DE69303633D1 - Mehrchipmodul - Google Patents

Mehrchipmodul

Info

Publication number
DE69303633D1
DE69303633D1 DE69303633T DE69303633T DE69303633D1 DE 69303633 D1 DE69303633 D1 DE 69303633D1 DE 69303633 T DE69303633 T DE 69303633T DE 69303633 T DE69303633 T DE 69303633T DE 69303633 D1 DE69303633 D1 DE 69303633D1
Authority
DE
Germany
Prior art keywords
chip module
chip
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69303633T
Other languages
English (en)
Inventor
Thomas Mario Cipolla
Paul William Coteus
Glen Walden Johnson
Lawrence Shungwei Mok
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69303633D1 publication Critical patent/DE69303633D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1429—Housings for circuits carrying a CPU and adapted to receive expansion cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69303633T 1992-02-14 1993-01-18 Mehrchipmodul Expired - Lifetime DE69303633D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/836,672 US5208729A (en) 1992-02-14 1992-02-14 Multi-chip module

Publications (1)

Publication Number Publication Date
DE69303633D1 true DE69303633D1 (de) 1996-08-22

Family

ID=25272461

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69303633T Expired - Lifetime DE69303633D1 (de) 1992-02-14 1993-01-18 Mehrchipmodul

Country Status (4)

Country Link
US (1) US5208729A (de)
EP (1) EP0555659B1 (de)
JP (1) JPH0821647B2 (de)
DE (1) DE69303633D1 (de)

