DE69215771D1 - Verfahren zur Montage elektronischer Bauteile auf einem Schaltkreissubstrat und Schaltkreissubstrat mit darauf montierten elektronischen Bauteilen - Google Patents
Verfahren zur Montage elektronischer Bauteile auf einem Schaltkreissubstrat und Schaltkreissubstrat mit darauf montierten elektronischen BauteilenInfo
- Publication number
- DE69215771D1 DE69215771D1 DE69215771T DE69215771T DE69215771D1 DE 69215771 D1 DE69215771 D1 DE 69215771D1 DE 69215771 T DE69215771 T DE 69215771T DE 69215771 T DE69215771 T DE 69215771T DE 69215771 D1 DE69215771 D1 DE 69215771D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic components
- circuit substrate
- components mounted
- mounting electronic
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3164—Partial encapsulation or coating the coating being a foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
- Y10T29/49176—Assembling terminal to elongated conductor with molding of electrically insulating material
- Y10T29/49178—Assembling terminal to elongated conductor with molding of electrically insulating material by shrinking of cover
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19873591 | 1991-07-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69215771D1 true DE69215771D1 (de) | 1997-01-23 |
DE69215771T2 DE69215771T2 (de) | 1997-04-10 |
Family
ID=16396116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69215771T Expired - Fee Related DE69215771T2 (de) | 1991-07-12 | 1992-07-10 | Verfahren zur Montage elektronischer Bauteile auf einem Schaltkreissubstrat und Schaltkreissubstrat mit darauf montierten elektronischen Bauteilen |
Country Status (3)
Country | Link |
---|---|
US (1) | US5331513A (de) |
EP (1) | EP0522593B1 (de) |
DE (1) | DE69215771T2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5453580A (en) * | 1993-11-23 | 1995-09-26 | E-Systems, Inc. | Vibration sensitive isolation for printed circuit boards |
US5622519A (en) * | 1995-04-28 | 1997-04-22 | Molex Incorporated | Retention system for electrical connectors on printed circuit boards |
JPH08335761A (ja) * | 1995-06-06 | 1996-12-17 | Matsushita Electric Ind Co Ltd | 電子部品の配線基板への装着方法およびこれを用いた照光式スイッチユニット |
US5877555A (en) * | 1996-12-20 | 1999-03-02 | Ericsson, Inc. | Direct contact die attach |
US6403882B1 (en) | 1997-06-30 | 2002-06-11 | International Business Machines Corporation | Protective cover plate for flip chip assembly backside |
US6046910A (en) * | 1998-03-18 | 2000-04-04 | Motorola, Inc. | Microelectronic assembly having slidable contacts and method for manufacturing the assembly |
DE19905807A1 (de) * | 1999-02-11 | 2000-08-31 | Ksw Microtec Ges Fuer Angewand | Verfahren zur Herstellung elektrisch leitender Verbindungen |
US6468891B2 (en) * | 2000-02-24 | 2002-10-22 | Micron Technology, Inc. | Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
US6906268B2 (en) * | 2001-12-14 | 2005-06-14 | Intel Corporation | Heat-shrinkable retainer for PCB double-sided assembly |
US7257001B2 (en) * | 2004-04-23 | 2007-08-14 | Shmuel Erez | Device and method for fastener-free connection via a heat-shrinkable insert |
DE102004030383A1 (de) * | 2004-06-23 | 2006-01-12 | Infineon Technologies Ag | Bondfolie und Halbleiterbauteil mit Bondfolie sowie Verfahren zu deren Herstellung |
DE102007054710B3 (de) * | 2007-11-16 | 2009-07-09 | Semikron Elektronik Gmbh & Co. Kg | Verfahren zur Herstellung einer Halbleiterbaugruppe |
CN110476489A (zh) * | 2017-03-28 | 2019-11-19 | 昕诺飞控股有限公司 | 增强3d打印对象中的电气连接的方法 |
KR102615050B1 (ko) * | 2019-01-16 | 2023-12-19 | 삼성전자주식회사 | 디스플레이 장치 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4695926A (en) * | 1986-07-01 | 1987-09-22 | Bell Of Pennsylvania | Encapsulation and insulation of electronic circuit board structures |
US4774643A (en) * | 1986-11-17 | 1988-09-27 | Diagin, Inc. | Illuminator for radiation dosimeter and method of manufacture |
US4858075A (en) * | 1987-01-30 | 1989-08-15 | Bell Of Pennsylvania | RF shielded and electrically insulated circuit board structure and method of making same |
-
1992
- 1992-07-06 US US07/908,993 patent/US5331513A/en not_active Expired - Lifetime
- 1992-07-10 EP EP92111830A patent/EP0522593B1/de not_active Expired - Lifetime
- 1992-07-10 DE DE69215771T patent/DE69215771T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5331513A (en) | 1994-07-19 |
DE69215771T2 (de) | 1997-04-10 |
EP0522593B1 (de) | 1996-12-11 |
EP0522593A1 (de) | 1993-01-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |