DE69303308D1 - Bad zur galvanischen Abscheidung von Palladium-Nickellegierung - Google Patents

Bad zur galvanischen Abscheidung von Palladium-Nickellegierung

Info

Publication number
DE69303308D1
DE69303308D1 DE69303308T DE69303308T DE69303308D1 DE 69303308 D1 DE69303308 D1 DE 69303308D1 DE 69303308 T DE69303308 T DE 69303308T DE 69303308 T DE69303308 T DE 69303308T DE 69303308 D1 DE69303308 D1 DE 69303308D1
Authority
DE
Germany
Prior art keywords
palladium
bath
nickel alloy
galvanic deposition
galvanic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69303308T
Other languages
English (en)
Other versions
DE69303308T2 (de
Inventor
Tomio Hirano
Masasski Tsukamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Publication of DE69303308D1 publication Critical patent/DE69303308D1/de
Application granted granted Critical
Publication of DE69303308T2 publication Critical patent/DE69303308T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
DE69303308T 1992-03-30 1993-03-01 Bad zur galvanischen Abscheidung von Palladium-Nickellegierung Expired - Fee Related DE69303308T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4073731A JPH05271980A (ja) 1992-03-30 1992-03-30 パラジウム−ニッケル合金メッキ液

Publications (2)

Publication Number Publication Date
DE69303308D1 true DE69303308D1 (de) 1996-08-01
DE69303308T2 DE69303308T2 (de) 1996-12-19

Family

ID=13526677

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69303308T Expired - Fee Related DE69303308T2 (de) 1992-03-30 1993-03-01 Bad zur galvanischen Abscheidung von Palladium-Nickellegierung

Country Status (6)

Country Link
US (1) US5342504A (de)
EP (1) EP0563587B1 (de)
JP (1) JPH05271980A (de)
AU (1) AU652508B2 (de)
DE (1) DE69303308T2 (de)
ES (1) ES2089609T3 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020121274A1 (en) * 1995-04-05 2002-09-05 Aerogen, Inc. Laminated electroformed aperture plate
US5758637A (en) 1995-08-31 1998-06-02 Aerogen, Inc. Liquid dispensing apparatus and methods
US6235177B1 (en) 1999-09-09 2001-05-22 Aerogen, Inc. Method for the construction of an aperture plate for dispensing liquid droplets
CN1117179C (zh) * 1999-09-30 2003-08-06 上海交通大学 电刷镀钯镍合金及稀土钯镍合金镀层的工艺
US7971588B2 (en) 2000-05-05 2011-07-05 Novartis Ag Methods and systems for operating an aerosol generator
US8336545B2 (en) 2000-05-05 2012-12-25 Novartis Pharma Ag Methods and systems for operating an aerosol generator
US7677467B2 (en) 2002-01-07 2010-03-16 Novartis Pharma Ag Methods and devices for aerosolizing medicament
MXPA04006629A (es) 2002-01-07 2004-11-10 Aerogen Inc Aparatos y metodos para nebulizar fluidos para inhalacion.
WO2003059424A1 (en) 2002-01-15 2003-07-24 Aerogen, Inc. Methods and systems for operating an aerosol generator
EP1509259B1 (de) 2002-05-20 2016-04-20 Novartis AG Gerät zur bereitstellung eines aerosols für die medizinische behandlung und verfahren
US8616195B2 (en) 2003-07-18 2013-12-31 Novartis Ag Nebuliser for the production of aerosolized medication
US7946291B2 (en) 2004-04-20 2011-05-24 Novartis Ag Ventilation systems and methods employing aerosol generators
UA94711C2 (uk) 2005-05-25 2011-06-10 Аэроджен, Инк. Вібраційна система (варіанти) та спосіб її виготовлення (варіанти), спосіб вібрування пластини (варіанти), система виробництва аерозолю та спосіб лікування пацієнта
EP1892320A1 (de) * 2006-08-22 2008-02-27 Enthone, Incorporated Elektrolytzusammensetzung und Verfahren zur elektrolytischen Abscheidung von palladiumhaltigen Schichten
US20110147225A1 (en) 2007-07-20 2011-06-23 Rohm And Haas Electronic Materials Llc High speed method for plating palladium and palladium alloys
CN101348928B (zh) * 2007-07-20 2012-07-04 罗门哈斯电子材料有限公司 镀钯及镀钯合金之高速方法
JP5583896B2 (ja) * 2008-07-22 2014-09-03 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． パラジウムおよびパラジウム合金の高速めっき方法
KR101491980B1 (ko) * 2008-07-23 2015-02-10 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 팔라듐 및 팔라듐 합금의 고속 도금 방법
KR102254372B1 (ko) * 2014-02-20 2021-05-24 엘지이노텍 주식회사 광택제 무첨가 광택도금방법
CN106480439A (zh) * 2016-11-29 2017-03-08 江苏澳光电子有限公司 一种化学镀镍钯合金渡液及其应用

