DE69310129D1 - Elektroplattiersystem mit mehreren Abteilungen - Google Patents

Elektroplattiersystem mit mehreren Abteilungen

Info

Publication number
DE69310129D1
DE69310129D1 DE69310129T DE69310129T DE69310129D1 DE 69310129 D1 DE69310129 D1 DE 69310129D1 DE 69310129 T DE69310129 T DE 69310129T DE 69310129 T DE69310129 T DE 69310129T DE 69310129 D1 DE69310129 D1 DE 69310129D1
Authority
DE
Germany
Prior art keywords
department
electroplating system
electroplating
department electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69310129T
Other languages
English (en)
Other versions
DE69310129T2 (de
Inventor
Panayotis Andrivcacos
Moritz Branger
Robert Browne
John Dukovic
Benjamin Fu
Robert Hitzfeld
Matteo Flotta
Donald Mckenna
Lubomyr Romankiw
Saeed Sahami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE69310129D1 publication Critical patent/DE69310129D1/de
Application granted granted Critical
Publication of DE69310129T2 publication Critical patent/DE69310129T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath
DE69310129T 1993-01-15 1993-12-17 Elektroplattiersystem mit mehreren Abteilungen Expired - Fee Related DE69310129T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/006,070 US5312532A (en) 1993-01-15 1993-01-15 Multi-compartment eletroplating system

Publications (2)

Publication Number Publication Date
DE69310129D1 true DE69310129D1 (de) 1997-05-28
DE69310129T2 DE69310129T2 (de) 1997-10-16

Family

ID=21719149

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69310129T Expired - Fee Related DE69310129T2 (de) 1993-01-15 1993-12-17 Elektroplattiersystem mit mehreren Abteilungen

Country Status (4)

Country Link
US (1) US5312532A (de)
EP (1) EP0606610B1 (de)
JP (1) JP2598877B2 (de)
DE (1) DE69310129T2 (de)

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US20050034977A1 (en) * 2003-06-06 2005-02-17 Hanson Kyle M. Electrochemical deposition chambers for depositing materials onto microfeature workpieces
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US20070144912A1 (en) * 2003-07-01 2007-06-28 Woodruff Daniel J Linearly translating agitators for processing microfeature workpieces, and associated methods
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US20050283993A1 (en) * 2004-06-18 2005-12-29 Qunwei Wu Method and apparatus for fluid processing and drying a workpiece
US7608174B1 (en) 2005-04-22 2009-10-27 Sandia Corporation Apparatus and method for electroforming high aspect ratio micro-parts
JP2006299367A (ja) * 2005-04-22 2006-11-02 Yamamoto Mekki Shikenki:Kk 電気めっき試験器
JP2006328470A (ja) * 2005-05-25 2006-12-07 Tousetsu:Kk 電気めっき装置
US9822461B2 (en) 2006-08-16 2017-11-21 Novellus Systems, Inc. Dynamic current distribution control apparatus and method for wafer electroplating
US20080181758A1 (en) * 2007-01-29 2008-07-31 Woodruff Daniel J Microfeature workpiece transfer devices with rotational orientation sensors, and associated systems and methods
US20080178460A1 (en) * 2007-01-29 2008-07-31 Woodruff Daniel J Protected magnets and magnet shielding for processing microfeature workpieces, and associated systems and methods
US7964081B2 (en) * 2007-08-24 2011-06-21 International Business Machines Corporation Enhanced magnetic plating method
US8177944B2 (en) * 2007-12-04 2012-05-15 Ebara Corporation Plating apparatus and plating method
US8062496B2 (en) * 2008-04-18 2011-11-22 Integran Technologies Inc. Electroplating method and apparatus
US8858774B2 (en) 2008-11-07 2014-10-14 Novellus Systems, Inc. Electroplating apparatus for tailored uniformity profile
US8426241B2 (en) 2010-09-09 2013-04-23 International Business Machines Corporation Structure and method of fabricating a CZTS photovoltaic device by electrodeposition
FR2966282B1 (fr) * 2010-10-18 2013-02-15 Nexcis Controle de la stoechiometrie de couches i-iii-vi pour des applications photovoltaiques a partir de conditions d'electrolyse perfectionnees.
US20120231574A1 (en) * 2011-03-12 2012-09-13 Jiaxiong Wang Continuous Electroplating Apparatus with Assembled Modular Sections for Fabrications of Thin Film Solar Cells
US9421617B2 (en) 2011-06-22 2016-08-23 Tel Nexx, Inc. Substrate holder
US8613474B2 (en) 2011-07-06 2013-12-24 Tel Nexx, Inc. Substrate loader and unloader having a Bernoulli support
US9362440B2 (en) 2012-10-04 2016-06-07 International Business Machines Corporation 60×120 cm2 prototype electrodeposition cell for processing of thin film solar panels
US9909228B2 (en) 2012-11-27 2018-03-06 Lam Research Corporation Method and apparatus for dynamic current distribution control during electroplating
US9303329B2 (en) 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management
US9752248B2 (en) 2014-12-19 2017-09-05 Lam Research Corporation Methods and apparatuses for dynamically tunable wafer-edge electroplating
US9567685B2 (en) 2015-01-22 2017-02-14 Lam Research Corporation Apparatus and method for dynamic control of plated uniformity with the use of remote electric current
US9988733B2 (en) 2015-06-09 2018-06-05 Lam Research Corporation Apparatus and method for modulating azimuthal uniformity in electroplating
US10240245B2 (en) 2017-06-28 2019-03-26 Honeywell International Inc. Systems, methods, and anodes for enhanced ionic liquid bath plating of turbomachine components and other workpieces
CN109898126B (zh) * 2019-04-03 2020-11-13 西安飞机工业（集团）有限责任公司 一种用于导轨类零件电镀的象形阳极夹具
CN116288607A (zh) * 2021-12-21 2023-06-23 盛美半导体设备(上海)股份有限公司 储液装置及电镀设备

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Also Published As

Publication number Publication date
DE69310129T2 (de) 1997-10-16
US5312532A (en) 1994-05-17
EP0606610A3 (de) 1995-04-05
JP2598877B2 (ja) 1997-04-09
JPH07300699A (ja) 1995-11-14
EP0606610A2 (de) 1994-07-20
EP0606610B1 (de) 1997-04-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee