DE69223770D1 - Sensorsystem für hochgenaue ausrichtung von komponenten - Google Patents

Sensorsystem für hochgenaue ausrichtung von komponenten

Info

Publication number
DE69223770D1
DE69223770D1 DE69223770T DE69223770T DE69223770D1 DE 69223770 D1 DE69223770 D1 DE 69223770D1 DE 69223770 T DE69223770 T DE 69223770T DE 69223770 T DE69223770 T DE 69223770T DE 69223770 D1 DE69223770 D1 DE 69223770D1
Authority
DE
Germany
Prior art keywords
component
sensor system
shadow
laser
placement machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69223770T
Other languages
English (en)
Other versions
DE69223770T2 (de
Inventor
Timothy Skunes
Steven Case
Curtis Bocchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cyberoptics Corp
Original Assignee
Cyberoptics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cyberoptics Corp filed Critical Cyberoptics Corp
Application granted granted Critical
Publication of DE69223770D1 publication Critical patent/DE69223770D1/de
Publication of DE69223770T2 publication Critical patent/DE69223770T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
    • G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
    • G01D5/342—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells the sensed object being the obturating part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
DE69223770T 1991-02-22 1992-02-21 Sensorsystem für hochgenaue ausrichtung von komponenten Expired - Lifetime DE69223770T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/659,983 US5278634A (en) 1991-02-22 1991-02-22 High precision component alignment sensor system
PCT/US1992/001123 WO1992014988A1 (en) 1991-02-22 1992-02-21 A high precision component alignment sensor system

Publications (2)

Publication Number Publication Date
DE69223770D1 true DE69223770D1 (de) 1998-02-05
DE69223770T2 DE69223770T2 (de) 1998-07-16

Family

ID=24647636

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69223770T Expired - Lifetime DE69223770T2 (de) 1991-02-22 1992-02-21 Sensorsystem für hochgenaue ausrichtung von komponenten

Country Status (11)

Country Link
US (2) US5278634A (de)
EP (1) EP0572555B1 (de)
JP (1) JP2995707B2 (de)
KR (7) KR0185692B1 (de)
AT (1) ATE161626T1 (de)
DE (1) DE69223770T2 (de)
DK (1) DK0572555T3 (de)
ES (1) ES2113426T3 (de)
GR (1) GR3026481T3 (de)
TW (1) TW217483B (de)
WO (1) WO1992014988A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107478178A (zh) * 2017-09-24 2017-12-15 长春理工大学 一种双向找正激光对中调整装置及对中方法

Families Citing this family (101)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5377405A (en) * 1992-07-01 1995-01-03 Yamaha Hatsudoki Kabushiki Kaisha Method for mounting components and an apparatus therefor
US5660519A (en) * 1992-07-01 1997-08-26 Yamaha Hatsudoki Kabushiki Kaisha Method for mounting components and an apparatus therefor
JPH0618215A (ja) * 1992-07-01 1994-01-25 Yamaha Motor Co Ltd 部品装着方法及び装置
US5741114A (en) * 1992-08-07 1998-04-21 Yamaha Hatsudoki Kabushiki Kaisha Method for mounting components and apparatus therefor
JP2554437B2 (ja) * 1992-08-07 1996-11-13 ヤマハ発動機株式会社 部品装着方法及び同装置
JP2554431B2 (ja) * 1992-11-05 1996-11-13 ヤマハ発動機株式会社 実装機の部品吸着状態検出装置
JP2816787B2 (ja) * 1992-11-09 1998-10-27 ヤマハ発動機株式会社 実装機の吸着ノズル制御装置
DE69424579T2 (de) * 1993-12-27 2000-09-14 Yamaha Motor Co Ltd Verfahren und Montagevorrichtung zum Montieren eines Bauelements auf eine spezifische Position
JP3090567B2 (ja) * 1993-12-29 2000-09-25 ヤマハ発動機株式会社 実装機における部品認識方法および同装置
JP3086578B2 (ja) * 1993-12-27 2000-09-11 ヤマハ発動機株式会社 部品装着装置
JPH07193397A (ja) * 1993-12-27 1995-07-28 Yamaha Motor Co Ltd 実装機の吸着ポイント補正装置
US5559727A (en) * 1994-02-24 1996-09-24 Quad Systems Corporation Apparatus and method for determining the position of a component prior to placement
US6055329A (en) * 1994-06-09 2000-04-25 Sherikon, Inc. High speed opto-electronic gage and method for gaging
JP3842287B2 (ja) * 1994-08-11 2006-11-08 サイバーオプティックス・コーポレーション 高精度半導体部品位置合せシステム
US6118538A (en) * 1995-01-13 2000-09-12 Cyberoptics Corporation Method and apparatus for electronic component lead measurement using light based sensors on a component placement machine
US6400459B1 (en) 1995-02-24 2002-06-04 Cyberoptics Corp. Methods and apparatus for using optical sensors in component replacement heads
JPH11502311A (ja) * 1995-12-14 1999-02-23 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ コンポーネント配置装置及びこのコンポーネント配置装置によってキャリヤ上にコンポーネントを配置する方法
AU4660496A (en) * 1996-02-12 1997-09-02 Icos Vision Systems N.V. Process for forming on an opto-electronic transducer a shadow image of at least a part of an electronic component
JP3296968B2 (ja) * 1996-04-26 2002-07-02 ヤマハ発動機株式会社 基準位置決定方法
US5739913A (en) * 1996-08-02 1998-04-14 Mrs Technology, Inc. Non-contact edge detector
US5768759A (en) * 1996-11-19 1998-06-23 Zevatech, Inc. Method and apparatus for reflective in-flight component registration
JP3894581B2 (ja) * 1996-11-26 2007-03-22 アセンブレオン ネムローゼ フェンノートシャップ 担体上に構成要素を配置する方法及び機械、並びにこの方法及び機械に使用する較正担体検出装置
US6157870A (en) * 1997-02-18 2000-12-05 Zevatech Trading Ag Apparatus supplying components to a placement machine with splice sensor
US6077022A (en) * 1997-02-18 2000-06-20 Zevatech Trading Ag Placement machine and a method to control a placement machine
US6128074A (en) * 1997-06-26 2000-10-03 Advanced Micro Devices, Inc. Method and apparatus for inspection of pin grid array packages for bent leads
US5953812A (en) * 1997-07-03 1999-09-21 Schlumberger Technologies, Inc. Misinsert sensing in pick and place tooling
US6230393B1 (en) * 1997-07-07 2001-05-15 Matsushita Electric Industrial Co., Ltd. Method and device for mounting electronic component
US6158119A (en) * 1997-07-14 2000-12-12 Motorola, Inc. Circuit board panel test strip and associated method of assembly
US6346988B1 (en) * 1997-08-01 2002-02-12 Hama Sensors, Inc. Laser position array optical measuring system and method
EP0901155B1 (de) * 1997-09-05 2004-08-18 ESEC Trading SA Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat
EP0913857B1 (de) 1997-10-30 2004-01-28 ESEC Trading SA Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial
BE1011535A3 (nl) * 1997-11-05 1999-10-05 Framatome Connectors Belgium Werkwijze en inrichting voor het opmeten van de positie van een reeks contactpennen en voor het aanbrengen van deze reeks in een plaat met gedrukte schakelingen.
EP0923111B1 (de) 1997-12-07 2007-05-02 Oerlikon Assembly Equipment AG, Steinhausen Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer
US6031242A (en) * 1998-01-23 2000-02-29 Zevatech, Inc. Semiconductor die in-flight registration and orientation method and apparatus
SG71189A1 (en) * 1998-01-26 2000-03-21 Esec Sa Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder
US6292261B1 (en) 1998-05-22 2001-09-18 Cyberoptics Corporation Rotary sensor system with at least two detectors
US6538750B1 (en) 1998-05-22 2003-03-25 Cyberoptics Corporation Rotary sensor system with a single detector
KR100287787B1 (ko) * 1998-09-24 2001-04-16 이중구 부품위치정렬장치및이를이용한정렬방법
US6639239B2 (en) 1998-10-30 2003-10-28 Cyberoptics Corporation Angle rejection filter
JP4428865B2 (ja) 1998-10-30 2010-03-10 サイバーオプティクス コーポレーション 多ノズル配置整列センサ内のグリントを制御するために改良された方法および装置
KR100619098B1 (ko) 1998-11-03 2006-09-04 사이버옵틱스 코포레이션 그림자 화상 센서 데이타에 의한 전자 부품의 단층 촬영식 재구성법을 이용한 물체 윤곽 표현 방법, 불투명 물체의 이차원 윤곽 재구성 방법 및 센서 시스템과, 전자 부품의 픽 앤 플레이스 방법 및 픽 앤 플레이스 장치
KR20010040321A (ko) * 1998-11-05 2001-05-15 사이버옵틱스 코포레이션 개선된 영상 시스템을 구비한 전자 제품 조립 장치
US6208419B1 (en) * 1998-11-18 2001-03-27 Fuji Photo Film Co., Ltd. Method of and apparatus for bonding light-emitting element
US6222629B1 (en) * 1999-06-10 2001-04-24 Pmj Automec Oyj Procedure and system for inspecting a component with leads to determine its fitness for assembly
US6229608B1 (en) * 1999-06-10 2001-05-08 Pmj Automec Oyj Procedure and system for inspecting a component with leads to determine its fitness for assembly
US6538244B1 (en) * 1999-11-03 2003-03-25 Cyberoptics Corporation Pick and place machine with improved vision system including a linescan sensor
US6593705B1 (en) 2000-01-07 2003-07-15 Cyberoptics Corporation Rapid-firing flashlamp discharge circuit
US6549647B1 (en) 2000-01-07 2003-04-15 Cyberoptics Corporation Inspection system with vibration resistant video capture
US6750899B1 (en) 2000-01-07 2004-06-15 Cyberoptics Corporation Solder paste inspection system
DE10194788T1 (de) 2000-01-07 2003-02-27 Cyberoptics Corp Phasenprofilometriesystem mit telezentrischem Projektor
US6633046B1 (en) * 2000-04-19 2003-10-14 Applied Materials, Inc. Method and apparatus for detecting that two moveable members are correctly positioned relatively to one another
US6535291B1 (en) 2000-06-07 2003-03-18 Cyberoptics Corporation Calibration methods for placement machines incorporating on-head linescan sensing
US6909515B2 (en) 2001-01-22 2005-06-21 Cyberoptics Corporation Multiple source alignment sensor with improved optics
US6762847B2 (en) 2001-01-22 2004-07-13 Cyberoptics Corporation Laser align sensor with sequencing light sources
US7239399B2 (en) * 2001-11-13 2007-07-03 Cyberoptics Corporation Pick and place machine with component placement inspection
US7813559B2 (en) * 2001-11-13 2010-10-12 Cyberoptics Corporation Image analysis for pick and place machines with in situ component placement inspection
US6718233B2 (en) * 2002-03-29 2004-04-06 Nortel Networks, Ltd. Placement of an optical component on a substrate
US7745805B2 (en) * 2002-06-17 2010-06-29 Johnson Thread-View Systems Product inspection system and a method for implementing same that incorporates a correction factor
US8410466B2 (en) * 2002-06-17 2013-04-02 Quest Metrology Group, Llc Non-contact component inspection system
CH696615A5 (de) * 2003-09-22 2007-08-15 Esec Trading Sa Verfahren für die Justierung des Bondkopfs eines Die Bonders.
US7706595B2 (en) 2003-11-07 2010-04-27 Cyberoptics Corporation Pick and place machine with workpiece motion inspection
NL1025332C2 (nl) * 2004-01-27 2005-08-02 Heineken Tech Services Inrichting en werkwijze voor het detecteren van vervuiling in een houder.
US7325354B2 (en) * 2004-05-06 2008-02-05 Insight Technology, Inc. Weapon aiming device
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
US20060139392A1 (en) * 2004-12-28 2006-06-29 Cesar Fernandez Detection apparatus
US20070003126A1 (en) * 2005-05-19 2007-01-04 Case Steven K Method and apparatus for evaluating a component pick action in an electronics assembly machine
JP4896136B2 (ja) * 2005-09-14 2012-03-14 サイバーオプティクス コーポレーション 改善された構成部品ピックイメージ処理を備えたピックアンドプレース機
JP2009514234A (ja) * 2005-10-31 2009-04-02 サイバーオプティクス コーポレーション 組み込み型半田ペースト検査を備える電子アセンブリマシン
US20070232691A1 (en) * 2006-03-31 2007-10-04 Tamar Goren Use of ladostigil for the treatment of schizophrenia
US7595893B2 (en) * 2006-09-20 2009-09-29 Mitutoyo Corporation Shape measurement method and shape measurement apparatus
US20080199068A1 (en) * 2007-01-10 2008-08-21 Duquette David W Inspection System
KR101157156B1 (ko) * 2007-03-06 2012-06-20 삼성테크윈 주식회사 전자부품 방향인식방법, 이를 이용한 전자부품 정렬 및장착 방법
US7746481B2 (en) * 2007-03-20 2010-06-29 Cyberoptics Corporation Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam
WO2008153885A1 (en) * 2007-06-05 2008-12-18 Cyberoptics Corporation Component sensor for pick and place machine using improved shadow imaging
NL1034086C2 (nl) * 2007-07-03 2009-01-06 Assembleon Bv Werkwijze voor het plaatsen van ten minste een van aansluitpunten voorziene component op een substraat alsmede een dergelijke inrichting.
US8059280B2 (en) 2008-01-31 2011-11-15 Cyberoptics Corporation Method for three-dimensional imaging using multi-phase structured light
JP4840422B2 (ja) * 2008-09-04 2011-12-21 パナソニック株式会社 電子部品実装用装置及び電子部品実装用装置による作業方法
US8294894B2 (en) * 2008-11-28 2012-10-23 Shimadzu Corporation Particle counter
ATE520958T1 (de) * 2009-08-19 2011-09-15 Pepperl & Fuchs Verfahren zum messen von objekten
US8036508B2 (en) * 2009-09-21 2011-10-11 Corning Incorporated Methods for passively aligning opto-electronic component assemblies on substrates
DE102009047018B4 (de) * 2009-11-23 2023-02-09 Robert Bosch Gmbh Verfahren zum Abgleich eines Beschleunigungssensors und Beschleunigungssensor
JP5584651B2 (ja) * 2011-05-12 2014-09-03 ヤマハ発動機株式会社 吸着状態検査装置、表面実装機及び部品試験装置
TW201336616A (zh) * 2012-03-07 2013-09-16 Chiuan Yan Technology Co Ltd 運動平台回授控制系統
JP2013206910A (ja) * 2012-03-27 2013-10-07 Sony Corp 照明装置、撮像装置、部品実装装置、及び基板の製造方法
CN102809356B (zh) * 2012-08-01 2014-12-17 天津大学 一种机床主轴与同向导轨平行度检测方法
US10172270B2 (en) 2013-03-15 2019-01-01 John S. Youngquist Pick-and-place feeder module assembly
US11026361B2 (en) 2013-03-15 2021-06-01 John S. Youngquist Linear/angular correction of pick-and-place held component and related optical subsystem
US9247685B2 (en) 2013-03-15 2016-01-26 John S. Youngquist Multi-component nozzle system
US9547284B2 (en) 2013-03-15 2017-01-17 John S. Youngquist Auto-setup control process
US10126252B2 (en) 2013-04-29 2018-11-13 Cyberoptics Corporation Enhanced illumination control for three-dimensional imaging
CZ2013565A3 (cs) * 2013-07-16 2014-08-27 Rieter Cz S.R.O. CMOS optický snímač obsahující množství optických prvků pro zařízení ke zjišťování parametrů pohybující se příze na textilních strojích
ITBO20130617A1 (it) * 2013-11-12 2015-05-13 Marposs Spa Sistema e metodo per il controllo della posizione mutua di componenti di un pezzo meccanico e apparecchiatura che utilizza tali sistema e metodo
RU2727082C2 (ru) * 2015-10-21 2020-07-17 Тиама Способ и установка для обеспечения оптического контроля сосудов по их профилю, включая дно
US10517199B2 (en) 2015-12-17 2019-12-24 Assembléon B.V. Methods of positioning a component in a desired position on a board, pick and place machines, and sensors for such pick and place machines
WO2018105051A1 (ja) * 2016-12-07 2018-06-14 ヤマハ発動機株式会社 表面実装機、部品認識装置、部品認識方法
CN108534713B (zh) * 2017-03-02 2019-08-06 林明慧 免对正轴心的影像测量装置及其测量方法
TWI632344B (zh) * 2017-04-17 2018-08-11 國立虎尾科技大學 光學式轉軸多自由度誤差檢測裝置與方法（二）
CN112739977B (zh) * 2018-10-05 2023-06-20 株式会社富士 测定装置及元件安装机
CN109640615B (zh) * 2018-12-29 2020-06-23 台州中恒机械股份有限公司 一种用于手工焊接电子元件的高度定位治具
JP7240937B2 (ja) * 2019-04-05 2023-03-16 株式会社ミツトヨ 光学式測定装置および光学式測定方法
WO2022043776A1 (en) * 2020-08-31 2022-03-03 Io Tech Group Ltd. Systems and methods for inkjet or laser based pick and place machine at high speed

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3487226A (en) 1967-10-10 1969-12-30 Remington Arms Co Inc Method and apparatus for determining the coordinate of a projectile by measuring the time interval between the interception of successive light screens
US3764813A (en) 1972-04-12 1973-10-09 Bell Telephone Labor Inc Coordinate detection system
NL7211841A (de) 1972-08-31 1974-03-04
US3888362A (en) 1973-05-31 1975-06-10 Nasa Cooperative multiaxis sensor for teleoperation of article manipulating apparatus
US3854052A (en) * 1974-01-02 1974-12-10 Western Electric Co Method of and apparatus for dimensionally inspecting an article with a pair of radiant energy beams
US4144449A (en) 1977-07-08 1979-03-13 Sperry Rand Corporation Position detection apparatus
US4151945A (en) 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
CA1109539A (en) 1978-04-05 1981-09-22 Her Majesty The Queen, In Right Of Canada, As Represented By The Ministe R Of Communications Touch sensitive computer input device
EP0020879A1 (de) 1979-06-06 1981-01-07 Erwin Sick GmbH Optik-Elektronik Opto-elektronischer Abstandsmesser
DD144494B1 (de) 1979-06-22 1984-11-07 Vorrichtung zum automatischen, sequentiellen bestuecken von leiterplatten
JPS56118391A (en) 1980-02-25 1981-09-17 Hitachi Ltd Method and device for inserting electronic part
US4405233A (en) 1980-06-05 1983-09-20 Bell Telephone Laboratories, Incorporated Photo-electric apparatus for testing electrical connector contacts
JPS5717804A (en) * 1980-07-07 1982-01-29 Seiko Seiki Co Ltd Dimension measuring method
JPS5743279A (en) 1980-08-29 1982-03-11 Fujitsu Ltd Method for detecting position of x-y symmetrical body
JPS57164310A (en) 1981-04-03 1982-10-08 Hitachi Ltd Automatic assembling device
EP0144717B1 (de) 1983-11-05 1988-10-19 Zevatech AG Verfahren und Vorrichtung zur Positionierung von Bauteilen auf einem Werkstück
JPS60183507A (ja) * 1984-02-29 1985-09-19 Hokuyo Automatic Co 光学式外形寸法測定器
JP2537770B2 (ja) 1984-08-31 1996-09-25 松下電器産業株式会社 電子部品の装着方法
DE3532500C2 (de) 1984-09-17 1996-03-14 Tdk Corp Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette
US4598456A (en) 1984-10-19 1986-07-08 Westinghouse Electric Corp. Assembly system for electronic circuit boards
WO1986004479A1 (en) 1985-01-21 1986-07-31 Fuji Machine Mfg. Co., Ltd. Method of and apparatus for detecting electronic device-holding position and electronic device-mounting apparatus
JPS61225604A (ja) * 1985-03-29 1986-10-07 Citizen Watch Co Ltd 寸法測定方法
JPH0776684B2 (ja) * 1985-07-03 1995-08-16 北陽電機株式会社 光学式外形測定装置
GB2183820A (en) * 1985-11-09 1987-06-10 Dynapert Precima Ltd Electronic component placement
JPS62114289A (ja) 1985-11-14 1987-05-26 松下電器産業株式会社 電子部品の装着方法および装置
JPS62144392A (ja) 1985-12-19 1987-06-27 ティーディーケイ株式会社 電子部品実装方法
JPH0687009B2 (ja) 1986-05-09 1994-11-02 松下電器産業株式会社 部品姿勢検出装置
JPS62288504A (ja) * 1986-06-07 1987-12-15 Brother Ind Ltd 非接触寸法測定装置
US4741621A (en) * 1986-08-18 1988-05-03 Westinghouse Electric Corp. Geometric surface inspection system with dual overlap light stripe generator
US4733969A (en) 1986-09-08 1988-03-29 Cyberoptics Corporation Laser probe for determining distance
JPH0767033B2 (ja) 1987-01-14 1995-07-19 三洋電機株式会社 自動装着装置
JPH0810794B2 (ja) * 1987-02-18 1996-01-31 三洋電機株式会社 部品装着装置
GB8706388D0 (en) * 1987-03-18 1987-04-23 Meta Machines Ltd Position sensing method
US4891772A (en) 1987-04-15 1990-01-02 Cyberoptics Corporation Point and line range sensors
JPS63283100A (ja) 1987-05-14 1988-11-18 Seiko Epson Corp 電子部品自動装着装置
EP0293175A3 (de) 1987-05-28 1990-08-22 Sanyo Electric Co., Ltd. Bauteilemontagegerät
JP2576123B2 (ja) 1987-05-29 1997-01-29 ソニー株式会社 部品実装機
US4776088A (en) 1987-11-12 1988-10-11 The United States Of America As Represented By The United States Department Of Energy Placement accuracy gauge for electrical components and method of using same
CA1320005C (en) 1988-06-16 1993-07-06 Kotaro Harigane Electronic component mounting apparatus
DE3823836A1 (de) 1988-07-14 1990-01-18 Fraunhofer Ges Forschung Verfahren zum vermessen von der bestueckung von leiterplatten dienenden bauelementen und einrichtung zur durchfuehrung des verfahrens
JPH0716834B2 (ja) 1988-08-23 1995-03-01 松下電工株式会社 部品装着方法
JPH0262099A (ja) 1988-08-26 1990-03-01 Matsushita Electric Ind Co Ltd 電子部品装着方法
JPH02165699A (ja) 1988-12-20 1990-06-26 Matsushita Electric Ind Co Ltd 産業用ロボットによるフラットパッケージ型ｉｃの装着方法
JPH0775817B2 (ja) 1989-02-27 1995-08-16 富士機械製造株式会社 電子部品の保持位置検出装置
JPH02303751A (ja) * 1989-05-17 1990-12-17 Hitachi Ltd 部品位置決め方法
JP2620646B2 (ja) 1989-06-07 1997-06-18 三洋電機株式会社 電子部品自動装着装置
JPH0345919A (ja) 1989-07-13 1991-02-27 Sony Corp 位置指示装置
JP2503082B2 (ja) 1989-09-05 1996-06-05 富士機械製造株式会社 電子部品装着装置
US5030839A (en) 1989-12-13 1991-07-09 North American Philips Corporation Method and apparatus for measuring body to lead tolerances of very odd components
JPH0824234B2 (ja) 1990-01-24 1996-03-06 松下電器産業株式会社 電子部品の吸着装置
US5040291A (en) 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
JPH04322924A (ja) 1991-04-19 1992-11-12 Tokico Ltd 部品取付装置
US5581632A (en) 1994-05-02 1996-12-03 Cognex Corporation Method and apparatus for ball bond inspection system
US6031242A (en) 1998-01-23 2000-02-29 Zevatech, Inc. Semiconductor die in-flight registration and orientation method and apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107478178A (zh) * 2017-09-24 2017-12-15 长春理工大学 一种双向找正激光对中调整装置及对中方法
CN107478178B (zh) * 2017-09-24 2023-04-25 长春理工大学 一种双向找正激光对中调整装置及对中方法

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KR930703586A (ko) 1993-11-30
DE69223770T2 (de) 1998-07-16
WO1992014988A1 (en) 1992-09-03
KR0185688B1 (ko) 1999-05-15
ATE161626T1 (de) 1998-01-15
ES2113426T3 (es) 1998-05-01
KR960703228A (ko) 1996-06-19
JP2995707B2 (ja) 1999-12-27
DK0572555T3 (da) 1998-08-31
EP0572555A4 (de) 1994-03-23
KR960703226A (ko) 1996-06-19
KR0185693B1 (ko) 1999-05-15
KR0185692B1 (ko) 1999-05-15
KR960703229A (ko) 1996-06-19
KR0185689B1 (ko) 1999-05-15
USRE38025E1 (en) 2003-03-11
KR960703230A (ko) 1996-06-19
KR0185691B1 (ko) 1999-05-15
KR0185690B1 (ko) 1999-05-15
KR960703227A (ko) 1996-06-19
EP0572555B1 (de) 1997-12-29
EP0572555A1 (de) 1993-12-08
US5278634A (en) 1994-01-11
GR3026481T3 (en) 1998-06-30
KR960703231A (ko) 1996-06-19
JPH06504847A (ja) 1994-06-02
TW217483B (de) 1993-12-11
KR0185694B1 (ko) 1999-05-15

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