DE69217702T2 - Hochtemperatur-Niederschlagsverfahren von Leitern in Öffnungen, die tiefer als breit sind - Google Patents
Hochtemperatur-Niederschlagsverfahren von Leitern in Öffnungen, die tiefer als breit sindInfo
- Publication number
- DE69217702T2 DE69217702T2 DE69217702T DE69217702T DE69217702T2 DE 69217702 T2 DE69217702 T2 DE 69217702T2 DE 69217702 T DE69217702 T DE 69217702T DE 69217702 T DE69217702 T DE 69217702T DE 69217702 T2 DE69217702 T2 DE 69217702T2
- Authority
- DE
- Germany
- Prior art keywords
- deeper
- conductors
- openings
- wide
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3447—Collimators, shutters, apertures
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US68802091A | 1991-04-19 | 1991-04-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69217702D1 DE69217702D1 (de) | 1997-04-10 |
DE69217702T2 true DE69217702T2 (de) | 1997-10-23 |
Family
ID=24762785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69217702T Expired - Fee Related DE69217702T2 (de) | 1991-04-19 | 1992-04-16 | Hochtemperatur-Niederschlagsverfahren von Leitern in Öffnungen, die tiefer als breit sind |
Country Status (5)
Country | Link |
---|---|
US (1) | US5529670A (de) |
EP (1) | EP0512296B1 (de) |
JP (1) | JP2725944B2 (de) |
DE (1) | DE69217702T2 (de) |
IE (1) | IE80715B1 (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6521106B1 (en) | 1990-01-29 | 2003-02-18 | Novellus Systems, Inc. | Collimated deposition apparatus |
CA2111536A1 (en) * | 1992-12-16 | 1994-06-17 | Geri M. Actor | Collimated deposition apparatus |
US5362372A (en) * | 1993-06-11 | 1994-11-08 | Applied Materials, Inc. | Self cleaning collimator |
JPH0718423A (ja) * | 1993-07-06 | 1995-01-20 | Japan Energy Corp | 薄膜形成装置 |
US5356836A (en) * | 1993-08-19 | 1994-10-18 | Industrial Technology Research Institute | Aluminum plug process |
JP3398452B2 (ja) * | 1994-01-19 | 2003-04-21 | 株式会社ソニー・ディスクテクノロジー | スパッタリング装置 |
JP2689931B2 (ja) * | 1994-12-29 | 1997-12-10 | 日本電気株式会社 | スパッタ方法 |
US5757879A (en) * | 1995-06-07 | 1998-05-26 | International Business Machines Corporation | Tungsten absorber for x-ray mask |
JPH0936228A (ja) * | 1995-07-21 | 1997-02-07 | Sony Corp | 配線形成方法 |
JPH09102541A (ja) * | 1995-10-05 | 1997-04-15 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
DE19621855C2 (de) * | 1996-05-31 | 2003-03-27 | Univ Dresden Tech | Verfahren zur Herstellung von Metallisierungen auf Halbleiterkörpern unter Verwendung eines gepulsten Vakuumbogenverdampfers |
US5801096A (en) * | 1996-06-03 | 1998-09-01 | Taiwan Semiconductor Manufacturing Company Ltd. | Self-aligned tungsen etch back process to minimize seams in tungsten plugs |
JP2894279B2 (ja) * | 1996-06-10 | 1999-05-24 | 日本電気株式会社 | 金属薄膜形成方法 |
JPH1012729A (ja) * | 1996-06-27 | 1998-01-16 | Nec Corp | 半導体装置の製造方法 |
KR100206938B1 (ko) * | 1996-09-19 | 1999-07-01 | 구본준 | 반도체 제조장치 및 이를 이용한 반도체 소자의 배선 형성방법 |
US5783282A (en) * | 1996-10-07 | 1998-07-21 | Micron Technology, Inc. | Resputtering to achieve better step coverage of contact holes |
