DE69208413D1 - Gerät zur automatischen Prüfung von Photomaske - Google Patents

Gerät zur automatischen Prüfung von Photomaske

Info

Publication number
DE69208413D1
DE69208413D1 DE69208413T DE69208413T DE69208413D1 DE 69208413 D1 DE69208413 D1 DE 69208413D1 DE 69208413 T DE69208413 T DE 69208413T DE 69208413 T DE69208413 T DE 69208413T DE 69208413 D1 DE69208413 D1 DE 69208413D1
Authority
DE
Germany
Prior art keywords
photomask
automatic testing
testing
automatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69208413T
Other languages
English (en)
Other versions
DE69208413T2 (de
Inventor
Mark Joseph Whil
Tao-Yi Fu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Instruments Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Instruments Corp filed Critical KLA Instruments Corp
Application granted granted Critical
Publication of DE69208413D1 publication Critical patent/DE69208413D1/de
Publication of DE69208413T2 publication Critical patent/DE69208413T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
DE69208413T 1991-08-22 1992-08-20 Gerät zur automatischen Prüfung von Photomaske Expired - Lifetime DE69208413T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74898491A 1991-08-22 1991-08-22

Publications (2)

Publication Number Publication Date
DE69208413D1 true DE69208413D1 (de) 1996-03-28
DE69208413T2 DE69208413T2 (de) 1996-11-14

Family

ID=25011729

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69208413T Expired - Lifetime DE69208413T2 (de) 1991-08-22 1992-08-20 Gerät zur automatischen Prüfung von Photomaske

Country Status (3)

Country Link
US (4) US5572598A (de)
JP (1) JP3258385B2 (de)
DE (1) DE69208413T2 (de)

Families Citing this family (199)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL99823A0 (en) * 1990-11-16 1992-08-18 Orbot Instr Ltd Optical inspection method and apparatus
US6411377B1 (en) 1991-04-02 2002-06-25 Hitachi, Ltd. Optical apparatus for defect and particle size inspection
DE69208413T2 (de) * 1991-08-22 1996-11-14 Kla Instr Corp Gerät zur automatischen Prüfung von Photomaske
JP3314440B2 (ja) * 1993-02-26 2002-08-12 株式会社日立製作所 欠陥検査装置およびその方法
US5923430A (en) 1993-06-17 1999-07-13 Ultrapointe Corporation Method for characterizing defects on semiconductor wafers
GB9400378D0 (en) * 1994-01-11 1994-03-09 Ebac Ltd Dehumidifiers
US6090555A (en) * 1997-12-11 2000-07-18 Affymetrix, Inc. Scanned image alignment systems and methods
US20030017081A1 (en) * 1994-02-10 2003-01-23 Affymetrix, Inc. Method and apparatus for imaging a sample on a device
US5631734A (en) 1994-02-10 1997-05-20 Affymetrix, Inc. Method and apparatus for detection of fluorescently labeled materials
US6741344B1 (en) 1994-02-10 2004-05-25 Affymetrix, Inc. Method and apparatus for detection of fluorescently labeled materials
JP3647100B2 (ja) * 1995-01-12 2005-05-11 キヤノン株式会社 検査装置およびこれを用いた露光装置やデバイス生産方法
EP0853856B1 (de) * 1995-10-02 2004-12-22 KLA-Tencor Corporation Verbesserung der ausrichtung von inspektionsystemen vor der bildaufnahme
US5801954A (en) * 1996-04-24 1998-09-01 Micron Technology, Inc. Process for designing and checking a mask layout
JP2000512744A (ja) 1996-05-16 2000-09-26 アフィメトリックス，インコーポレイテッド 標識材料を検出するシステムおよび方法
IL118872A (en) * 1996-07-16 2000-06-01 Orbot Instr Ltd Optical inspection method and apparatus
JP3566470B2 (ja) 1996-09-17 2004-09-15 株式会社日立製作所 パターン検査方法及びその装置
US6228539B1 (en) 1996-09-18 2001-05-08 Numerical Technologies, Inc. Phase shifting circuit manufacture method and apparatus
US6381356B1 (en) 1996-10-23 2002-04-30 Nec Corporation Method and apparatus for inspecting high-precision patterns
US6148114A (en) 1996-11-27 2000-11-14 Ultrapointe Corporation Ring dilation and erosion techniques for digital image processing
JPH10307005A (ja) * 1997-05-08 1998-11-17 Dainippon Screen Mfg Co Ltd 測長装置
US6108093A (en) * 1997-06-04 2000-08-22 Lsi Logic Corporation Automated inspection system for residual metal after chemical-mechanical polishing
US5985679A (en) * 1997-06-12 1999-11-16 Lsi Logic Corporation Automated endpoint detection system during chemical-mechanical polishing
US5917932A (en) * 1997-06-24 1999-06-29 International Business Machines Corporation System and method for evaluating image placement on pre-distorted masks
JP4309751B2 (ja) * 1997-06-27 2009-08-05 株式会社東芝 フォトマスク修復方法
JPH1172905A (ja) * 1997-06-27 1999-03-16 Toshiba Corp フォトマスク修復方法、検査方法、検査装置及びフォトマスク製造方法
JP4309752B2 (ja) * 1997-06-27 2009-08-05 株式会社東芝 フォトマスク検査方法、フォトマスク検査装置及びフォトマスク製造方法
US6849363B2 (en) 1997-06-27 2005-02-01 Kabushiki Kaisha Toshiba Method for repairing a photomask, method for inspecting a photomask, method for manufacturing a photomask, and method for manufacturing a semiconductor device
JPH1183753A (ja) * 1997-07-09 1999-03-26 Toshiba Corp 光学式基板検査装置
US6470489B1 (en) 1997-09-17 2002-10-22 Numerical Technologies, Inc. Design rule checking system and method
US7617474B2 (en) * 1997-09-17 2009-11-10 Synopsys, Inc. System and method for providing defect printability analysis of photolithographic masks with job-based automation
US6453452B1 (en) * 1997-12-12 2002-09-17 Numerical Technologies, Inc. Method and apparatus for data hierarchy maintenance in a system for mask description
US6370679B1 (en) 1997-09-17 2002-04-09 Numerical Technologies, Inc. Data hierarchy layout correction and verification method and apparatus
US6757645B2 (en) * 1997-09-17 2004-06-29 Numerical Technologies, Inc. Visual inspection and verification system
US6578188B1 (en) 1997-09-17 2003-06-10 Numerical Technologies, Inc. Method and apparatus for a network-based mask defect printability analysis system
US7093229B2 (en) * 1997-09-17 2006-08-15 Synopsys, Inc. System and method for providing defect printability analysis of photolithographic masks with job-based automation
US7107571B2 (en) * 1997-09-17 2006-09-12 Synopsys, Inc. Visual analysis and verification system using advanced tools
US6614520B1 (en) 1997-12-18 2003-09-02 Kla-Tencor Corporation Method for inspecting a reticle
US6211505B1 (en) 1997-12-25 2001-04-03 Nec Corporation Method and apparatus for checking shape
US6175645B1 (en) 1998-01-22 2001-01-16 Applied Materials, Inc. Optical inspection method and apparatus
US5989444A (en) * 1998-02-13 1999-11-23 Zywno; Marek Fluid bearings and vacuum chucks and methods for producing same
US6091845A (en) 1998-02-24 2000-07-18 Micron Technology, Inc. Inspection technique of photomask
US6137570A (en) * 1998-06-30 2000-10-24 Kla-Tencor Corporation System and method for analyzing topological features on a surface
US6687396B1 (en) * 1998-07-29 2004-02-03 Pentax Corporation Optical member inspection apparatus, image-processing apparatus, image-processing method, and computer readable medium
JP2947513B1 (ja) * 1998-07-30 1999-09-13 株式会社ニデック パターン検査装置
JP3535390B2 (ja) * 1998-09-03 2004-06-07 株式会社東芝 露光マスクの検査方法および測長箇所を探索するプログラムを記録した記録媒体
US6122046A (en) * 1998-10-02 2000-09-19 Applied Materials, Inc. Dual resolution combined laser spot scanning and area imaging inspection
JP3693508B2 (ja) * 1998-10-28 2005-09-07 株式会社東京精密 パターン比較方法および外観検査装置
JP3139998B2 (ja) * 1998-12-01 2001-03-05 株式会社東京精密 外観検査装置及び方法
JP2000193443A (ja) * 1998-12-28 2000-07-14 Hitachi Ltd パタ―ン欠陥検査方法及びその装置
DE69906469T2 (de) * 1999-01-28 2004-02-12 Fujifilm Electronic Imaging Ltd. Verfahren zur Erzeugung einer lasttragenden Oberfläche
US6134014A (en) * 1999-02-08 2000-10-17 Taiwan Semiconductor Manufacturing Company Apparatus and method of inspecting phase shift masks using comparison of a mask die image to the mask image database
US6233350B1 (en) * 1999-03-04 2001-05-15 Materials Technologies Corporation Apparatus for viewing and inspecting a surface area of an object
JP2000280570A (ja) * 1999-03-31 2000-10-10 Brother Ind Ltd 画像形成装置
KR20020011416A (ko) * 1999-05-18 2002-02-08 조셉 제이. 스위니 마스트와 비교함으로써 물체의 검사를 수행하는 방법 및장치
US8531678B2 (en) 1999-07-09 2013-09-10 Nova Measuring Instruments, Ltd. Method and system for measuring patterned structures
IL130874A (en) * 1999-07-09 2002-12-01 Nova Measuring Instr Ltd System and method for measuring pattern structures
US6268093B1 (en) * 1999-10-13 2001-07-31 Applied Materials, Inc. Method for reticle inspection using aerial imaging
JP2003514234A (ja) * 1999-11-12 2003-04-15 ゴー・センサーズ・エルエルシー 画像測定方法および装置
JP4486217B2 (ja) * 2000-05-01 2010-06-23 浜松ホトニクス株式会社 厚み計測装置、及びそれを用いたウエットエッチング装置、ウエットエッチング方法
JP3874996B2 (ja) * 2000-05-30 2007-01-31 ファブソリューション株式会社 デバイス検査方法および装置
JP2001343336A (ja) 2000-05-31 2001-12-14 Nidek Co Ltd 欠陥検査方法及び欠陥検査装置
US6603542B1 (en) 2000-06-14 2003-08-05 Qc Optics, Inc. High sensitivity optical inspection system and method for detecting flaws on a diffractive surface
DE10039337A1 (de) * 2000-08-04 2002-02-28 Infineon Technologies Ag Kombination von abtastenden und abbildenden Methoden bei der Überprüfung von Photomasken
US6919957B2 (en) 2000-09-20 2005-07-19 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen
US7106425B1 (en) 2000-09-20 2006-09-12 Kla-Tencor Technologies Corp. Methods and systems for determining a presence of defects and a thin film characteristic of a specimen
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US6694284B1 (en) 2000-09-20 2004-02-17 Kla-Tencor Technologies Corp. Methods and systems for determining at least four properties of a specimen
US6782337B2 (en) 2000-09-20 2004-08-24 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension an a presence of defects on a specimen
US6812045B1 (en) 2000-09-20 2004-11-02 Kla-Tencor, Inc. Methods and systems for determining a characteristic of a specimen prior to, during, or subsequent to ion implantation
US7130029B2 (en) 2000-09-20 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for determining an adhesion characteristic and a thickness of a specimen
US20020190207A1 (en) 2000-09-20 2002-12-19 Ady Levy Methods and systems for determining a characteristic of micro defects on a specimen
US6673637B2 (en) 2000-09-20 2004-01-06 Kla-Tencor Technologies Methods and systems for determining a presence of macro defects and overlay of a specimen
US6792590B1 (en) 2000-09-29 2004-09-14 Numerical Technologies, Inc. Dissection of edges with projection points in a fabrication layout for correcting proximity effects
US6539521B1 (en) 2000-09-29 2003-03-25 Numerical Technologies, Inc. Dissection of corners in a fabrication layout for correcting proximity effects
US6453457B1 (en) 2000-09-29 2002-09-17 Numerical Technologies, Inc. Selection of evaluation point locations based on proximity effects model amplitudes for correcting proximity effects in a fabrication layout
US6625801B1 (en) 2000-09-29 2003-09-23 Numerical Technologies, Inc. Dissection of printed edges from a fabrication layout for correcting proximity effects
US6831742B1 (en) 2000-10-23 2004-12-14 Applied Materials, Inc Monitoring substrate processing using reflected radiation
JP3266602B1 (ja) * 2000-10-30 2002-03-18 洋一 奥寺 アドレス照会システム、コンピュータプログラム製品及びその方法
JP2002169268A (ja) 2000-11-30 2002-06-14 Nec Corp 光学式レチクル基板検査装置及びそのビーム走査方法
US6665856B1 (en) 2000-12-01 2003-12-16 Numerical Technologies, Inc. Displacing edge segments on a fabrication layout based on proximity effects model amplitudes for correcting proximity effects
US7072034B2 (en) * 2001-06-08 2006-07-04 Kla-Tencor Corporation Systems and methods for inspection of specimen surfaces
US6925202B2 (en) * 2001-03-20 2005-08-02 Synopsys, Inc. System and method of providing mask quality control
US6873720B2 (en) * 2001-03-20 2005-03-29 Synopsys, Inc. System and method of providing mask defect printability analysis
US6665065B1 (en) * 2001-04-09 2003-12-16 Advanced Micro Devices, Inc. Defect detection in pellicized reticles via exposure at short wavelengths
US6674522B2 (en) 2001-05-04 2004-01-06 Kla-Tencor Technologies Corporation Efficient phase defect detection system and method
US6789237B1 (en) * 2001-05-11 2004-09-07 Northwestern University Efficient model order reduction via multi-point moment matching
US7318912B2 (en) * 2001-06-07 2008-01-15 Nanostream, Inc. Microfluidic systems and methods for combining discrete fluid volumes
US7072502B2 (en) 2001-06-07 2006-07-04 Applied Materials, Inc. Alternating phase-shift mask inspection method and apparatus
US6560766B2 (en) 2001-07-26 2003-05-06 Numerical Technologies, Inc. Method and apparatus for analyzing a layout using an instance-based representation
US6721928B2 (en) 2001-07-26 2004-04-13 Numerical Technologies, Inc. Verification utilizing instance-based hierarchy management
US7014955B2 (en) * 2001-08-28 2006-03-21 Synopsys, Inc. System and method for indentifying dummy features on a mask layer
JP2003066341A (ja) * 2001-08-28 2003-03-05 Nec Corp レチクル検査装置
US6670082B2 (en) * 2001-10-09 2003-12-30 Numerical Technologies, Inc. System and method for correcting 3D effects in an alternating phase-shifting mask
US6624403B2 (en) 2001-10-11 2003-09-23 Therma-Wave, Inc. Autofocus system
US6903446B2 (en) * 2001-10-23 2005-06-07 Cree, Inc. Pattern for improved visual inspection of semiconductor devices
US6976240B2 (en) * 2001-11-14 2005-12-13 Synopsys Inc. Simulation using design geometry information
US20040032581A1 (en) * 2002-01-15 2004-02-19 Mehrdad Nikoonahad Systems and methods for inspection of specimen surfaces
US7236847B2 (en) * 2002-01-16 2007-06-26 Kla-Tencor Technologies Corp. Systems and methods for closed loop defect reduction
JP3913555B2 (ja) * 2002-01-17 2007-05-09 ファブソリューション株式会社 膜厚測定方法および膜厚測定装置
US6727512B2 (en) * 2002-03-07 2004-04-27 Kla-Tencor Technologies Corporation Method and system for detecting phase defects in lithographic masks and semiconductor wafers
US20030227614A1 (en) * 2002-06-05 2003-12-11 Taminiau August A. Laser machining apparatus with automatic focusing
US7155052B2 (en) * 2002-06-10 2006-12-26 Tokyo Seimitsu (Israel) Ltd Method for pattern inspection
US6850321B1 (en) * 2002-07-09 2005-02-01 Kla-Tencor Technologies Corporation Dual stage defect region identification and defect detection method and apparatus
KR100494146B1 (ko) * 2002-07-16 2005-06-13 주식회사 하이닉스반도체 파티클검사장치의 다용도 홀더 및 그를 이용한 검사방법
US6861660B2 (en) * 2002-07-29 2005-03-01 Applied Materials, Inc. Process and assembly for non-destructive surface inspection
US6930770B2 (en) * 2002-08-08 2005-08-16 Applied Materials, Israel, Ltd. High throughput inspection system and method for generating transmitted and/or reflected images
US6937343B2 (en) * 2002-08-29 2005-08-30 Applied Materials, Israel, Ltd. Laser scanner with amplitude and phase detection
US7043071B2 (en) * 2002-09-13 2006-05-09 Synopsys, Inc. Soft defect printability simulation and analysis for masks
US7095507B1 (en) * 2002-09-27 2006-08-22 Kla-Tencor Technologies Corporation Method and apparatus using microscopic and interferometric based detection
US7061625B1 (en) 2002-09-27 2006-06-13 Kla-Tencor Technologies Corporation Method and apparatus using interferometric metrology for high aspect ratio inspection
US7379175B1 (en) 2002-10-15 2008-05-27 Kla-Tencor Technologies Corp. Methods and systems for reticle inspection and defect review using aerial imaging
US7123356B1 (en) 2002-10-15 2006-10-17 Kla-Tencor Technologies Corp. Methods and systems for inspecting reticles using aerial imaging and die-to-database detection
US7027143B1 (en) 2002-10-15 2006-04-11 Kla-Tencor Technologies Corp. Methods and systems for inspecting reticles using aerial imaging at off-stepper wavelengths
US7133119B1 (en) 2002-12-17 2006-11-07 Kla-Tencor Technologies Corp. Systems for simulating high NA and polarization effects in aerial images
JP4220287B2 (ja) * 2003-03-31 2009-02-04 株式会社東芝 パターン欠陥検査装置
DE10316821A1 (de) * 2003-04-03 2004-10-21 Infineon Technologies Ag Verfahren und Vorrichtung zur Korrektur von Abbildungsfehlern eines optischen Systems sowie eine Verwendung der Vorrichtung
JP2004354088A (ja) 2003-05-27 2004-12-16 Toshiba Corp 検査装置及びマスク製造方法
DE10331594A1 (de) * 2003-07-11 2005-01-27 Leica Microsystems Semiconductor Gmbh Verfahren zur Inspektion von Strukturen auf Halbleitersubstraten
DE10331686A1 (de) * 2003-07-14 2005-02-17 Leica Microsystems Semiconductor Gmbh Verfahren zur Bewertung von aufgenommenen Bildern von Wafern
TWI336914B (en) * 2003-09-26 2011-02-01 Sumitomo Chemical Co Method for evaluating solution for coating film for semiconductor
JP4758358B2 (ja) 2004-01-29 2011-08-24 ケーエルエー−テンカー コーポレイション レチクル設計データにおける欠陥を検出するためのコンピュータに実装される方法
US7448012B1 (en) 2004-04-21 2008-11-04 Qi-De Qian Methods and system for improving integrated circuit layout
JP2007536552A (ja) * 2004-05-10 2007-12-13 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 光学精密測定装置及び方法
JP4904034B2 (ja) 2004-09-14 2012-03-28 ケーエルエー−テンカー コーポレイション レチクル・レイアウト・データを評価するための方法、システム及び搬送媒体
DE102005032601A1 (de) * 2005-01-07 2006-07-20 Heidelberger Druckmaschinen Ag Druckmaschine
US7856138B2 (en) * 2005-02-24 2010-12-21 Applied Materials Israel, Ltd. System, method and computer software product for inspecting charged particle responsive resist
KR100674973B1 (ko) * 2005-05-25 2007-01-29 삼성전자주식회사 투과율이 다른 복수의 다이들을 갖는 포토마스크의 결함검사 방법
US7769225B2 (en) 2005-08-02 2010-08-03 Kla-Tencor Technologies Corp. Methods and systems for detecting defects in a reticle design pattern
JP4185516B2 (ja) * 2005-08-31 2008-11-26 アドバンスド・マスク・インスペクション・テクノロジー株式会社 試料検査装置、試料検査方法及びプログラム
JP4336672B2 (ja) * 2005-09-26 2009-09-30 アドバンスド・マスク・インスペクション・テクノロジー株式会社 試料検査装置、試料検査方法及びプログラム
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8041103B2 (en) 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
JP2007178144A (ja) * 2005-12-27 2007-07-12 Advanced Mask Inspection Technology Kk パターン検査装置、パターン検査方法、検査対象試料、及び検査対象試料の管理方法
KR100720364B1 (ko) * 2006-01-11 2007-05-23 삼성전자주식회사 공기조화기의 히터 제어 장치 및 방법
US8055098B2 (en) 2006-01-27 2011-11-08 Affymetrix, Inc. System, method, and product for imaging probe arrays with small feature sizes
US9445025B2 (en) 2006-01-27 2016-09-13 Affymetrix, Inc. System, method, and product for imaging probe arrays with small feature sizes
JP4988224B2 (ja) * 2006-03-01 2012-08-01 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置
JP4760564B2 (ja) * 2006-06-20 2011-08-31 日本電気株式会社 パターン形状の欠陥検出方法及び検出装置
TW200801487A (en) * 2006-06-23 2008-01-01 Innolux Display Corp Method and device for detecting circuit
US9255348B2 (en) 2006-08-25 2016-02-09 The Trustees Of Columbia University In The City Of New York Systems and methods for biodosimetry with biochip using gene expression signatures
US20080179301A1 (en) * 2006-08-25 2008-07-31 Guy Garty Systems and methods for etching materials
KR100791005B1 (ko) * 2006-12-01 2008-01-04 삼성전자주식회사 사입사 조건에서의 포토마스크의 투과율 측정장치 및 그를이용한 측정방법
JP4065893B1 (ja) * 2006-12-04 2008-03-26 東京エレクトロン株式会社 欠陥検出装置、欠陥検出方法、情報処理装置、情報処理方法及びそのプログラム
JP4102842B1 (ja) * 2006-12-04 2008-06-18 東京エレクトロン株式会社 欠陥検出装置、欠陥検出方法、情報処理装置、情報処理方法及びそのプログラム
US7877722B2 (en) 2006-12-19 2011-01-25 Kla-Tencor Corp. Systems and methods for creating inspection recipes
US8194968B2 (en) 2007-01-05 2012-06-05 Kla-Tencor Corp. Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
JP2008249921A (ja) 2007-03-30 2008-10-16 Advanced Mask Inspection Technology Kk レチクル欠陥検査装置およびレチクル欠陥検査方法
US7962863B2 (en) 2007-05-07 2011-06-14 Kla-Tencor Corp. Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer
US7738093B2 (en) 2007-05-07 2010-06-15 Kla-Tencor Corp. Methods for detecting and classifying defects on a reticle
US8213704B2 (en) 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
KR100883505B1 (ko) 2007-06-26 2009-02-16 포항공과대학교 산학협력단 마스크 검사 장치 및 방법
US7796804B2 (en) 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US7711514B2 (en) 2007-08-10 2010-05-04 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan
JP5425779B2 (ja) 2007-08-20 2014-02-26 ケーエルエー−テンカー・コーポレーション 実際の欠陥が潜在的にシステム的な欠陥であるか、または潜在的にランダムな欠陥であるかを判断する、コンピューターに実装された方法
US20090153824A1 (en) * 2007-12-17 2009-06-18 Kla-Tencor Corporation Multiple chuck scanning stage
US8131055B2 (en) * 2008-01-31 2012-03-06 Caterpillar Inc. System and method for assembly inspection
US8139844B2 (en) 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
KR101623747B1 (ko) * 2008-07-28 2016-05-26 케이엘에이-텐코어 코오포레이션 웨이퍼 상의 메모리 디바이스 영역에서 검출된 결함들을 분류하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US9041903B2 (en) * 2009-04-13 2015-05-26 Asml Holding N.V. Mask inspection with fourier filtering and image compare
DE102009019711A1 (de) * 2009-05-05 2010-11-18 Biametrics Marken Und Rechte Gmbh Verfahren und Vorrichtung zur Bestimmung von Reflexionskoeffizienten an Filteranordnung mit dünnen Schichten
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
US9110282B2 (en) * 2011-03-30 2015-08-18 The Regents Of The University Of California Nanometer-scale optical imaging by the modulation tracking (MT) method
US8873596B2 (en) 2011-07-22 2014-10-28 Kla-Tencor Corporation Laser with high quality, stable output beam, and long life high conversion efficiency non-linear crystal
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
DE102012101643A1 (de) 2012-02-29 2013-08-29 Scanlab Ag Vorrichtung und Verfahren zum Ablenken von elektro-magnetischer Strahlung, Vorrichtung und Verfahren zum Bestrahlen eines Körpers
US9304160B1 (en) 2012-05-08 2016-04-05 Kla-Tencor Corporation Defect inspection apparatus, system, and method
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9723720B2 (en) * 2012-07-12 2017-08-01 Konrad Gmbh Device for producing and/or processing a workpiece
US9042006B2 (en) 2012-09-11 2015-05-26 Kla-Tencor Corporation Solid state illumination source and inspection system
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
US8929406B2 (en) 2013-01-24 2015-01-06 Kla-Tencor Corporation 193NM laser and inspection system
WO2014149197A1 (en) 2013-02-01 2014-09-25 Kla-Tencor Corporation Detecting defects on a wafer using defect-specific and multi-channel information
US9529182B2 (en) 2013-02-13 2016-12-27 KLA—Tencor Corporation 193nm laser and inspection system
US9448343B2 (en) 2013-03-15 2016-09-20 Kla-Tencor Corporation Segmented mirror apparatus for imaging and method of using the same
US9608399B2 (en) 2013-03-18 2017-03-28 Kla-Tencor Corporation 193 nm laser and an inspection system using a 193 nm laser
JP6170707B2 (ja) 2013-04-01 2017-07-26 株式会社ニューフレアテクノロジー 検査方法および検査装置
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
US9804101B2 (en) 2014-03-20 2017-10-31 Kla-Tencor Corporation System and method for reducing the bandwidth of a laser and an inspection system and method using a laser
US9419407B2 (en) 2014-09-25 2016-08-16 Kla-Tencor Corporation Laser assembly and inspection system using monolithic bandwidth narrowing apparatus
US9748729B2 (en) 2014-10-03 2017-08-29 Kla-Tencor Corporation 183NM laser and inspection system
KR102242559B1 (ko) 2014-12-01 2021-04-20 삼성전자주식회사 광학 검사 장치
CN104765173B (zh) * 2015-04-29 2018-01-16 京东方科技集团股份有限公司 一种检测装置及其检测方法
US9996766B2 (en) 2015-05-01 2018-06-12 Corning Incorporated Imaging-based methods for detecting and measuring defects in extruded cellular ceramic articles
EP3298583B1 (de) 2015-05-21 2020-04-08 Corning Incorporated Verfahren zur inspektion von zellulären artikeln
JP6783644B2 (ja) * 2016-12-12 2020-11-11 株式会社日立製作所 異物検査装置
US10175555B2 (en) 2017-01-03 2019-01-08 KLA—Tencor Corporation 183 nm CW laser and inspection system
US10451563B2 (en) * 2017-02-21 2019-10-22 Kla-Tencor Corporation Inspection of photomasks by comparing two photomasks
US20210270736A1 (en) * 2018-07-18 2021-09-02 Dr. Johannes Heidenhain Gmbh Diffractive biosensor
JP6999137B2 (ja) 2019-08-20 2022-01-18 株式会社カサイ 養殖池用水質管理装置及び方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3851951A (en) * 1974-01-16 1974-12-03 Isomet Corp High resolution laser beam recorder with self-focusing acousto-optic scanner
US4247203A (en) * 1978-04-03 1981-01-27 Kla Instrument Corporation Automatic photomask inspection system and apparatus
JPS5867093A (ja) * 1981-10-19 1983-04-21 株式会社東芝 印刷回路基板検査方法及びその装置
JPS58162038A (ja) * 1982-03-23 1983-09-26 Canon Inc 面状態検査装置
US4500202A (en) * 1982-05-24 1985-02-19 Itek Corporation Printed circuit board defect detection of detecting maximum line width violations
US4926489A (en) * 1983-03-11 1990-05-15 Kla Instruments Corporation Reticle inspection system
US4579455A (en) * 1983-05-09 1986-04-01 Kla Instruments Corporation Photomask inspection apparatus and method with improved defect detection
US4644172A (en) * 1984-02-22 1987-02-17 Kla Instruments Corporation Electronic control of an automatic wafer inspection system
US4633504A (en) * 1984-06-28 1986-12-30 Kla Instruments Corporation Automatic photomask inspection system having image enhancement means
US4778984A (en) * 1985-10-16 1988-10-18 Canon Denshi Kabushiki Kaisha Apparatus for detecting focus from astigmatism
US4910690A (en) * 1986-02-14 1990-03-20 Citizen Watch Co., Ltd. Micro-dimensional measurement apparatus
JPS62247478A (ja) * 1986-04-21 1987-10-28 Hitachi Ltd パタ−ン検査装置
US4805123B1 (en) * 1986-07-14 1998-10-13 Kla Instr Corp Automatic photomask and reticle inspection method and apparatus including improved defect detector and alignment sub-systems
US5231621A (en) * 1986-09-05 1993-07-27 Canon Kabushiki Kaisha Focus detector which serves to split off a portion of a detected light beam only when the detected light beam is not refocused at an expected refocus point
JPH0682102B2 (ja) * 1987-02-27 1994-10-19 三菱電機株式会社 パターン欠陥検査装置及びパターン欠陥検査方法
JP2514037B2 (ja) * 1987-07-02 1996-07-10 キヤノン株式会社 検知光学系
US4916340A (en) * 1988-01-22 1990-04-10 Canon Kabushiki Kaisha Movement guiding mechanism
US4926081A (en) * 1988-02-11 1990-05-15 Copeland Corporation Thermally protected hermetic motor compressor
US4969200A (en) * 1988-03-25 1990-11-06 Texas Instruments Incorporated Target autoalignment for pattern inspector or writer
US4975972A (en) * 1988-10-18 1990-12-04 At&T Bell Laboratories Method and apparatus for surface inspection
JP2796316B2 (ja) * 1988-10-24 1998-09-10 株式会社日立製作所 欠陥または異物の検査方法およびその装置
US5008851A (en) * 1989-03-27 1991-04-16 Grumman Aerospace Corporation Optical heterodyning system and method for rapid optical phase and amplitude measurements
US5133601A (en) * 1991-06-12 1992-07-28 Wyko Corporation Rough surface profiler and method
DE69208413T2 (de) * 1991-08-22 1996-11-14 Kla Instr Corp Gerät zur automatischen Prüfung von Photomaske

Also Published As

Publication number Publication date
US6052478A (en) 2000-04-18
US6363166B1 (en) 2002-03-26
US20020054702A1 (en) 2002-05-09
DE69208413T2 (de) 1996-11-14
US5572598A (en) 1996-11-05
US6584218B2 (en) 2003-06-24
JP3258385B2 (ja) 2002-02-18
JPH06294750A (ja) 1994-10-21

Similar Documents

Publication Publication Date Title
DE69208413D1 (de) Gerät zur automatischen Prüfung von Photomaske
DE69425822D1 (de) Automatisches inspektionsgerät
DE69221665D1 (de) Verfahren zur Ermittlung einer Belichtung
DE69026839D1 (de) Vorrichtung zur kontrolle von blaseninkontinenz
DE68929193D1 (de) Gerät zur Farbfilmanalyse
DE69013261T2 (de) Einrichtung zur automatischen Einstellung der Belichtung.
DE3855913T2 (de) Gerät zur inspektion von Walzzeichen
DE68914738T2 (de) Gerät zur automatischen schaltungsinternen Prüfung von Teilnehmerschaltungen und Verfahren.
DE69333571D1 (de) Gerät zur automatischen prüfung von komplexen vorrichtungen
DE59209718D1 (de) Einrichtung zur automatischen Untersuchung von Blutproben
DE69208108T3 (de) Verfahren zur Prüfung von Gasleckage
DE69304547D1 (de) Vorrichtung zur prüfung von schlachtkörpern
DE69122187D1 (de) Verfahren zur Bandstandskontrolle
DE69025812D1 (de) Verfahren und Gerät zur automatischen Durchführung von Prüfmustererzeugung
DE69223826D1 (de) Gerät zur Entwicklung von Photoresists
DE69030677T2 (de) Vorrichtung zur Feststellung des Fokussierungszustandes
DE59107865D1 (de) Verfahren zur Füllstandsmessung
NO173223C (no) Utsetningsanordning for frittfallbaat
DE69305769T2 (de) Gerät zur Filmlängenprüfung
KR930004558U (ko) 핸들러의 디바이스 자동분류 장치
DE68908892D1 (de) Einrichtung zur Prüfung von IC-Bausteinen.
KR910002232U (ko) 자동 때밀이기의 타임장치
KR930004554U (ko) 핸들러의 디바이스 자동파지장치
DE9018080U1 (de) Einrichtung zur automatischen Überprüfung von Magnetbandgeräten
KR940008304U (ko) 에이티비(atb)의 자동 측정장치

Legal Events

Date Code Title Description
8381 Inventor (new situation)

Free format text: WIHL, MARK JOSEPH, TRANCY, CALIFORNIA 95376, US FU, TAO-YI, FREMONT, CALIFORNIA 94539, US ZWYNO, MAREK, SAN JOSE, CALIFORNIA 95120, US KVAMME, DAMON FLOYD, ANN ARBOR, CALIFORNIA 48105, US FEIN, MICHAEL E., MOUNTAIN VIEW, CALIFORNIA 94040, US

8364 No opposition during term of opposition
R071 Expiry of right

Ref document number: 532927

Country of ref document: EP