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US5268815A (en) * 1992-02-14 1993-12-07 International Business Machines Corporation High density, high performance memory circuit package
US5731633A (en) * 1992-09-16 1998-03-24 Gary W. Hamilton Thin multichip module
US5477082A (en) * 1994-01-11 1995-12-19 Exponential Technology, Inc. Bi-planar multi-chip module
US5544174A (en) * 1994-03-17 1996-08-06 The United States Of America As Represented By The Secretary Of The Air Force Programmable boundary scan and input output parameter device for testing integrated circuits
US6266872B1 (en) * 1996-12-12 2001-07-31 Tessera, Inc. Method for making a connection component for a semiconductor chip package
AU1901299A (en) * 1997-11-06 1999-05-31 Lockheed Martin Corporation Modular and multifunctional structure
US6201695B1 (en) * 1998-10-26 2001-03-13 Micron Technology, Inc. Heat sink for chip stacking applications
JP2001196103A (ja) * 2000-01-12 2001-07-19 Matsushita Electric Ind Co Ltd 組電池の冷却構造
US6605778B2 (en) * 2000-10-02 2003-08-12 Siemens Aktiengesellschaft Circuit carrier, in particular printed circuit board
US6956284B2 (en) 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
US7202555B2 (en) 2001-10-26 2007-04-10 Staktek Group L.P. Pitch change and chip scale stacking system and method
US7656678B2 (en) 2001-10-26 2010-02-02 Entorian Technologies, Lp Stacked module systems
US7081373B2 (en) 2001-12-14 2006-07-25 Staktek Group, L.P. CSP chip stack with flex circuit
US6661666B1 (en) 2002-09-24 2003-12-09 Agilent Technologies, Inc. Device for enhancing the local cooling of electronic packages subject to laminar air flow
US6711021B1 (en) * 2003-01-15 2004-03-23 Hewlett-Packard Development Company, L.P. Systems and methods that use at least one component to remove the heat generated by at least one other component
US7023700B2 (en) * 2003-12-24 2006-04-04 Super Talent Electronics, Inc. Heat sink riveted to memory module with upper slots and open bottom edge for air flow
US7579687B2 (en) 2004-09-03 2009-08-25 Entorian Technologies, Lp Circuit module turbulence enhancement systems and methods
US7511968B2 (en) 2004-09-03 2009-03-31 Entorian Technologies, Lp Buffered thin module system and method
US7443023B2 (en) 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
US7324352B2 (en) 2004-09-03 2008-01-29 Staktek Group L.P. High capacity thin module system and method
US7606049B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Module thermal management system and method
US7616452B2 (en) 2004-09-03 2009-11-10 Entorian Technologies, Lp Flex circuit constructions for high capacity circuit module systems and methods
US7446410B2 (en) 2004-09-03 2008-11-04 Entorian Technologies, Lp Circuit module with thermal casing systems
US7289327B2 (en) 2006-02-27 2007-10-30 Stakick Group L.P. Active cooling methods and apparatus for modules
US20060050492A1 (en) 2004-09-03 2006-03-09 Staktek Group, L.P. Thin module system and method
US7542297B2 (en) 2004-09-03 2009-06-02 Entorian Technologies, Lp Optimized mounting area circuit module system and method
US7468893B2 (en) 2004-09-03 2008-12-23 Entorian Technologies, Lp Thin module system and method
US7606040B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Memory module system and method
US7760513B2 (en) 2004-09-03 2010-07-20 Entorian Technologies Lp Modified core for circuit module system and method
US7522421B2 (en) * 2004-09-03 2009-04-21 Entorian Technologies, Lp Split core circuit module
US7423885B2 (en) 2004-09-03 2008-09-09 Entorian Technologies, Lp Die module system
US7606050B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Compact module system and method
US7033861B1 (en) 2005-05-18 2006-04-25 Staktek Group L.P. Stacked module systems and method
JP2007109932A (ja) * 2005-10-14 2007-04-26 Toshiba Corp 半導体装置
US7576995B2 (en) 2005-11-04 2009-08-18 Entorian Technologies, Lp Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area
US7304382B2 (en) 2006-01-11 2007-12-04 Staktek Group L.P. Managed memory component
US7508069B2 (en) 2006-01-11 2009-03-24 Entorian Technologies, Lp Managed memory component
US7608920B2 (en) 2006-01-11 2009-10-27 Entorian Technologies, Lp Memory card and method for devising
US7508058B2 (en) 2006-01-11 2009-03-24 Entorian Technologies, Lp Stacked integrated circuit module
US7605454B2 (en) 2006-01-11 2009-10-20 Entorian Technologies, Lp Memory card and method for devising
US7511969B2 (en) 2006-02-02 2009-03-31 Entorian Technologies, Lp Composite core circuit module system and method
US7468553B2 (en) 2006-10-20 2008-12-23 Entorian Technologies, Lp Stackable micropackages and stacked modules
AT12722U1 (de) * 2010-03-16 2012-10-15 Austria Tech & System Tech Verfahren und verbund zum bearbeiten bzw. behandeln einer mehrzahl von leiterplatten sowie verwendung hiefür
TW201611675A (zh) * 2014-09-01 2016-03-16 廣達電腦股份有限公司 電路板結構之改良方法
KR102654718B1 (ko) * 2018-07-31 2024-04-08 삼성디스플레이 주식회사 커넥터 및 이를 포함하는 디스플레이 장치
CN112164891B (zh) * 2020-08-31 2023-05-23 西安朗普达通信科技有限公司 一种对消式去耦芯片

Family Cites Families (40)

