DE69212185D1 - Halbleiteraufbau mit flexibler Trägerfolie - Google Patents

Halbleiteraufbau mit flexibler Trägerfolie

Info

Publication number
DE69212185D1
DE69212185D1 DE69212185T DE69212185T DE69212185D1 DE 69212185 D1 DE69212185 D1 DE 69212185D1 DE 69212185 T DE69212185 T DE 69212185T DE 69212185 T DE69212185 T DE 69212185T DE 69212185 D1 DE69212185 D1 DE 69212185D1
Authority
DE
Germany
Prior art keywords
semiconductor structure
carrier film
flexible carrier
flexible
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69212185T
Other languages
English (en)
Other versions
DE69212185T2 (de
Inventor
Neil R Mclellan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of DE69212185D1 publication Critical patent/DE69212185D1/de
Publication of DE69212185T2 publication Critical patent/DE69212185T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
DE69212185T 1991-03-04 1992-03-04 Halbleiteraufbau mit flexibler Trägerfolie Expired - Fee Related DE69212185T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/664,170 US5130783A (en) 1991-03-04 1991-03-04 Flexible film semiconductor package

Publications (2)

Publication Number Publication Date
DE69212185D1 true DE69212185D1 (de) 1996-08-22
DE69212185T2 DE69212185T2 (de) 1996-11-21

Family

ID=24664867

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69212185T Expired - Fee Related DE69212185T2 (de) 1991-03-04 1992-03-04 Halbleiteraufbau mit flexibler Trägerfolie

Country Status (6)

Country Link
US (1) US5130783A (de)
EP (1) EP0502710B1 (de)
JP (1) JPH0567692A (de)
KR (1) KR100263723B1 (de)
DE (1) DE69212185T2 (de)
TW (1) TW212250B (de)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JP3061954B2 (ja) * 1991-08-20 2000-07-10 株式会社東芝 半導体装置
US5977618A (en) 1992-07-24 1999-11-02 Tessera, Inc. Semiconductor connection components and methods with releasable lead support
US5915752A (en) 1992-07-24 1999-06-29 Tessera, Inc. Method of making connections to a semiconductor chip assembly
US5294827A (en) * 1992-12-14 1994-03-15 Motorola, Inc. Semiconductor device having thin package body and method for making the same
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
JP3378338B2 (ja) * 1994-03-01 2003-02-17 新光電気工業株式会社 半導体集積回路装置
EP0956745A1 (de) 1995-09-18 1999-11-17 Tessera, Inc. Mikroeletronische anschlussstruktur mit dielektrischen lagen
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US5786988A (en) * 1996-07-02 1998-07-28 Sandisk Corporation Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture
US5877555A (en) * 1996-12-20 1999-03-02 Ericsson, Inc. Direct contact die attach
DE19653782A1 (de) * 1996-12-21 1998-07-02 Mci Computer Gmbh Halbleiter-Bauelement
US6478229B1 (en) 2000-03-14 2002-11-12 Harvey Epstein Packaging tape with radio frequency identification technology
SG143932A1 (en) * 2003-05-30 2008-07-29 Micron Technology Inc Packaged microelectronic devices and methods of packaging microelectronic devices
US6934065B2 (en) * 2003-09-18 2005-08-23 Micron Technology, Inc. Microelectronic devices and methods for packaging microelectronic devices
US7583862B2 (en) * 2003-11-26 2009-09-01 Aptina Imaging Corporation Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7253397B2 (en) * 2004-02-23 2007-08-07 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US8092734B2 (en) * 2004-05-13 2012-01-10 Aptina Imaging Corporation Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers
US7253957B2 (en) * 2004-05-13 2007-08-07 Micron Technology, Inc. Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
US20050275750A1 (en) 2004-06-09 2005-12-15 Salman Akram Wafer-level packaged microelectronic imagers and processes for wafer-level packaging
US7498647B2 (en) * 2004-06-10 2009-03-03 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7262405B2 (en) * 2004-06-14 2007-08-28 Micron Technology, Inc. Prefabricated housings for microelectronic imagers
US7199439B2 (en) * 2004-06-14 2007-04-03 Micron Technology, Inc. Microelectronic imagers and methods of packaging microelectronic imagers
US7232754B2 (en) * 2004-06-29 2007-06-19 Micron Technology, Inc. Microelectronic devices and methods for forming interconnects in microelectronic devices
US7294897B2 (en) * 2004-06-29 2007-11-13 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7416913B2 (en) * 2004-07-16 2008-08-26 Micron Technology, Inc. Methods of manufacturing microelectronic imaging units with discrete standoffs
US7189954B2 (en) * 2004-07-19 2007-03-13 Micron Technology, Inc. Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
US7402453B2 (en) * 2004-07-28 2008-07-22 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US20060023107A1 (en) * 2004-08-02 2006-02-02 Bolken Todd O Microelectronic imagers with optics supports having threadless interfaces and methods for manufacturing such microelectronic imagers
US7364934B2 (en) 2004-08-10 2008-04-29 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US7397066B2 (en) * 2004-08-19 2008-07-08 Micron Technology, Inc. Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers
US7223626B2 (en) * 2004-08-19 2007-05-29 Micron Technology, Inc. Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
US7115961B2 (en) * 2004-08-24 2006-10-03 Micron Technology, Inc. Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
US7429494B2 (en) * 2004-08-24 2008-09-30 Micron Technology, Inc. Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers
US7425499B2 (en) 2004-08-24 2008-09-16 Micron Technology, Inc. Methods for forming interconnects in vias and microelectronic workpieces including such interconnects
US7276393B2 (en) * 2004-08-26 2007-10-02 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US7511262B2 (en) * 2004-08-30 2009-03-31 Micron Technology, Inc. Optical device and assembly for use with imaging dies, and wafer-label imager assembly
US20070148807A1 (en) * 2005-08-22 2007-06-28 Salman Akram Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
US7646075B2 (en) * 2004-08-31 2010-01-12 Micron Technology, Inc. Microelectronic imagers having front side contacts
US7300857B2 (en) 2004-09-02 2007-11-27 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
KR100577430B1 (ko) 2004-09-03 2006-05-08 삼성전자주식회사 디스플레이 장치
US7271482B2 (en) * 2004-12-30 2007-09-18 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US7214919B2 (en) * 2005-02-08 2007-05-08 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US20060177999A1 (en) * 2005-02-10 2006-08-10 Micron Technology, Inc. Microelectronic workpieces and methods for forming interconnects in microelectronic workpieces
US7303931B2 (en) * 2005-02-10 2007-12-04 Micron Technology, Inc. Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces
US7190039B2 (en) * 2005-02-18 2007-03-13 Micron Technology, Inc. Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
US7795134B2 (en) 2005-06-28 2010-09-14 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
US20060290001A1 (en) * 2005-06-28 2006-12-28 Micron Technology, Inc. Interconnect vias and associated methods of formation
US7288757B2 (en) * 2005-09-01 2007-10-30 Micron Technology, Inc. Microelectronic imaging devices and associated methods for attaching transmissive elements
US7622377B2 (en) 2005-09-01 2009-11-24 Micron Technology, Inc. Microfeature workpiece substrates having through-substrate vias, and associated methods of formation
US7262134B2 (en) * 2005-09-01 2007-08-28 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US20100194465A1 (en) * 2009-02-02 2010-08-05 Ali Salih Temperature compensated current source and method therefor

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4007479A (en) * 1976-03-29 1977-02-08 Honeywell Information Systems, Inc. Fixture for an integrated circuit chip
CA1226966A (en) * 1985-09-10 1987-09-15 Gabriel Marcantonio Integrated circuit chip package
US4870476A (en) * 1986-02-13 1989-09-26 Vtc Incorporated Integrated circuit packaging process and structure
EP0361985B1 (de) * 1988-09-30 1994-12-07 Raychem Limited Verbindungsartikel für Hybrid-Mikrochip
DE3838085A1 (de) * 1988-11-10 1990-05-17 Rheinmetall Gmbh Beschleunigungsfeste verpackung fuer integrierte schaltungen und verfahren zu ihrer herstellung
JPH02240956A (ja) * 1989-02-03 1990-09-25 Motorola Inc プラスチックカプセル収納集積回路デバイスおよびその製造方法
US5019673A (en) * 1990-08-22 1991-05-28 Motorola, Inc. Flip-chip package for integrated circuits

Also Published As

Publication number Publication date
EP0502710B1 (de) 1996-07-17
KR100263723B1 (ko) 2000-09-01
TW212250B (de) 1993-09-01
DE69212185T2 (de) 1996-11-21
KR920018878A (ko) 1992-10-22
JPH0567692A (ja) 1993-03-19
US5130783A (en) 1992-07-14
EP0502710A1 (de) 1992-09-09

Similar Documents

Publication Publication Date Title
DE69212185D1 (de) Halbleiteraufbau mit flexibler Trägerfolie
DE69128876D1 (de) Dünnfilm-Halbleitervorrichtung
DE69106225D1 (de) Integrierte Schaltungseinheit mit flexiblem Substrat.
DE69210886D1 (de) Substrat mit Dünnfilmelementen
DE69210767D1 (de) Substrat-Transport-Vorrichtung
FI940071A0 (fi) Syvämartioitu muovikalvo
BR8905826A (pt) Pelicula flexivel
DE69427501D1 (de) Halbleiteranordnung mit Dünnfilm-Widerstand
DE69326284D1 (de) Halbleiteranordnung mit anschlusswählender Schaltung
DE69303187D1 (de) Adapter mit flexibelen Träger
DE3883188D1 (de) Duennfilm-halbleiteranordung.
DE59108756D1 (de) Flexible kunststoffolie mit rippenstruktur
DE69330505D1 (de) Halbleiterspeichergerät mit Redundanz
DE69124310D1 (de) Halbleiter-Speichereinrichtung mit Strom-Spannungs-Wandler
DE69219509D1 (de) Halbleiteranordnung mit Substrat
DE69231371D1 (de) Antistatische Zeichenfolie
DE69216781T2 (de) Filmkassette
DE69114455D1 (de) Halbleiteranordnung mit Filmträger.
DE69229011D1 (de) Filmkassette
DE69320743T2 (de) Halbleiterspeichergerät mit Redundanz
DE68917743T2 (de) Elektrolumineszente Dünnschichtvorrichtung.
DE69220085T2 (de) Transparentumschlag mit erhöhter flexibilität
DE69206999T2 (de) Klebefilm
KR900008681A (ko) 복수의 반도체층을 가진 박막트랜지스터
KR930003451U (ko) 크리닝 필름이 구비된 카세트

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee