US5668057A
(en)
*
|
1991-03-13 |
1997-09-16 |
Matsushita Electric Industrial Co., Ltd. |
Methods of manufacture for electronic components having high-frequency elements
|
US5583058A
(en)
*
|
1992-09-17 |
1996-12-10 |
Mitsubishi Denki Kabushiki Kaisha |
Infrared detection element array and method for fabricating the same
|
EP0734589B1
(de)
*
|
1993-12-13 |
1998-03-25 |
Honeywell Inc. |
Integrierte silizium-vakuum-mikropackung für infrarot-geräte
|
JPH07209089A
(ja)
*
|
1994-01-24 |
1995-08-11 |
Terumo Corp |
赤外線センサ
|
US6127629A
(en)
*
|
1994-10-03 |
2000-10-03 |
Ford Global Technologies, Inc. |
Hermetically sealed microelectronic device and method of forming same
|
JPH08107120A
(ja)
*
|
1994-10-06 |
1996-04-23 |
Mitsubishi Electric Corp |
高周波半導体集積回路装置,及びその製造方法
|
JPH08152356A
(ja)
*
|
1994-11-30 |
1996-06-11 |
Terumo Corp |
赤外線センサ
|
US5686779A
(en)
*
|
1995-03-01 |
1997-11-11 |
The United States Of America As Represented By The Secretary Of The Army |
High sensitivity temperature sensor and sensor array
|
EP0773435A3
(de)
*
|
1995-07-21 |
1998-03-11 |
Texas Instruments Incorporated |
Verfahren und Vorrichtungen zur Strahlungsmessung
|
US5710217A
(en)
*
|
1995-09-15 |
1998-01-20 |
Minnesota Mining And Manufacturing Company |
Extrudable thermoplastic hydrocarbon compositions
|
JPH09147631A
(ja)
*
|
1995-09-20 |
1997-06-06 |
Denso Corp |
検出器用のリード線
|
US5729019A
(en)
*
|
1995-12-29 |
1998-03-17 |
Honeywell Inc. |
Split field-of-view uncooled infrared sensor
|
GB2310952B
(en)
*
|
1996-03-05 |
1998-08-19 |
Mitsubishi Electric Corp |
Infrared detector
|
US5962854A
(en)
*
|
1996-06-12 |
1999-10-05 |
Ishizuka Electronics Corporation |
Infrared sensor and infrared detector
|
FR2752299B1
(fr)
*
|
1996-08-08 |
1998-09-11 |
Commissariat Energie Atomique |
Detecteur infrarouge et procede de fabication de celui-ci
|
US5962909A
(en)
*
|
1996-09-12 |
1999-10-05 |
Institut National D'optique |
Microstructure suspended by a microsupport
|
US5831266A
(en)
*
|
1996-09-12 |
1998-11-03 |
Institut National D'optique |
Microbridge structure for emitting or detecting radiations and method for forming such microbridge structure
|
KR100205384B1
(ko)
*
|
1997-03-14 |
1999-07-01 |
구자홍 |
적외선 센서 및 그의 온도 보상방법
|
US6239033B1
(en)
*
|
1998-05-28 |
2001-05-29 |
Sony Corporation |
Manufacturing method of semiconductor device
|
US5929515A
(en)
*
|
1997-10-01 |
1999-07-27 |
The Charles Stark Draper Laboratory, Inc. |
Gettering enclosure for a semiconductor device
|
US6244121B1
(en)
*
|
1998-03-06 |
2001-06-12 |
Applied Materials, Inc. |
Sensor device for non-intrusive diagnosis of a semiconductor processing system
|
US6036872A
(en)
|
1998-03-31 |
2000-03-14 |
Honeywell Inc. |
Method for making a wafer-pair having sealed chambers
|
WO2000012985A1
(en)
*
|
1998-08-31 |
2000-03-09 |
Daewoo Electronics Co., Ltd. |
Bolometer including an absorber made of a material having a low deposition-temperature and a low heat-conductivity
|
DE19842403B4
(de)
*
|
1998-09-16 |
2004-05-06 |
Braun Gmbh |
Strahlungssensor mit mehreren Sensorelementen
|
US7258003B2
(en)
*
|
1998-12-07 |
2007-08-21 |
Honeywell International Inc. |
Flow sensor with self-aligned flow channel
|
US6734252B1
(en)
|
1999-01-29 |
2004-05-11 |
3M Innovative Properties Company |
Melt processable thermoplastic polymer composition employing a polymer processing additive containing a fluorothermoplastic copolymer
|
US6277919B1
(en)
|
1999-05-13 |
2001-08-21 |
Dyneon Llc |
Polymer processing additive containing a multimodal fluoropolymer and melt processable thermoplastic polymer composition employing the same
|
US6222454B1
(en)
*
|
1999-07-01 |
2001-04-24 |
Goal Electronics Inc. |
Non-contacting temperature sensing device
|
GB9919877D0
(en)
*
|
1999-08-24 |
1999-10-27 |
Secr Defence |
Micro-bridge structure
|
DE19942214A1
(de)
*
|
1999-09-03 |
2001-03-08 |
Braun Gmbh |
Beheizbarer Infrarot-Sensor und Infrarot-Thermometer mit einem derartigen Sensor
|
US6380313B1
(en)
|
2000-06-27 |
2002-04-30 |
Dyneon Llc |
Polymer processing additive containing a perfluorovinylether-modified flouropolymer and a melt processable thermoplastic polymer composition employing the same
|
CA2312646A1
(en)
*
|
2000-06-28 |
2001-12-28 |
Institut National D'optique |
Hybrid micropackaging of microdevices
|
US6686653B2
(en)
|
2000-06-28 |
2004-02-03 |
Institut National D'optique |
Miniature microdevice package and process for making thereof
|
JP3379518B2
(ja)
*
|
2000-08-14 |
2003-02-24 |
株式会社村田製作所 |
圧電素子の製造方法
|
AUPR244801A0
(en)
*
|
2001-01-10 |
2001-02-01 |
Silverbrook Research Pty Ltd |
A method and apparatus (WSM01)
|
FR2822541B1
(fr)
*
|
2001-03-21 |
2003-10-03 |
Commissariat Energie Atomique |
Procedes et dispositifs de fabrication de detecteurs de rayonnement
|
US7057256B2
(en)
|
2001-05-25 |
2006-06-06 |
President & Fellows Of Harvard College |
Silicon-based visible and near-infrared optoelectric devices
|
US7442629B2
(en)
|
2004-09-24 |
2008-10-28 |
President & Fellows Of Harvard College |
Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
|
US6890834B2
(en)
*
|
2001-06-11 |
2005-05-10 |
Matsushita Electric Industrial Co., Ltd. |
Electronic device and method for manufacturing the same
|
DE10144343A1
(de)
*
|
2001-09-10 |
2003-03-27 |
Perkinelmer Optoelectronics |
Sensor zum berührugslosen Messen einer Temperatur
|
US20050224902A1
(en)
*
|
2002-02-06 |
2005-10-13 |
Ramsey Craig C |
Wireless substrate-like sensor
|
US7289230B2
(en)
*
|
2002-02-06 |
2007-10-30 |
Cyberoptics Semiconductors, Inc. |
Wireless substrate-like sensor
|
US20050233770A1
(en)
*
|
2002-02-06 |
2005-10-20 |
Ramsey Craig C |
Wireless substrate-like sensor
|
US20050224899A1
(en)
*
|
2002-02-06 |
2005-10-13 |
Ramsey Craig C |
Wireless substrate-like sensor
|
EP1369929B1
(de)
*
|
2002-05-27 |
2016-08-03 |
STMicroelectronics Srl |
Herstellungsverfahren von verkapselten optischen Sensoren und so hergestellter verkapselter optischer Sensor
|
US7453129B2
(en)
*
|
2002-12-18 |
2008-11-18 |
Noble Peak Vision Corp. |
Image sensor comprising isolated germanium photodetectors integrated with a silicon substrate and silicon circuitry
|
DE10260961A1
(de)
*
|
2002-12-20 |
2004-07-01 |
Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG |
Halbleitersensor mit frontseitiger Kontaktierung
|
US8210120B2
(en)
*
|
2003-01-10 |
2012-07-03 |
Microsemi Corporation |
Systems and methods for building tamper resistant coatings
|
FR2855609B1
(fr)
*
|
2003-05-26 |
2005-07-01 |
Commissariat Energie Atomique |
Dispositif de detection bolometrique a antenne, a cavite optimisee, pour ondes electromagnetiques millimetriques ou submillimetriques, et procede de fabrication de ce dispositif
|
RU2383557C2
(ru)
*
|
2003-06-09 |
2010-03-10 |
3М Инновейтив Пропертиз Компани |
Плавкая полимерная композиция, содержащая фторполимер, имеющий длинные боковые цепочки
|
US7084010B1
(en)
*
|
2003-10-17 |
2006-08-01 |
Raytheon Company |
Integrated package design and method for a radiation sensing device
|
FR2863357B1
(fr)
*
|
2003-12-08 |
2006-05-05 |
Commissariat Energie Atomique |
Dispositif de mesure d'energie rayonnante ameliore a deux positions
|
FR2867273B1
(fr)
*
|
2004-03-04 |
2006-09-08 |
Commissariat Energie Atomique |
Procede de realisation d'un dispositif pour la detection thermique d'un rayonnement comportant un microbolometre actif et un microbolometre passif
|
DE102004010499A1
(de)
*
|
2004-03-04 |
2005-09-22 |
Robert Bosch Gmbh |
Mikrostrukturierter Sensor
|
US20050250908A1
(en)
*
|
2004-05-07 |
2005-11-10 |
3M Innovative Properties Company |
Polymer melt additive composition and use thereof
|
JP4535367B2
(ja)
*
|
2004-05-24 |
2010-09-01 |
ルネサスエレクトロニクス株式会社 |
集積回路装置
|
US7264983B2
(en)
*
|
2004-11-04 |
2007-09-04 |
Unimems Manufacturing Co., Ltd. |
Method of enhancing connection strength for suspended membrane leads and substrate contacts
|
JP2006145501A
(ja)
*
|
2004-11-24 |
2006-06-08 |
Hamamatsu Photonics Kk |
赤外線検出装置
|
TWI256105B
(en)
*
|
2005-02-17 |
2006-06-01 |
Touch Micro System Tech |
Method of forming chip type low-k dielectric layer
|
TWI302036B
(en)
*
|
2005-04-01 |
2008-10-11 |
Unimems Mfg Co Ltd |
Infrared imaging sensor and vacuum packaging method thereof
|
CN100411183C
(zh)
*
|
2005-04-18 |
2008-08-13 |
友力微系统制造股份有限公司 |
红外线图像传感器及其真空封装方法
|
CA2616164A1
(en)
*
|
2005-07-25 |
2007-02-01 |
Metanomics Gmbh |
Means and methods for analyzing a sample by means of chromatography-mass spectrometry
|
US7893697B2
(en)
*
|
2006-02-21 |
2011-02-22 |
Cyberoptics Semiconductor, Inc. |
Capacitive distance sensing in semiconductor processing tools
|
CN101410690B
(zh)
*
|
2006-02-21 |
2011-11-23 |
赛博光学半导体公司 |
半导体加工工具中的电容性距离感测
|
US7449693B2
(en)
*
|
2006-06-12 |
2008-11-11 |
Texas Instruments Incorporated |
System and method for radiation detection and imaging
|
WO2008042199A2
(en)
*
|
2006-09-29 |
2008-04-10 |
Cyberoptics Semiconductor, Inc. |
Particles sensor integrated with substrate
|
US20080128620A1
(en)
*
|
2006-12-04 |
2008-06-05 |
Krellner Theodore J |
Method of making a thermopile detector and package
|
US7778793B2
(en)
*
|
2007-03-12 |
2010-08-17 |
Cyberoptics Semiconductor, Inc. |
Wireless sensor for semiconductor processing systems
|
TW200849444A
(en)
*
|
2007-04-05 |
2008-12-16 |
Cyberoptics Semiconductor Inc |
Semiconductor processing system with integrated showerhead distance measuring device
|
DE102007024903B4
(de)
*
|
2007-05-29 |
2009-05-07 |
Pyreos Ltd. |
Vorrichtung mit Sandwichstruktur zur Detektion von Wärmestrahlung, Verfahren zum Herstellen und Verwendung der Vorrichtung
|
US7905855B2
(en)
*
|
2007-07-05 |
2011-03-15 |
Baxter International Inc. |
Dialysis system having non-invasive temperature sensing
|
US20090015268A1
(en)
*
|
2007-07-13 |
2009-01-15 |
Gardner Delrae H |
Device and method for compensating a capacitive sensor measurement for variations caused by environmental conditions in a semiconductor processing environment
|
US8058615B2
(en)
|
2008-02-29 |
2011-11-15 |
Sionyx, Inc. |
Wide spectral range hybrid image detector
|
US7847253B2
(en)
|
2008-08-15 |
2010-12-07 |
Sionyx, Inc. |
Wideband semiconducting light detector
|
DE102009002559A1
(de)
*
|
2009-04-22 |
2010-10-28 |
Robert Bosch Gmbh |
Sensoranordnung
|
US20100314149A1
(en)
*
|
2009-06-10 |
2010-12-16 |
Medtronic, Inc. |
Hermetically-sealed electrical circuit apparatus
|
US9911781B2
(en)
|
2009-09-17 |
2018-03-06 |
Sionyx, Llc |
Photosensitive imaging devices and associated methods
|
US9673243B2
(en)
|
2009-09-17 |
2017-06-06 |
Sionyx, Llc |
Photosensitive imaging devices and associated methods
|
JP5640529B2
(ja)
*
|
2009-10-17 |
2014-12-17 |
三菱マテリアル株式会社 |
赤外線センサ及びこれを備えた回路基板
|
JP5832007B2
(ja)
*
|
2009-12-25 |
2015-12-16 |
三菱マテリアル株式会社 |
赤外線センサ及びその製造方法
|
US8692198B2
(en)
|
2010-04-21 |
2014-04-08 |
Sionyx, Inc. |
Photosensitive imaging devices and associated methods
|
US20120146172A1
(en)
|
2010-06-18 |
2012-06-14 |
Sionyx, Inc. |
High Speed Photosensitive Devices and Associated Methods
|
TWI369483B
(en)
*
|
2010-08-30 |
2012-08-01 |
Unimems Mfg Co Ltd |
Miniature infrared sensor and manufacturing method thereof
|
JP5870492B2
(ja)
*
|
2011-02-23 |
2016-03-01 |
セイコーエプソン株式会社 |
熱型検出器、熱型検出装置及び電子機器
|
US9496308B2
(en)
|
2011-06-09 |
2016-11-15 |
Sionyx, Llc |
Process module for increasing the response of backside illuminated photosensitive imagers and associated methods
|
CN103946867A
(zh)
|
2011-07-13 |
2014-07-23 |
西奥尼克斯公司 |
生物计量成像装置和相关方法
|
US9064764B2
(en)
|
2012-03-22 |
2015-06-23 |
Sionyx, Inc. |
Pixel isolation elements, devices, and associated methods
|
US9252182B2
(en)
*
|
2012-09-05 |
2016-02-02 |
Northrop Grumman Systems Corporation |
Infrared multiplier for photo-conducting sensors
|
WO2014127376A2
(en)
|
2013-02-15 |
2014-08-21 |
Sionyx, Inc. |
High dynamic range cmos image sensor having anti-blooming properties and associated methods
|
WO2014151093A1
(en)
|
2013-03-15 |
2014-09-25 |
Sionyx, Inc. |
Three dimensional imaging utilizing stacked imager devices and associated methods
|
US9209345B2
(en)
|
2013-06-29 |
2015-12-08 |
Sionyx, Inc. |
Shallow trench textured regions and associated methods
|
DE102014217336A1
(de)
*
|
2014-08-29 |
2016-03-03 |
Mahle International Gmbh |
Temperiereinrichtung
|
JP2016058699A
(ja)
|
2014-09-12 |
2016-04-21 |
株式会社東芝 |
赤外線センサ
|
JP6279011B2
(ja)
*
|
2016-05-13 |
2018-02-14 |
三菱電機株式会社 |
熱型赤外線検出器および熱型赤外線検出器の製造方法
|
JP6726087B2
(ja)
*
|
2016-12-14 |
2020-07-22 |
浜松ホトニクス株式会社 |
光検出器
|