* Cited by examiner, † Cited by third party
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US3372310A (en) * 1965-04-30 1968-03-05 Radiation Inc Universal modular packages for integrated circuits
DE1765575B1 (de) * 1968-06-12 1971-05-27 Zuse Kg Schaltungsplatten baueinheit
US3671812A (en) * 1970-07-01 1972-06-20 Martin Marietta Corp High density packaging of electronic components in three-dimensional modules
US3833836A (en) * 1973-06-18 1974-09-03 Sanders Associates Inc Printed circuit board package with cooling and vibration damping means
US4019098A (en) * 1974-11-25 1977-04-19 Sundstrand Corporation Heat pipe cooling system for electronic devices
US3991347A (en) * 1975-01-31 1976-11-09 Amp Incorporated Plated-through hole soldering to filter body
US4107760A (en) * 1977-05-31 1978-08-15 Burroughs Corporation Dual printed circuit card mount assembly
US4122508A (en) * 1977-09-06 1978-10-24 Altec Corporation Modular printed circuit board assembly having cooling means incorporated therein
US4315300A (en) * 1979-01-29 1982-02-09 The United States Of America As Represented By The Secretary Of The Navy Cooling arrangement for plug-in module assembly
US4283754A (en) * 1979-03-26 1981-08-11 Bunker Ramo Corporation Cooling system for multiwafer high density circuit
US4291364A (en) * 1979-12-26 1981-09-22 International Business Machines Corporation Air-cooled hybrid electronic package
US4339628A (en) * 1980-08-20 1982-07-13 Northern Telecom Limited RF Shielding support for stacked electrical circuit boards
US4423468A (en) * 1980-10-01 1983-12-27 Motorola, Inc. Dual electronic component assembly
US4375290A (en) * 1980-11-24 1983-03-01 Westinghouse Electric Corp. Sliding compression air seal for removable electronic units
US4549200A (en) * 1982-07-08 1985-10-22 International Business Machines Corporation Repairable multi-level overlay system for semiconductor device
US4493010A (en) * 1982-11-05 1985-01-08 Lockheed Corporation Electronic packaging module utilizing phase-change conductive cooling
JPS60229353A (ja) * 1984-04-27 1985-11-14 Hitachi Ltd 熱伝達装置
JPS6140053A (ja) * 1984-07-31 1986-02-26 Toshiba Corp 半導体装置
JPH0752762B2 (ja) * 1985-01-07 1995-06-05 株式会社日立製作所 半導体樹脂パッケージ
US4580193A (en) * 1985-01-14 1986-04-01 International Business Machines Corporation Chip to board bus connection
JPS61267398A (ja) * 1985-05-22 1986-11-26 株式会社日立製作所 電子装置の冷却構造
US4730232A (en) * 1986-06-25 1988-03-08 Westinghouse Electric Corp. High density microelectronic packaging module for high speed chips
US4674004A (en) * 1986-07-03 1987-06-16 Burroughs Corporation Parallel-flow air system for cooling electronic equipment
US4783695A (en) * 1986-09-26 1988-11-08 General Electric Company Multichip integrated circuit packaging configuration and method
DE3684602D1 (de) * 1986-10-08 1992-04-30 Ibm Verfahren zum herstellen von loetkontakten fuer ein keramisches modul ohne steckerstifte.
JPS6387064U (de) * 1986-11-27 1988-06-07
JP2573225B2 (ja) * 1987-02-10 1997-01-22 株式会社東芝 電子部品の製造方法
US4868634A (en) * 1987-03-13 1989-09-19 Citizen Watch Co., Ltd. IC-packaged device
US4862249A (en) * 1987-04-17 1989-08-29 Xoc Devices, Inc. Packaging system for stacking integrated circuits
US4782381A (en) * 1987-06-12 1988-11-01 Hewlett-Packard Company Chip carrier
US4771366A (en) * 1987-07-06 1988-09-13 International Business Machines Corporation Ceramic card assembly having enhanced power distribution and cooling
US4838475A (en) * 1987-08-28 1989-06-13 Motorola, Inc. Method and apparatus for EMI/RFI shielding an infrared energy reflow soldered device
US4841355A (en) * 1988-02-10 1989-06-20 Amdahl Corporation Three-dimensional microelectronic package for semiconductor chips
EP0353443B1 (de) * 1988-08-03 1993-01-27 Mannesmann Kienzle GmbH (HR B1220) Gehäuse für ein elektronisches Gerät
KR970004752B1 (ko) * 1989-03-07 1997-04-03 로-무 가부시기가이샤 전자장치의 제조방법 및 그 제조에 사용되는 소재기판 및 이 소재기판으로부터의 프린트기판의 절단장치
US4956746A (en) * 1989-03-29 1990-09-11 Hughes Aircraft Company Stacked wafer electronic package
US5049982A (en) * 1989-07-28 1991-09-17 At&T Bell Laboratories Article comprising a stacked array of electronic subassemblies
US5023754A (en) * 1990-01-19 1991-06-11 International Business Machines Corporation Double-sided backplane assembly
US5101322A (en) * 1990-03-07 1992-03-31 Motorola, Inc. Arrangement for electronic circuit module
US5053853A (en) * 1990-05-08 1991-10-01 International Business Machines Corporation Modular electronic packaging system

Also Published As

Publication number Publication date
JPH0821647B2 (ja) 1996-03-04
US5208729A (en) 1993-05-04
EP0555659A2 (de) 1993-08-18
JPH05275865A (ja) 1993-10-22
EP0555659A3 (en) 1993-12-22
EP0555659B1 (de) 1996-07-17

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Legal Events

Date Code Title Description
8332 No legal effect for de