DE69312196T2 - Verfahren zur Vorbereitung der Montage eines Chips auf einem Substrat - Google Patents
Verfahren zur Vorbereitung der Montage eines Chips auf einem SubstratInfo
- Publication number
- DE69312196T2 DE69312196T2 DE1993612196 DE69312196T DE69312196T2 DE 69312196 T2 DE69312196 T2 DE 69312196T2 DE 1993612196 DE1993612196 DE 1993612196 DE 69312196 T DE69312196 T DE 69312196T DE 69312196 T2 DE69312196 T2 DE 69312196T2
- Authority
- DE
- Germany
- Prior art keywords
- chip
- preparing
- substrate
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H01L2224/818—Bonding techniques
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9211447A FR2696279B1 (fr) | 1992-09-25 | 1992-09-25 | Procédé pour permettre le montage d'une puce sur un substrat et puce préparée selon le procédé. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69312196D1 DE69312196D1 (de) | 1997-08-21 |
DE69312196T2 true DE69312196T2 (de) | 1997-10-30 |
Family
ID=9433889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1993612196 Expired - Fee Related DE69312196T2 (de) | 1992-09-25 | 1993-09-10 | Verfahren zur Vorbereitung der Montage eines Chips auf einem Substrat |
Country Status (4)
Country | Link |
---|---|
US (1) | US5438020A (de) |
EP (1) | EP0589748B1 (de) |
DE (1) | DE69312196T2 (de) |
FR (1) | FR2696279B1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5677203A (en) * | 1993-12-15 | 1997-10-14 | Chip Supply, Inc. | Method for providing known good bare semiconductor die |
JP3304720B2 (ja) * | 1995-10-31 | 2002-07-22 | 日立電線株式会社 | リードフレームへの接着剤塗布方法 |
US5744383A (en) * | 1995-11-17 | 1998-04-28 | Altera Corporation | Integrated circuit package fabrication method |
TW337033B (en) * | 1996-02-08 | 1998-07-21 | Matsushita Electric Ind Co Ltd | Bump forming method and its forming apparatus |
US5771157A (en) * | 1996-03-08 | 1998-06-23 | Honeywell, Inc. | Chip-on-board printed circuit assembly using aluminum wire bonded to copper pads |
US6179198B1 (en) * | 1996-09-18 | 2001-01-30 | Matsushita Electric Industrial Co., Ltd. | Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps |
JP3425510B2 (ja) * | 1996-09-27 | 2003-07-14 | 松下電器産業株式会社 | バンプボンダー形成方法 |
US6293456B1 (en) | 1997-05-27 | 2001-09-25 | Spheretek, Llc | Methods for forming solder balls on substrates |
US7007833B2 (en) | 1997-05-27 | 2006-03-07 | Mackay John | Forming solder balls on substrates |
US7842599B2 (en) * | 1997-05-27 | 2010-11-30 | Wstp, Llc | Bumping electronic components using transfer substrates |
US6609652B2 (en) | 1997-05-27 | 2003-08-26 | Spheretek, Llc | Ball bumping substrates, particuarly wafers |
US7819301B2 (en) * | 1997-05-27 | 2010-10-26 | Wstp, Llc | Bumping electronic components using transfer substrates |
US7288471B2 (en) * | 1997-05-27 | 2007-10-30 | Mackay John | Bumping electronic components using transfer substrates |
US7654432B2 (en) | 1997-05-27 | 2010-02-02 | Wstp, Llc | Forming solder balls on substrates |
US5988487A (en) * | 1997-05-27 | 1999-11-23 | Fujitsu Limited | Captured-cell solder printing and reflow methods |
FR2769130B1 (fr) | 1997-09-30 | 2001-06-08 | Thomson Csf | Procede d'enrobage d'une puce electronique et carte electronique comportant au moins une puce enrobee selon ce procede |
US6765652B1 (en) * | 1998-01-12 | 2004-07-20 | Micron Technology, Inc. | Forming thermally curable materials on a support structure in an electronic device |
KR20120091839A (ko) * | 2011-02-10 | 2012-08-20 | 삼성전자주식회사 | 플립칩 발광소자 패키지 및 그 제조 방법 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3621565A (en) * | 1969-06-12 | 1971-11-23 | Nasa | Fabrication of single-crystal film semiconductor devices |
JPS6482643A (en) * | 1987-09-25 | 1989-03-28 | Fujitsu Ltd | Manufacture of resin sealed semiconductor device |
US5014111A (en) * | 1987-12-08 | 1991-05-07 | Matsushita Electric Industrial Co., Ltd. | Electrical contact bump and a package provided with the same |
WO1991000619A1 (en) * | 1989-06-30 | 1991-01-10 | Raychem Corporation | Flying leads for integrated circuits |
JP2682160B2 (ja) * | 1989-08-11 | 1997-11-26 | 富士通株式会社 | ワイヤボンディング方法 |
JP2891432B2 (ja) * | 1989-12-27 | 1999-05-17 | 田中電子工業株式会社 | 半導体材料の接続方法,それに用いる接続材料及び半導体装置 |
US5173451A (en) * | 1991-06-04 | 1992-12-22 | Micron Technology, Inc. | Soft bond for semiconductor dies |
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1992
- 1992-09-25 FR FR9211447A patent/FR2696279B1/fr not_active Expired - Fee Related
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1993
- 1993-09-10 DE DE1993612196 patent/DE69312196T2/de not_active Expired - Fee Related
- 1993-09-10 EP EP19930402204 patent/EP0589748B1/de not_active Expired - Lifetime
- 1993-09-17 US US08/121,881 patent/US5438020A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2696279B1 (fr) | 1994-11-18 |
DE69312196D1 (de) | 1997-08-21 |
US5438020A (en) | 1995-08-01 |
EP0589748A1 (de) | 1994-03-30 |
EP0589748B1 (de) | 1997-07-16 |
FR2696279A1 (fr) | 1994-04-01 |
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