DE69224788T2 - Verfahren zur Herstellung einer Festkoerper- Bildaufnahmevorrichtung - Google Patents
Verfahren zur Herstellung einer Festkoerper- BildaufnahmevorrichtungInfo
- Publication number
- DE69224788T2 DE69224788T2 DE69224788T DE69224788T DE69224788T2 DE 69224788 T2 DE69224788 T2 DE 69224788T2 DE 69224788 T DE69224788 T DE 69224788T DE 69224788 T DE69224788 T DE 69224788T DE 69224788 T2 DE69224788 T2 DE 69224788T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- imaging device
- solid state
- state imaging
- solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003384 imaging method Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000007787 solid Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28591291 | 1991-10-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69224788D1 DE69224788D1 (de) | 1998-04-23 |
DE69224788T2 true DE69224788T2 (de) | 1998-07-09 |
Family
ID=17697630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69224788T Expired - Fee Related DE69224788T2 (de) | 1991-10-31 | 1992-06-30 | Verfahren zur Herstellung einer Festkoerper- Bildaufnahmevorrichtung |
Country Status (4)
Country | Link |
---|---|
US (2) | US5321249A (de) |
EP (1) | EP0539658B1 (de) |
KR (1) | KR960016178B1 (de) |
DE (1) | DE69224788T2 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3067435B2 (ja) * | 1992-12-24 | 2000-07-17 | キヤノン株式会社 | 画像読取用光電変換装置及び該装置を有する画像処理装置 |
WO1995008192A1 (en) * | 1993-09-17 | 1995-03-23 | Polaroid Corporation | Forming microlenses on solid state imager |
US5708264A (en) * | 1995-11-07 | 1998-01-13 | Eastman Kodak Company | Planar color filter array for CCDs from dyed and mordant layers |
US5677202A (en) * | 1995-11-20 | 1997-10-14 | Eastman Kodak Company | Method for making planar color filter array for image sensors with embedded color filter arrays |
US5734190A (en) * | 1996-03-11 | 1998-03-31 | Eastman Kodak Company | Imager having a plurality of cylindrical lenses |
US6211916B1 (en) * | 1996-03-11 | 2001-04-03 | Eastman Kodak Company | Solid state imager with inorganic lens array |
US5824236A (en) * | 1996-03-11 | 1998-10-20 | Eastman Kodak Company | Method for forming inorganic lens array for solid state imager |
US5711890A (en) * | 1996-03-11 | 1998-01-27 | Eastman Kodak Company | Method for forming cylindrical lens arrays for solid state imager |
US5756239A (en) * | 1996-12-12 | 1998-05-26 | Eastman Kodak Company | Method of forming a color filter array with improved resolution |
TW370727B (en) * | 1998-06-04 | 1999-09-21 | United Microelectronics Corp | Method for removing color filter films of CMOS sensor |
TW400657B (en) * | 1998-06-09 | 2000-08-01 | United Microelectronics Corp | The manufacture method of CMOS sensor device |
US6297071B1 (en) | 1998-07-22 | 2001-10-02 | Eastman Kodak Company | Method of making planar image sensor color filter arrays |
US6495813B1 (en) | 1999-10-12 | 2002-12-17 | Taiwan Semiconductor Manufacturing Company | Multi-microlens design for semiconductor imaging devices to increase light collection efficiency in the color filter process |
KR100382723B1 (ko) * | 2000-11-13 | 2003-05-09 | 삼성전자주식회사 | 고체촬상소자 및 그 제조방법 |
US20020084407A1 (en) * | 2000-12-28 | 2002-07-04 | Xerox Corporation | Systems and methods for fabricating an electro-optical device used for image sensing |
TW540157B (en) * | 2001-05-31 | 2003-07-01 | Konishiroku Photo Ind | CMOS image sensor |
FR2829876B1 (fr) * | 2001-09-18 | 2004-07-02 | St Microelectronics Sa | Cellule photosensible incorporant un guide de lumiere et matrice composee de telles cellules |
US6861280B2 (en) * | 2002-10-25 | 2005-03-01 | Omnivision International Holding Ltd | Image sensor having micro-lenses with integrated color filter and method of making |
KR100560309B1 (ko) * | 2003-12-31 | 2006-03-14 | 동부아남반도체 주식회사 | 씨모스 이미지 센서 및 그 광 칼라 감도 감지 방법 |
JP4882224B2 (ja) * | 2004-11-26 | 2012-02-22 | ソニー株式会社 | 固体撮像装置の製造方法 |
WO2006085528A1 (ja) * | 2005-02-10 | 2006-08-17 | Toppan Printing Co., Ltd. | 固体撮像素子及びその製造方法 |
KR101304263B1 (ko) * | 2005-06-03 | 2013-09-05 | 후지필름 가부시키가이샤 | 안료함유 열경화성 조성물, 및, 컬러필터, 화상기록재료,및, 컬러필터의 제조방법 |
US7799491B2 (en) * | 2006-04-07 | 2010-09-21 | Aptina Imaging Corp. | Color filter array and imaging device containing such color filter array and method of fabrication |
KR100823031B1 (ko) * | 2006-12-21 | 2008-04-17 | 동부일렉트로닉스 주식회사 | 이미지 센서 제조방법 |
JP2008241744A (ja) * | 2007-03-23 | 2008-10-09 | Fujifilm Corp | カラーフィルタの製造方法 |
US9570491B2 (en) | 2014-10-08 | 2017-02-14 | Omnivision Technologies, Inc. | Dual-mode image sensor with a signal-separating color filter array, and method for same |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4236098A (en) * | 1979-08-20 | 1980-11-25 | Eastman Kodak Company | Solid-state color imaging devices |
US4357415A (en) * | 1980-03-06 | 1982-11-02 | Eastman Kodak Company | Method of making a solid-state color imaging device having a color filter array using a photocrosslinkable barrier |
US4416961A (en) * | 1980-09-11 | 1983-11-22 | Eastman Kodak Company | Color imaging devices and color filter arrays using photo-bleachable dyes |
JPS58219748A (ja) * | 1982-06-15 | 1983-12-21 | Toshiba Corp | 半導体装置 |
US4827118A (en) * | 1986-07-10 | 1989-05-02 | Minolta Camera Kabushiki Kaisha | Light-sensitive device having color filter and manufacturing method thereof |
JPS63204486A (ja) * | 1987-02-20 | 1988-08-24 | Mitsubishi Electric Corp | 文字入力装置 |
JPS63250316A (ja) * | 1987-04-07 | 1988-10-18 | Nitto Koryo Kk | 浴用剤 |
JPS63290802A (ja) * | 1987-05-25 | 1988-11-28 | Dai Ichi Kogyo Seiyaku Co Ltd | 水系水中防汚剤 |
JPS63304675A (ja) * | 1987-06-04 | 1988-12-12 | Mitsubishi Electric Corp | 半導体素子装置 |
JPH0296372A (ja) * | 1988-09-30 | 1990-04-09 | Fujitsu Ltd | カラー固体撮像素子の製造方法 |
US5124543A (en) * | 1989-08-09 | 1992-06-23 | Ricoh Company, Ltd. | Light emitting element, image sensor and light receiving element with linearly varying waveguide index |
US5239412A (en) * | 1990-02-05 | 1993-08-24 | Sharp Kabushiki Kaisha | Solid image pickup device having microlenses |
JPH0485960A (ja) * | 1990-07-30 | 1992-03-18 | Toshiba Corp | 固体撮像装置及びその製造方法 |
JPH05167054A (ja) * | 1991-12-19 | 1993-07-02 | Toshiba Corp | 固体撮像装置の製造方法 |
-
1992
- 1992-06-01 US US07/891,827 patent/US5321249A/en not_active Expired - Fee Related
- 1992-06-30 DE DE69224788T patent/DE69224788T2/de not_active Expired - Fee Related
- 1992-06-30 EP EP92111031A patent/EP0539658B1/de not_active Expired - Lifetime
- 1992-10-29 KR KR1019920020012A patent/KR960016178B1/ko not_active IP Right Cessation
-
1993
- 1993-05-24 US US08/065,770 patent/US5336367A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69224788D1 (de) | 1998-04-23 |
KR960016178B1 (ko) | 1996-12-04 |
US5336367A (en) | 1994-08-09 |
EP0539658A1 (de) | 1993-05-05 |
US5321249A (en) | 1994-06-14 |
EP0539658B1 (de) | 1998-03-18 |
KR930009375A (ko) | 1993-05-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD., KADOMA, |
|
8339 | Ceased/non-payment of the annual fee |