DE69208675T2 - Kupferaluminat enthalterde paste auf kupferbasis für mikrostrukturelle und schrumpfungs-beherrschung von kupfergefüllten kontaktlöchern - Google Patents
Kupferaluminat enthalterde paste auf kupferbasis für mikrostrukturelle und schrumpfungs-beherrschung von kupfergefüllten kontaktlöchernInfo
- Publication number
- DE69208675T2 DE69208675T2 DE1992608675 DE69208675T DE69208675T2 DE 69208675 T2 DE69208675 T2 DE 69208675T2 DE 1992608675 DE1992608675 DE 1992608675 DE 69208675 T DE69208675 T DE 69208675T DE 69208675 T2 DE69208675 T2 DE 69208675T2
- Authority
- DE
- Germany
- Prior art keywords
- copper
- shrinkling
- microstructural
- control
- contact holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/758,991 US5925443A (en) | 1991-09-10 | 1991-09-10 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias |
PCT/EP1992/001414 WO1993005632A1 (en) | 1991-09-10 | 1992-06-23 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69208675D1 DE69208675D1 (de) | 1996-04-04 |
DE69208675T2 true DE69208675T2 (de) | 1996-09-26 |
Family
ID=25053958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1992608675 Expired - Fee Related DE69208675T2 (de) | 1991-09-10 | 1992-06-23 | Kupferaluminat enthalterde paste auf kupferbasis für mikrostrukturelle und schrumpfungs-beherrschung von kupfergefüllten kontaktlöchern |
Country Status (7)
Country | Link |
---|---|
US (3) | US5925443A (de) |
EP (1) | EP0606216B1 (de) |
JP (1) | JPH0817217B2 (de) |
BR (1) | BR9203415A (de) |
CA (1) | CA2072727A1 (de) |
DE (1) | DE69208675T2 (de) |
WO (1) | WO1993005632A1 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0569799B1 (de) * | 1992-05-14 | 2000-09-06 | Matsushita Electric Industrial Co., Ltd. | Verfahren zur Herstellung von Leitern in Kontaktlöcher in vielschichtigen Keramiksubstraten |
US5858193A (en) * | 1995-06-06 | 1999-01-12 | Sarnoff Corporation | Electrokinetic pumping |
US5698015A (en) * | 1995-05-19 | 1997-12-16 | Nikko Company | Conductor paste for plugging through-holes in ceramic circuit boards and a ceramic circuit board having this conductor paste |
US20030148024A1 (en) * | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
US6376054B1 (en) * | 1999-02-10 | 2002-04-23 | International Business Machines Corporation | Surface metallization structure for multiple chip test and burn-in |
US6171988B1 (en) | 1999-07-30 | 2001-01-09 | International Business Machines Corporation | Low loss glass ceramic composition with modifiable dielectric constant |
US20070163641A1 (en) * | 2004-02-19 | 2007-07-19 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer from inter-metallic nanoflake particles |
US7604843B1 (en) | 2005-03-16 | 2009-10-20 | Nanosolar, Inc. | Metallic dispersion |
US8623448B2 (en) * | 2004-02-19 | 2014-01-07 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer from chalcogenide microflake particles |
US8048477B2 (en) * | 2004-02-19 | 2011-11-01 | Nanosolar, Inc. | Chalcogenide solar cells |
US7700464B2 (en) * | 2004-02-19 | 2010-04-20 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer from nanoflake particles |
US8309163B2 (en) * | 2004-02-19 | 2012-11-13 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer by use of chalcogen-containing vapor and inter-metallic material |
US8372734B2 (en) | 2004-02-19 | 2013-02-12 | Nanosolar, Inc | High-throughput printing of semiconductor precursor layer from chalcogenide nanoflake particles |
US7605328B2 (en) * | 2004-02-19 | 2009-10-20 | Nanosolar, Inc. | Photovoltaic thin-film cell produced from metallic blend using high-temperature printing |
US8329501B1 (en) | 2004-02-19 | 2012-12-11 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer from inter-metallic microflake particles |
US20070163639A1 (en) * | 2004-02-19 | 2007-07-19 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer from microflake particles |
US20070169809A1 (en) * | 2004-02-19 | 2007-07-26 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer by use of low-melting chalcogenides |
US8846141B1 (en) | 2004-02-19 | 2014-09-30 | Aeris Capital Sustainable Ip Ltd. | High-throughput printing of semiconductor precursor layer from microflake particles |
US20070163642A1 (en) * | 2004-02-19 | 2007-07-19 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer from inter-metallic microflake articles |
US7663057B2 (en) * | 2004-02-19 | 2010-02-16 | Nanosolar, Inc. | Solution-based fabrication of photovoltaic cell |
TWI422485B (zh) * | 2010-12-31 | 2014-01-11 | Tong Hsing Electronic Ind Ltd | 一種具有反射膜之陶瓷基板及其製造方法 |
JP2022521578A (ja) | 2019-02-21 | 2022-04-11 | コーニング インコーポレイテッド | 銅金属化貫通孔を有するガラスまたはガラスセラミック物品およびその製造方法 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3838071A (en) * | 1972-06-30 | 1974-09-24 | Du Pont | High adhesion silver-based metallizations |
US4072771A (en) * | 1975-11-28 | 1978-02-07 | Bala Electronics Corporation | Copper thick film conductor |
US4090009A (en) * | 1977-03-11 | 1978-05-16 | E. I. Du Pont De Nemours And Company | Novel silver compositions |
US4301324A (en) * | 1978-02-06 | 1981-11-17 | International Business Machines Corporation | Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper |
US4234367A (en) * | 1979-03-23 | 1980-11-18 | International Business Machines Corporation | Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors |
FR2508054A1 (fr) * | 1981-06-19 | 1982-12-24 | Labo Electronique Physique | Melange de depart pour une encre serigraphiable contenant un verre au plomb a cuire en atmosphere non oxydante et encre serigraphiable obtenue |
US4584181A (en) * | 1982-12-27 | 1986-04-22 | Sri International | Process and apparatus for obtaining silicon from fluosilicic acid |
US4503090A (en) * | 1983-02-23 | 1985-03-05 | At&T Bell Laboratories | Thick film resistor circuits |
US4776978A (en) * | 1984-04-26 | 1988-10-11 | International Business Machines Corporation | Method of controlling the sintering of metal particles |
JPS61183807A (ja) * | 1985-02-08 | 1986-08-16 | 松下電器産業株式会社 | メタライズ組成物 |
US4594181A (en) * | 1984-09-17 | 1986-06-10 | E. I. Du Pont De Nemours And Company | Metal oxide-coated copper powder |
US4599277A (en) * | 1984-10-09 | 1986-07-08 | International Business Machines Corp. | Control of the sintering of powdered metals |
US5100714A (en) * | 1986-07-24 | 1992-03-31 | Ceramic Packaging, Inc. | Metallized ceramic substrate and method therefor |
JPH0246553B2 (ja) * | 1986-10-03 | 1990-10-16 | Goei Seisakusho Kk | Metaraizukashitaseramitsukusuoyobisonoseizohoho |
CA1273853C (en) * | 1986-12-17 | 1990-09-11 | METHOD OF PRODUCTION OF A CERAMIC CIRCUIT BOARD | |
US4906405A (en) * | 1987-05-19 | 1990-03-06 | Matsushita Electric Industrial Co., Ltd. | Conductor composition and method of manufacturing a multilayered ceramic body using the composition |
JPS63291304A (ja) * | 1987-05-22 | 1988-11-29 | Matsushita Electric Ind Co Ltd | メタライズ組成物 |
JPS63292504A (ja) * | 1987-05-26 | 1988-11-29 | Matsushita Electric Works Ltd | 導体ペ−スト |
US4865722A (en) | 1987-09-01 | 1989-09-12 | Max Ririe | Method and apparatus for separation using fluidized bed |
JPH01192781A (ja) * | 1988-01-26 | 1989-08-02 | Dai Ichi Kogyo Seiyaku Co Ltd | 銅厚膜導体組成物 |
JPH0728128B2 (ja) * | 1988-03-11 | 1995-03-29 | 松下電器産業株式会社 | セラミック多層配線基板とその製造方法 |
JPH01260712A (ja) * | 1988-04-08 | 1989-10-18 | Tdk Corp | ペースト組成物および導体 |
JPH03116608A (ja) * | 1989-09-29 | 1991-05-17 | Tdk Corp | 導体ペーストおよび導体 |
US5073180A (en) * | 1991-03-20 | 1991-12-17 | International Business Machines Corporation | Method for forming sealed co-fired glass ceramic structures |
JP3116608B2 (ja) | 1992-11-12 | 2000-12-11 | 日本電気株式会社 | 携帯電話装置 |
-
1991
- 1991-09-10 US US07/758,991 patent/US5925443A/en not_active Expired - Fee Related
-
1992
- 1992-06-23 WO PCT/EP1992/001414 patent/WO1993005632A1/en active IP Right Grant
- 1992-06-23 DE DE1992608675 patent/DE69208675T2/de not_active Expired - Fee Related
- 1992-06-23 EP EP19920913656 patent/EP0606216B1/de not_active Expired - Lifetime
- 1992-06-29 CA CA 2072727 patent/CA2072727A1/en not_active Abandoned
- 1992-08-03 JP JP20631392A patent/JPH0817217B2/ja not_active Expired - Lifetime
- 1992-09-01 BR BR9203415A patent/BR9203415A/pt active Search and Examination
-
1995
- 1995-06-06 US US08/466,562 patent/US6358439B1/en not_active Expired - Fee Related
-
1999
- 1999-03-11 US US09/266,338 patent/US6124041A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2072727A1 (en) | 1993-03-11 |
EP0606216A1 (de) | 1994-07-20 |
US5925443A (en) | 1999-07-20 |
JPH05198698A (ja) | 1993-08-06 |
EP0606216B1 (de) | 1996-02-28 |
JPH0817217B2 (ja) | 1996-02-21 |
WO1993005632A1 (en) | 1993-03-18 |
BR9203415A (pt) | 1993-04-13 |
US6358439B1 (en) | 2002-03-19 |
DE69208675D1 (de) | 1996-04-04 |
US6124041A (en) | 2000-09-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |