DE69312411D1 - Ballkontaktierung für Flip-Chip-Anordnungen - Google Patents

Ballkontaktierung für Flip-Chip-Anordnungen

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Publication number
DE69312411D1
DE69312411D1 DE69312411T DE69312411T DE69312411D1 DE 69312411 D1 DE69312411 D1 DE 69312411D1 DE 69312411 T DE69312411 T DE 69312411T DE 69312411 T DE69312411 T DE 69312411T DE 69312411 D1 DE69312411 D1 DE 69312411D1
Authority
DE
Germany
Prior art keywords
flip
ball contacting
chip arrangements
arrangements
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69312411T
Other languages
English (en)
Other versions
DE69312411T2 (de
Inventor
Anthony M Chiu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE69312411D1 publication Critical patent/DE69312411D1/de
Application granted granted Critical
Publication of DE69312411T2 publication Critical patent/DE69312411T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/109—Embedding of laminae within face of additional laminae
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49224—Contact or terminal manufacturing with coating
DE69312411T 1992-09-15 1993-09-15 Ballkontaktierung für Flip-Chip-Anordnungen Expired - Fee Related DE69312411T2 (de)

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EP (1) EP0588609B1 (de)
JP (1) JPH06224198A (de)
KR (1) KR100317756B1 (de)
DE (1) DE69312411T2 (de)
SG (1) SG54297A1 (de)
TW (1) TW239899B (de)

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FR2791046B1 (fr) * 1999-03-17 2001-05-11 Novatec Sa Soc Procede et dispositif de distribution unitaire de billes solides et identiques sur un substrat par serigraphie
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JP4341187B2 (ja) * 2001-02-13 2009-10-07 日本電気株式会社 半導体装置
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JP4427411B2 (ja) * 2004-07-28 2010-03-10 日立ソフトウエアエンジニアリング株式会社 ビーズ配列装置及びビーズ配列方法
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CN101125406B (zh) * 2006-08-16 2010-09-29 比亚迪股份有限公司 球体固定块及其制造装置
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TW239899B (de) 1995-02-01
EP0588609A1 (de) 1994-03-23
SG54297A1 (en) 1998-11-16
EP0588609B1 (de) 1997-07-23
DE69312411T2 (de) 1997-11-27
KR940012484A (ko) 1994-06-23
KR100317756B1 (ko) 2002-03-20
US5955784A (en) 1999-09-21
US5849132A (en) 1998-12-15
JPH06224198A (ja) 1994-08-12

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