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2364980A1 (fr) * 1976-09-17 1978-04-14 Parker Ste Continentale Bain et procede pour le depot electrolytique d'alliages a base de palladium
US4406755A (en) * 1982-03-08 1983-09-27 Technic Inc. Bright palladium electrodeposition
JPS62177193A (ja) * 1986-01-30 1987-08-04 Yazaki Corp パラジウム・ニツケル合金メツキ液及びメツキ法
JP2539394B2 (ja) * 1986-10-29 1996-10-02 株式会社日立製作所 パラジウム電気めつき液
SU1585391A1 (ru) * 1988-05-16 1990-08-15 Рижское Производственное Объединение Вэф Им.В.И.Ленина Электролит дл осаждени сплава палладий-никель
JPH0826472B2 (ja) * 1988-08-01 1996-03-13 日本エレクトロプレイテイング・エンジニヤース株式会社 パラジウムめっき液

Also Published As

Publication number Publication date
EP0563587A1 (de) 1993-10-06
AU3402993A (en) 1993-10-07
JPH05271980A (ja) 1993-10-19
EP0563587B1 (de) 1996-06-26
ES2089609T3 (es) 1996-10-01
AU652508B2 (en) 1994-08-25
DE69303308T2 (de) 1996-12-19
US5342504A (en) 1994-08-30

Similar Documents

Publication Publication Date Title
DE69303308T2 (de) Bad zur galvanischen Abscheidung von Palladium-Nickellegierung
IT8448693A0 (it) Bagno e procedimento per elettroplaccature zinco e lega di zinco
DE69210435T2 (de) Verfahren zur elektrolytischen Verzinkung von Aluminiumband
DE69400952D1 (de) Alkalisches Bad für die galvanische Abscheidung von Zink-Nickel-Legierungen
DE69520779D1 (de) Verfahren zur Herstellung von einer aktiven metallenthaltenden Kupferlegierung
DE3665078D1 (en) Galvanic bath for the electrodeposition of gold alloys
DE69422201T2 (de) Reaktive Träger zur Bestimmung von Cyanid
DE69007345T2 (de) Nichtwässeriges Galvanisierbad zur Abscheidung von Aluminium.
FI952774A (fi) Pinnoitteen galvaaninen tuotantomenetelmä
DE69424112D1 (de) Verfahren zur Herstellung von Iturin A und Fungizid für schwere Mycosis
DK59285A (da) Fremgangsmaade til omdannelse af teicoplanin faktor a2 komponent 1 tilteicoplanin faktor a2 komponent 3
ATA166488A (de) Waesseriges saures bad zur galvanischen abscheidung glaenzender und eingeebneter kupferueberzuege
DE58902124D1 (de) Alkalisches waessriges bad zur galvanischen abscheidung von zink - eisen - legierungen.
CA2093924A1 (en) Acid bath for copper plating
DE3660313D1 (en) Bath for the galvanic deposition of gold-tin alloy coatings
DE3476225D1 (en) Bath for the galvanic deposition of gold alloys
KR960008912B1 (en) Cathodic electrodeposition coating composition
DE69418938T2 (de) Zusatzmittel zur herstellung von legierungen
DE69204644D1 (de) Verfahren zur galvanischen Verzinnung.
DE59500711D1 (de) Bad zum galvanischen Abscheiden von Kupfer-Zinn-Legierungen
DE29520434U1 (de) Anodenkorb zur galvanischen Abscheidung von Metallen
DE59301633D1 (de) Konzentrat zur herstellung von metallbeizmitteln
DE59500558D1 (de) Bad zum galvanischen Abscheiden von Palladium-Silber-Legierungen
DE69008537D1 (de) Elektroplattierung von zink- oder zinklegierungsbeschichtungen.
DE59502070D1 (de) Bad zum galvanischen Abscheiden von Silber-Zinn-Legierungen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee