DE69229489T2 - Herstellungsverfahren einer Halbleiterpackung mit Drähten und eine Oberfläche mit planarisierter Dünnfilmdecke - Google Patents

Herstellungsverfahren einer Halbleiterpackung mit Drähten und eine Oberfläche mit planarisierter Dünnfilmdecke

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Publication number
DE69229489T2
DE69229489T2 DE69229489T DE69229489T DE69229489T2 DE 69229489 T2 DE69229489 T2 DE 69229489T2 DE 69229489 T DE69229489 T DE 69229489T DE 69229489 T DE69229489 T DE 69229489T DE 69229489 T2 DE69229489 T2 DE 69229489T2
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Germany
Prior art keywords
wires
thin film
manufacturing process
semiconductor package
film cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69229489T
Other languages
English (en)
Other versions
DE69229489D1 (de
Inventor
Ward H Conru
Gary Hugh Irish
Francis Joseph Pakulski
William John Slattery
Stephen George Starr
William Caroll Ward
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
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International Business Machines Corp
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Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE69229489D1 publication Critical patent/DE69229489D1/de
Application granted granted Critical
Publication of DE69229489T2 publication Critical patent/DE69229489T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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DE69229489T 1991-05-02 1992-04-07 Herstellungsverfahren einer Halbleiterpackung mit Drähten und eine Oberfläche mit planarisierter Dünnfilmdecke Expired - Fee Related DE69229489T2 (de)

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US07/694,719 US5086018A (en) 1991-05-02 1991-05-02 Method of making a planarized thin film covered wire bonded semiconductor package

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DE69229489D1 (de) 1999-08-05
EP0513521B1 (de) 1999-06-30
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