JPH10237662A (ja) * | 1996-12-24 | 1998-09-08 | Sony Corp | 金属膜のプラズマcvd方法、および金属窒化物膜の形成方法ならびに半導体装置 |
US6168832B1 (en) | 1997-01-20 | 2001-01-02 | Coherent, Inc. | Three-dimensional masking method for control of coating thickness |
GB9701114D0 (en) * | 1997-01-20 | 1997-03-12 | Coherent Optics Europ Ltd | Three-dimensional masking method for control of optical coating thickness |
US6605197B1 (en) * | 1997-05-13 | 2003-08-12 | Applied Materials, Inc. | Method of sputtering copper to fill trenches and vias |
US6045634A (en) * | 1997-08-14 | 2000-04-04 | Praxair S. T. Technology, Inc. | High purity titanium sputtering target and method of making |
US6277737B1 (en) | 1998-09-02 | 2001-08-21 | Micron Technology, Inc. | Semiconductor processing methods and integrated circuitry |
JP3358587B2 (ja) | 1999-05-26 | 2002-12-24 | 日本電気株式会社 | 半導体装置の製造方法 |
GB2357371B (en) * | 1999-11-04 | 2004-02-11 | Trikon Holdings Ltd | A method of forming a barrier layer |
JP2002069634A (ja) * | 2000-08-29 | 2002-03-08 | Canon Inc | 薄膜作製方法および薄膜作製装置 |
JP2002217292A (ja) | 2001-01-23 | 2002-08-02 | Hitachi Ltd | 半導体集積回路装置および半導体集積回路装置の製造方法 |
US7355687B2 (en) * | 2003-02-20 | 2008-04-08 | Hunter Engineering Company | Method and apparatus for vehicle service system with imaging components |
US7070697B2 (en) * | 2003-04-14 | 2006-07-04 | Hitachi Global Storage Technologies Netherlands B.V. | Methods of making a read sensor with use of a barrier structure for depositing materials |
US20050211546A1 (en) * | 2004-03-26 | 2005-09-29 | Applied Materials, Inc. | Reactive sputter deposition plasma process using an ion shower grid |
US7244474B2 (en) * | 2004-03-26 | 2007-07-17 | Applied Materials, Inc. | Chemical vapor deposition plasma process using an ion shower grid |
US7695590B2 (en) | 2004-03-26 | 2010-04-13 | Applied Materials, Inc. | Chemical vapor deposition plasma reactor having plural ion shower grids |
US20050211547A1 (en) * | 2004-03-26 | 2005-09-29 | Applied Materials, Inc. | Reactive sputter deposition plasma reactor and process using plural ion shower grids |
US7291360B2 (en) * | 2004-03-26 | 2007-11-06 | Applied Materials, Inc. | Chemical vapor deposition plasma process using plural ion shower grids |
US8058156B2 (en) * | 2004-07-20 | 2011-11-15 | Applied Materials, Inc. | Plasma immersion ion implantation reactor having multiple ion shower grids |
US7767561B2 (en) * | 2004-07-20 | 2010-08-03 | Applied Materials, Inc. | Plasma immersion ion implantation reactor having an ion shower grid |
US7407875B2 (en) * | 2006-09-06 | 2008-08-05 | International Business Machines Corporation | Low resistance contact structure and fabrication thereof |
JP2007295004A (ja) * | 2007-07-27 | 2007-11-08 | Toshiba Corp | 半導体装置の製造方法 |
JP5145000B2 (ja) * | 2007-09-28 | 2013-02-13 | 株式会社フジクラ | 貫通配線基板、半導体パッケージ及び貫通配線基板の製造方法 |
JP2009182140A (ja) * | 2008-01-30 | 2009-08-13 | Tokyo Electron Ltd | 薄膜の形成方法、プラズマ成膜装置及び記憶媒体 |
TW201005109A (en) * | 2008-07-25 | 2010-02-01 | Inotera Memories Inc | Method for changing physical vapor deposition film form |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4293374A (en) * | 1980-03-10 | 1981-10-06 | International Business Machines Corporation | High aspect ratio, high resolution mask fabrication |
KR900001825B1 (ko) * | 1984-11-14 | 1990-03-24 | 가부시끼가이샤 히다찌세이사꾸쇼 | 성막 지향성을 고려한 스퍼터링장치 |
FR2583220B1 (fr) * | 1985-06-11 | 1987-08-07 | Thomson Csf | Procede de realisation d'au moins deux metallisations d'un composant semi-conducteur, recouvertes d'une couche de dielectrique et composant obtenu par ce dielectrique |
JPS627855A (ja) * | 1985-07-05 | 1987-01-14 | Hitachi Ltd | スパツタリング装置 |
JPS6217173A (ja) * | 1985-07-15 | 1987-01-26 | Ulvac Corp | 平板マグネトロンスパツタ装置 |
JPH084088B2 (ja) * | 1986-02-27 | 1996-01-17 | 工業技術院長 | 薄膜形成方法 |
US4756810A (en) * | 1986-12-04 | 1988-07-12 | Machine Technology, Inc. | Deposition and planarizing methods and apparatus |
US4783248A (en) * | 1987-02-10 | 1988-11-08 | Siemens Aktiengesellschaft | Method for the production of a titanium/titanium nitride double layer |
JPH0660391B2 (ja) * | 1987-06-11 | 1994-08-10 | 日電アネルバ株式会社 | スパッタリング装置 |
US4824544A (en) * | 1987-10-29 | 1989-04-25 | International Business Machines Corporation | Large area cathode lift-off sputter deposition device |
JP2776826B2 (ja) * | 1988-04-15 | 1998-07-16 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
US4822753A (en) * | 1988-05-09 | 1989-04-18 | Motorola, Inc. | Method for making a w/tin contact |
JPH02178923A (ja) * | 1988-12-29 | 1990-07-11 | Fujitsu Ltd | 半導体装置の製造方法 |
US4920073A (en) * | 1989-05-11 | 1990-04-24 | Texas Instruments, Incorporated | Selective silicidation process using a titanium nitride protective layer |
US4994162A (en) * | 1989-09-29 | 1991-02-19 | Materials Research Corporation | Planarization method |
US5026470A (en) * | 1989-12-19 | 1991-06-25 | International Business Machines | Sputtering apparatus |
DE69129081T2 (de) * | 1990-01-29 | 1998-07-02 | Varian Associates | Gerät und Verfahren zur Niederschlagung durch einen Kollimator |
US5008217A (en) * | 1990-06-08 | 1991-04-16 | At&T Bell Laboratories | Process for fabricating integrated circuits having shallow junctions |
-
1992
- 1992-03-26 JP JP4102200A patent/JP2725944B2/ja not_active Expired - Fee Related
- 1992-04-16 IE IE921253A patent/IE80715B1/en not_active IP Right Cessation
- 1992-04-16 EP EP92106614A patent/EP0512296B1/de not_active Expired - Lifetime
- 1992-04-16 DE DE69217702T patent/DE69217702T2/de not_active Expired - Fee Related
-
1993
- 1993-12-22 US US08/172,017 patent/US5529670A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
IE80715B1 (en) | 1998-12-30 |
US5529670A (en) | 1996-06-25 |
JP2725944B2 (ja) | 1998-03-11 |
IE921253A1 (en) | 1992-10-21 |
EP0512296A1 (de) | 1992-11-11 |
DE69217702D1 (de) | 1997-04-10 |
JPH06140359A (ja) | 1994-05-20 |
EP0512296B1 (de) | 1997-03-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: QIMONDA AG, 81739 MUENCHEN, DE Owner name: INTERNATIONAL BUSINESS MACHINES CORP., ARMONK,, US |
|
8339 | Ceased/non-payment of the annual fee |