DE69211667D1 - Gehäuse für elektrisches Bauteil und Herstellungsverfahren - Google Patents
Gehäuse für elektrisches Bauteil und HerstellungsverfahrenInfo
- Publication number
- DE69211667D1 DE69211667D1 DE69211667T DE69211667T DE69211667D1 DE 69211667 D1 DE69211667 D1 DE 69211667D1 DE 69211667 T DE69211667 T DE 69211667T DE 69211667 T DE69211667 T DE 69211667T DE 69211667 D1 DE69211667 D1 DE 69211667D1
- Authority
- DE
- Germany
- Prior art keywords
- housing
- manufacturing process
- electrical component
- electrical
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP36005791A JP3187106B2 (ja) | 1991-12-27 | 1991-12-27 | 電気回路素子のパッケージ構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69211667D1 true DE69211667D1 (de) | 1996-07-25 |
DE69211667T2 DE69211667T2 (de) | 1997-02-06 |
Family
ID=18467687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69211667T Expired - Fee Related DE69211667T2 (de) | 1991-12-27 | 1992-12-22 | Gehäuse für elektrisches Bauteil und Herstellungsverfahren |
Country Status (4)
Country | Link |
---|---|
US (1) | US5554823A (de) |
EP (1) | EP0548913B1 (de) |
JP (1) | JP3187106B2 (de) |
DE (1) | DE69211667T2 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19625228C2 (de) * | 1996-06-24 | 1998-05-14 | Siemens Ag | Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse |
US5986209A (en) | 1997-07-09 | 1999-11-16 | Micron Technology, Inc. | Package stack via bottom leaded plastic (BLP) packaging |
JP4656573B2 (ja) * | 2005-12-08 | 2011-03-23 | ニチコン株式会社 | チップ型固体電解コンデンサ |
KR101938819B1 (ko) * | 2017-03-15 | 2019-04-10 | 한국과학기술연구원 | 습식 스프링클러용 배수, 배기 및 충수장치 그리고 이를 이용한 습식 스프링클러 장치의 배수, 배기 및 충수방법 |
US20220028622A1 (en) * | 2018-11-30 | 2022-01-27 | Panasonic Intellectual Property Management Co., Ltd. | Electrolytic capacitor and method for producing the same |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6027150A (ja) * | 1983-07-25 | 1985-02-12 | Nec Corp | 樹脂封止型半導体装置 |
JPS6132490A (ja) * | 1984-07-24 | 1986-02-15 | 富士通株式会社 | フラツトリ−ドパツケ−ジ型電子部品の取付け構造 |
JPS6298759A (ja) * | 1985-10-25 | 1987-05-08 | Mitsubishi Electric Corp | 電子デバイス |
US4660127A (en) * | 1985-12-17 | 1987-04-21 | North American Philips Corporation | Fail-safe lead configuration for polar SMD components |
JPS63199447A (ja) * | 1987-02-16 | 1988-08-17 | Oki Electric Ind Co Ltd | 半導体装置のリ−ド |
JPH01206652A (ja) * | 1988-02-15 | 1989-08-18 | Hitachi Ltd | 半導体装置 |
US4890154A (en) * | 1988-03-02 | 1989-12-26 | Lsi Logic Corporation | Semiconductor package profile |
JPH01230218A (ja) * | 1988-03-10 | 1989-09-13 | Matsuo Denki Kk | 固体電解コンデンサの端子の処理方法 |
US5107324A (en) * | 1989-04-27 | 1992-04-21 | Fuji Electric Co., Ltd. | Two-terminal semiconductor device of surface installation type |
JPH03116767A (ja) * | 1989-09-28 | 1991-05-17 | Nec Kyushu Ltd | Icのパッケージ |
JPH04246813A (ja) * | 1991-02-01 | 1992-09-02 | Nec Corp | ヒューズ入り固体電解コンデンサ |
EP0689241A2 (de) * | 1991-10-17 | 1995-12-27 | Fujitsu Limited | Halter für Halbleiterteil |
US5281852A (en) * | 1991-12-10 | 1994-01-25 | Normington Peter J C | Semiconductor device including stacked die |
JP2766446B2 (ja) * | 1993-05-12 | 1998-06-18 | ローム株式会社 | 固体電解コンデンサーの構造 |
-
1991
- 1991-12-27 JP JP36005791A patent/JP3187106B2/ja not_active Expired - Fee Related
-
1992
- 1992-12-22 EP EP92121796A patent/EP0548913B1/de not_active Expired - Lifetime
- 1992-12-22 DE DE69211667T patent/DE69211667T2/de not_active Expired - Fee Related
- 1992-12-23 US US07/996,336 patent/US5554823A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5554823A (en) | 1996-09-10 |
DE69211667T2 (de) | 1997-02-06 |
EP0548913A1 (de) | 1993-06-30 |
JP3187106B2 (ja) | 2001-07-11 |
EP0548913B1 (de) | 1996-06-19 |
JPH05182871A (ja) | 1993-07-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |