DE69208924D1 - Kühlsystem mit Flüssigkeitsfilmzwischenschicht zur Bearbeitung von Halbleiterscheiben - Google Patents

Kühlsystem mit Flüssigkeitsfilmzwischenschicht zur Bearbeitung von Halbleiterscheiben

Info

Publication number
DE69208924D1
DE69208924D1 DE69208924T DE69208924T DE69208924D1 DE 69208924 D1 DE69208924 D1 DE 69208924D1 DE 69208924 T DE69208924 T DE 69208924T DE 69208924 T DE69208924 T DE 69208924T DE 69208924 D1 DE69208924 D1 DE 69208924D1
Authority
DE
Germany
Prior art keywords
intermediate layer
cooling system
liquid film
semiconductor wafers
processing semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69208924T
Other languages
English (en)
Inventor
Del Puerto Santiago Ernesto
Paul Matthew Gaschke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69208924D1 publication Critical patent/DE69208924D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
DE69208924T 1991-04-25 1992-03-27 Kühlsystem mit Flüssigkeitsfilmzwischenschicht zur Bearbeitung von Halbleiterscheiben Expired - Lifetime DE69208924D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/691,628 US5088006A (en) 1991-04-25 1991-04-25 Liquid film interface cooling system for semiconductor wafer processing

Publications (1)

Publication Number Publication Date
DE69208924D1 true DE69208924D1 (de) 1996-04-18

Family

ID=24777307

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69208924T Expired - Lifetime DE69208924D1 (de) 1991-04-25 1992-03-27 Kühlsystem mit Flüssigkeitsfilmzwischenschicht zur Bearbeitung von Halbleiterscheiben

Country Status (4)

Country Link
US (1) US5088006A (de)
EP (1) EP0511928B1 (de)
JP (1) JPH0817200B2 (de)
DE (1) DE69208924D1 (de)

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US5972505A (en) * 1989-04-04 1999-10-26 Eastman Chemical Company Fibers capable of spontaneously transporting fluids
US5203401A (en) * 1990-06-29 1993-04-20 Digital Equipment Corporation Wet micro-channel wafer chuck and cooling method
DE9212752U1 (de) * 1992-09-22 1993-03-04 Siemens Ag, 8000 Muenchen, De
US5740016A (en) * 1996-03-29 1998-04-14 Lam Research Corporation Solid state temperature controlled substrate holder
DE19808461A1 (de) 1998-03-02 1999-09-09 Zeiss Carl Fa Retikel mit Kristall-Trägermaterial
US8401336B2 (en) * 2001-05-04 2013-03-19 Legend3D, Inc. System and method for rapid image sequence depth enhancement with augmented computer-generated elements
DE10156407A1 (de) * 2001-11-16 2003-06-05 Bosch Gmbh Robert Haltevorrichtung, insbesondere zum Fixieren eines Halbleiterwafers in einer Plasmaätzvorrichtung, und Verfahren zur Wärmezufuhr oder Wärmeabfuhr von einem Substrat
JP3979143B2 (ja) * 2002-03-27 2007-09-19 株式会社日立製作所 情報処理装置の冷却装置
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
US6907742B2 (en) * 2002-12-19 2005-06-21 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for controlling wafer temperature
US7158211B2 (en) * 2003-09-29 2007-01-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102004057215B4 (de) * 2004-11-26 2008-12-18 Erich Reitinger Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer Sondenkarte unter Verwendung eines temperierten Fluidstrahls
DE102005001163B3 (de) * 2005-01-10 2006-05-18 Erich Reitinger Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer temperierbaren Aufspanneinrichtung
DE102005014513B4 (de) * 2005-03-30 2011-05-12 Att Advanced Temperature Test Systems Gmbh Vorrichtung und Verfahren zum Temperieren eines Substrats, sowie Verfahren zur Herstellung der Vorrichtung
JP4647401B2 (ja) * 2005-06-06 2011-03-09 東京エレクトロン株式会社 基板保持台、基板温度制御装置及び基板温度制御方法
US7593096B2 (en) * 2006-05-15 2009-09-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7466402B2 (en) * 2006-12-18 2008-12-16 Texas Instruments Incorporated System and method for testing a lighting diode
TWI514090B (zh) 2007-07-13 2015-12-21 Mapper Lithography Ip Bv 微影系統及用於支撐晶圓的晶圓台
TW201106107A (en) 2009-02-22 2011-02-16 Mapper Lithography Ip Bv Preparation unit for lithography machine
KR101568652B1 (ko) * 2009-02-22 2015-11-12 마퍼 리쏘그라피 아이피 비.브이. 기판 지지 구조, 클램프 제조 유닛, 및 리소그래피 시스템
CN102870383A (zh) 2010-02-19 2013-01-09 迈普尔平版印刷Ip有限公司 基板支撑结构、夹持准备单元、以及光刻系统
NL1037754C2 (en) * 2010-02-26 2011-08-30 Mapper Lithography Ip Bv Substrate support structure, clamp preparation unit, and lithography system.
NL1038213C2 (en) * 2010-03-04 2012-10-08 Mapper Lithography Ip Bv Substrate support structure, clamp preparation unit, and lithography system.
US8471575B2 (en) 2010-04-30 2013-06-25 International Business Machines Corporation Methodologies and test configurations for testing thermal interface materials
US8686749B2 (en) 2010-04-30 2014-04-01 International Business Machines Corporation Thermal interface material, test structure and method of use
US9377423B2 (en) 2012-12-31 2016-06-28 Cascade Microtech, Inc. Systems and methods for handling substrates at below dew point temperatures
JP6213824B2 (ja) * 2013-11-20 2017-10-18 株式会社リコー シート材載置装置および画像形成装置
CN104882275A (zh) * 2015-06-10 2015-09-02 江苏省电力公司涟水县供电公司 一种带有散热结构的电力电容
US9870934B2 (en) * 2015-07-28 2018-01-16 Micron Technology, Inc. Electrostatic chuck and temperature-control method for the same
JP6510461B2 (ja) * 2016-05-25 2019-05-08 日本特殊陶業株式会社 基板保持装置
JP1624353S (de) * 2018-07-19 2019-02-12
DE102019128942A1 (de) 2019-10-28 2021-04-29 Infineon Technologies Ag Prober mit Kühlmechanismus zum direkten Kühlen einer zu prüfenden Vorrichtung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019098A (en) * 1974-11-25 1977-04-19 Sundstrand Corporation Heat pipe cooling system for electronic devices
US4559580A (en) * 1983-11-04 1985-12-17 Sundstrand Corporation Semiconductor package with internal heat exchanger
US4920574A (en) * 1985-10-04 1990-04-24 Fujitsu Limited Cooling system for an electronic circuit device
US4750086A (en) * 1985-12-11 1988-06-07 Unisys Corporation Apparatus for cooling integrated circuit chips with forced coolant jet
JPH065700B2 (ja) * 1987-07-22 1994-01-19 株式会社日立製作所 電子回路デバイスの冷却装置
US4942497A (en) * 1987-07-24 1990-07-17 Nec Corporation Cooling structure for heat generating electronic components mounted on a substrate
US4918928A (en) * 1987-12-17 1990-04-24 Kabushiki Kaisha Kobe Seikosho Apparatus for testing IC devices at low temperature and cooling bag for use in testing IC devices at low temperature
FR2631010B1 (fr) * 1988-05-06 1991-03-22 Sagem Dispositif de support et de regulation thermique d'une piece et appareillage de test de plaques de circuits semi-conducteurs incluant un tel dispositif
JP2748127B2 (ja) * 1988-09-02 1998-05-06 キヤノン株式会社 ウエハ保持方法
US4956746A (en) * 1989-03-29 1990-09-11 Hughes Aircraft Company Stacked wafer electronic package
JPH0670984B2 (ja) * 1989-09-27 1994-09-07 株式会社日立製作所 試料の温度制御方法及び装置
US4967832A (en) * 1989-12-27 1990-11-06 Nrc Corporation Cooling method and apparatus for integrated circuit chips

Also Published As

Publication number Publication date
EP0511928A1 (de) 1992-11-04
US5088006A (en) 1992-02-11
JPH0817200B2 (ja) 1996-02-21
EP0511928B1 (de) 1996-03-13
JPH04329656A (ja) 1992-11-18

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Legal Events

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8332 No legal effect for de