leiterplattenbaugruppe

Info

Publication number
DE69207520D1
DE69207520D1 DE69207520T DE69207520T DE69207520D1 DE 69207520 D1 DE69207520 D1 DE 69207520D1 DE 69207520 T DE69207520 T DE 69207520T DE 69207520 T DE69207520 T DE 69207520T DE 69207520 D1 DE69207520 D1 DE 69207520D1
Authority
DE
Germany
Prior art keywords
circuit board
electrical circuit
board assembly
manufacturing
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69207520T
Other languages
English (en)
Other versions
DE69207520T2 (de
Inventor
Masahide Tsukamoto
Seiichi Nakatani
Toru Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69207520D1 publication Critical patent/DE69207520D1/de
Publication of DE69207520T2 publication Critical patent/DE69207520T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
DE69207520T 1991-09-05 1992-09-05 Elektrische Leiterplattenbaugruppe und Herstellungsverfahren für eine elektrische Leiterplattenbaugruppe Expired - Fee Related DE69207520T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3225930A JPH0567869A (ja) 1991-09-05 1991-09-05 電装部品接合方法並びにモジユール及び多層基板

Publications (2)

Publication Number Publication Date
DE69207520D1 true DE69207520D1 (de) 1996-02-22
DE69207520T2 DE69207520T2 (de) 1996-08-29

Family

ID=16837124

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69207520T Expired - Fee Related DE69207520T2 (de) 1991-09-05 1992-09-05 Elektrische Leiterplattenbaugruppe und Herstellungsverfahren für eine elektrische Leiterplattenbaugruppe

Country Status (5)

Country Link
US (1) US5406459A (de)
EP (1) EP0530840B1 (de)
JP (1) JPH0567869A (de)
KR (1) KR0142178B1 (de)
DE (1) DE69207520T2 (de)

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US5612512A (en) * 1992-11-11 1997-03-18 Murata Manufacturing Co., Ltd. High frequency electronic component having base substrate formed of bismaleimide-triazine resin and resistant film formed on base substrate
US5479694A (en) 1993-04-13 1996-01-02 Micron Technology, Inc. Method for mounting integrated circuits onto printed circuit boards and testing
EP0645950B1 (de) * 1993-09-21 1998-09-02 Matsushita Electric Industrial Co., Ltd. Verbindungsteil eines Schaltungssubstrats und Verfahren zur Herstellung mehrschichtiger Schaltungssubstrate unter Verwendung dieses Teils
CN1044762C (zh) 1993-09-22 1999-08-18 松下电器产业株式会社 印刷电路板及其制造方法
US5548091A (en) * 1993-10-26 1996-08-20 Tessera, Inc. Semiconductor chip connection components with adhesives and methods for bonding to the chip
JPH08167630A (ja) * 1994-12-15 1996-06-25 Hitachi Ltd チップ接続構造
JP2833521B2 (ja) * 1995-05-18 1998-12-09 日本電気株式会社 配線基板
US6551845B1 (en) * 1996-01-02 2003-04-22 Micron Technology, Inc. Method of temporarily securing a die to a burn-in carrier
US6147870A (en) * 1996-01-05 2000-11-14 Honeywell International Inc. Printed circuit assembly having locally enhanced wiring density
US6460245B1 (en) 1996-03-07 2002-10-08 Tessera, Inc. Method of fabricating semiconductor chip assemblies
US5936847A (en) * 1996-05-02 1999-08-10 Hei, Inc. Low profile electronic circuit modules
US5873161A (en) * 1996-07-23 1999-02-23 Minnesota Mining And Manufacturing Company Method of making a Z axis interconnect circuit
US6208022B1 (en) * 1997-03-27 2001-03-27 Nec Corporation Electronic-circuit assembly
US5902438A (en) * 1997-08-13 1999-05-11 Fry's Metals, Inc. Process for the formation of anisotropic conducting material
US6163957A (en) * 1998-11-13 2000-12-26 Fujitsu Limited Multilayer laminated substrates with high density interconnects and methods of making the same
RU2134498C1 (ru) * 1998-12-08 1999-08-10 Таран Александр Иванович Контактный узел
US6326555B1 (en) 1999-02-26 2001-12-04 Fujitsu Limited Method and structure of z-connected laminated substrate for high density electronic packaging
US6271107B1 (en) 1999-03-31 2001-08-07 Fujitsu Limited Semiconductor with polymeric layer
DE60009464T2 (de) 1999-12-17 2004-08-19 Matsushita Electric Industrial Co., Ltd., Kadoma Leitfähige harzzusammensetzung; elektronisches modul das diese verwendet und verfahren zur herstellung dieses moduls
US6319811B1 (en) 2000-02-22 2001-11-20 Scott Zimmerman Bond ply structure and associated process for interconnection of circuit layer pairs with conductive inks
JP4479083B2 (ja) * 2000-10-03 2010-06-09 パナソニック株式会社 誘電体フィルタ及び端子
US6930395B2 (en) 2000-12-05 2005-08-16 Matsushita Electric Industrial Co., Ltd. Circuit substrate having improved connection reliability and a method for manufacturing the same
JP3867523B2 (ja) * 2000-12-26 2007-01-10 株式会社デンソー プリント基板およびその製造方法
WO2003017367A1 (en) * 2001-08-17 2003-02-27 Virtual Integration, Inc. Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same
TW530377B (en) * 2002-05-28 2003-05-01 Via Tech Inc Structure of laminated substrate with high integration and method of production thereof
US6998539B2 (en) * 2003-05-27 2006-02-14 Xerox Corporation Standoff/mask structure for electrical interconnect
CN101483970B (zh) * 2008-01-10 2010-12-08 欣兴电子股份有限公司 线路板
WO2010146524A1 (en) * 2009-06-19 2010-12-23 Koninklijke Philips Electronics N.V. Conformable electronic devices and methods for their manufacture
JP5426310B2 (ja) * 2009-10-09 2014-02-26 藤倉化成株式会社 電子部品の実装方法および実装体
KR20120110193A (ko) * 2011-03-29 2012-10-10 삼성전자주식회사 불순물 도핑 방법 및 이를 이용한 씨모스 이미지 센서의 제조 방법
GB2499850B (en) * 2012-03-02 2014-07-09 Novalia Ltd Circuit board assembly
JP6225193B2 (ja) * 2013-10-08 2017-11-01 リンテック株式会社 電子部品実装体の製造方法
DE102014217866A1 (de) * 2014-09-08 2016-03-10 Robert Bosch Gmbh Verfahren zum Herstellen eines Elektronikmuduls insbesondere für ein Kfz-Getriebesteuergerät
US10820416B2 (en) * 2015-11-27 2020-10-27 Sony Corporation Substrate apparatus and method of manufacturing the same

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DE3439047A1 (de) * 1984-10-25 1986-04-30 Wilde Membran Impuls Technik GmbH, 5828 Ennepetal Verfahren zur bestueckung einer schaltungsanordnung mit elektronischen bauteilen
JPS61229389A (ja) * 1985-04-03 1986-10-13 イビデン株式会社 セラミツク配線板およびその製造方法
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JPH02198198A (ja) * 1989-01-27 1990-08-06 Cmk Corp 電磁波シールド層を備えるプリント配線板
US4928387A (en) * 1989-09-07 1990-05-29 Rockwell International Corp. Temporary soldering aid for manufacture of printed wiring assemblies
DE9015206U1 (de) * 1990-11-05 1991-01-17 Isabellenhuette Heusler Gmbh Kg, 6340 Dillenburg, De
DE9105035U1 (de) * 1991-04-24 1992-06-17 Siemens Ag, 8000 Muenchen, De
JP2562661Y2 (ja) * 1992-10-13 1998-02-16 株式会社村田製作所 圧電素子の実装構造

Also Published As

Publication number Publication date
DE69207520T2 (de) 1996-08-29
JPH0567869A (ja) 1993-03-19
EP0530840A1 (de) 1993-03-10
KR0142178B1 (ko) 1998-07-15
US5406459A (en) 1995-04-11
EP0530840B1 (de) 1996-01-10

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