DE69323762D1 - Lasermarkierungsgerät - Google Patents
LasermarkierungsgerätInfo
- Publication number
- DE69323762D1 DE69323762D1 DE69323762T DE69323762T DE69323762D1 DE 69323762 D1 DE69323762 D1 DE 69323762D1 DE 69323762 T DE69323762 T DE 69323762T DE 69323762 T DE69323762 T DE 69323762T DE 69323762 D1 DE69323762 D1 DE 69323762D1
- Authority
- DE
- Germany
- Prior art keywords
- marking device
- laser marking
- laser
- marking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1992086578U JP2588281Y2 (ja) | 1992-11-25 | 1992-11-25 | レーザマーキング装置 |
PCT/JP1993/001717 WO1994012309A1 (en) | 1992-11-25 | 1993-11-24 | Laser marking apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69323762D1 true DE69323762D1 (de) | 1999-04-08 |
DE69323762T2 DE69323762T2 (de) | 1999-07-01 |
Family
ID=13890895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69323762T Expired - Fee Related DE69323762T2 (de) | 1992-11-25 | 1993-11-24 | Lasermarkierungsgerät |
Country Status (6)
Country | Link |
---|---|
US (1) | US5587094A (de) |
EP (1) | EP0671238B1 (de) |
JP (1) | JP2588281Y2 (de) |
KR (1) | KR950704081A (de) |
DE (1) | DE69323762T2 (de) |
WO (1) | WO1994012309A1 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3293136B2 (ja) * | 1993-06-04 | 2002-06-17 | セイコーエプソン株式会社 | レーザ加工装置及びレーザ加工方法 |
JP3265553B2 (ja) * | 1994-08-19 | 2002-03-11 | 株式会社小松製作所 | レーザマーキング方法 |
JP2860765B2 (ja) * | 1995-03-07 | 1999-02-24 | 株式会社小松製作所 | レーザ刻印装置の制御装置 |
US5937270A (en) * | 1996-01-24 | 1999-08-10 | Micron Electronics, Inc. | Method of efficiently laser marking singulated semiconductor devices |
JPH10166167A (ja) * | 1996-12-03 | 1998-06-23 | Komatsu Ltd | レーザマーキング方法及び装置 |
US6057871A (en) * | 1998-07-10 | 2000-05-02 | Litton Systems, Inc. | Laser marking system and associated microlaser apparatus |
US6262388B1 (en) | 1998-12-21 | 2001-07-17 | Micron Electronics, Inc. | Laser marking station with enclosure and method of operation |
US6417484B1 (en) | 1998-12-21 | 2002-07-09 | Micron Electronics, Inc. | Laser marking system for dice carried in trays and method of operation |
CN1376100A (zh) * | 1999-09-28 | 2002-10-23 | 住友重机械工业株式会社 | 激光钻孔的加工方法及其加工装置 |
JP2001105164A (ja) * | 1999-10-07 | 2001-04-17 | Sumitomo Heavy Ind Ltd | レーザ穴あけ加工方法及び加工装置 |
DE19955647C1 (de) * | 1999-11-19 | 2001-06-13 | Audi Ag | Verfahren zum messtechnischen Erfassen einer Formänderung eines Werkstückes |
JP2001166237A (ja) * | 1999-12-10 | 2001-06-22 | Canon Inc | 光走査光学装置 |
GB0000632D0 (en) * | 2000-01-13 | 2000-03-01 | Hastings Stephen A | Apparatus for and method of targeting |
US6528760B1 (en) | 2000-07-14 | 2003-03-04 | Micron Technology, Inc. | Apparatus and method using rotational indexing for laser marking IC packages carried in trays |
DE10119456C1 (de) * | 2001-04-20 | 2003-05-08 | Siemens Ag | Beschriftungsverfahren für ein elektrisches Gerät |
US6804269B2 (en) * | 2001-06-19 | 2004-10-12 | Hitachi Via Mechanics, Ltd. | Laser beam delivery system with trepanning module |
US7169685B2 (en) | 2002-02-25 | 2007-01-30 | Micron Technology, Inc. | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive |
US7011880B2 (en) * | 2002-07-03 | 2006-03-14 | The Gates Corporation | Belt and method of marking |
US6705727B1 (en) | 2002-12-30 | 2004-03-16 | Bausch & Lomb Incorporated | Mechanism for rotationally moving a mirror |
JP4662411B2 (ja) * | 2003-03-14 | 2011-03-30 | 日立ビアメカニクス株式会社 | レーザ加工装置 |
WO2006000549A1 (de) * | 2004-06-29 | 2006-01-05 | Hitachi Via Mechanics, Ltd. | Laserbearbeitungsmaschine zum bohren von löchern in ein werkstück mit einer optischen auslenkvorrichtung und einer ablenkeinheit |
CN102294906B (zh) * | 2010-06-22 | 2013-04-17 | 翁希明 | 一种陶瓷材料表面标记制作工艺 |
CN107922989B (zh) * | 2015-05-08 | 2020-11-10 | 爱科古恩A.I.E. | 利用能量束热处理含铁材料的方法和设备 |
KR102075731B1 (ko) * | 2018-09-27 | 2020-02-10 | 한국기계연구원 | 레이저 제염 시스템 |
WO2021117850A1 (ja) * | 2019-12-13 | 2021-06-17 | パナソニックIpマネジメント株式会社 | レーザ装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5368499A (en) * | 1976-11-30 | 1978-06-17 | Komatsu Ltd | Method of shaping laser beam used for machining |
JPS6011325B2 (ja) * | 1977-01-21 | 1985-03-25 | キヤノン株式会社 | 走査装置 |
DD207347A1 (de) * | 1982-05-03 | 1984-02-29 | Joerg Neumann | Anordnung zur materialabtragung mittels laserstrahlung |
JPH0825044B2 (ja) * | 1989-06-15 | 1996-03-13 | 株式会社小松製作所 | レーザ印字装置 |
JP3126368B2 (ja) * | 1990-06-22 | 2001-01-22 | 株式会社日立製作所 | 画像縮小拡大投影装置 |
JPH0494881A (ja) * | 1990-08-08 | 1992-03-26 | Nippon Denki Laser Kiki Eng Kk | レーザマーキング装置 |
JPH04251683A (ja) * | 1991-01-24 | 1992-09-08 | Komatsu Ltd | レーザマーキング装置 |
JP2701183B2 (ja) * | 1991-08-09 | 1998-01-21 | 株式会社小松製作所 | 液晶マスク式レーザマーカ |
-
1992
- 1992-11-25 JP JP1992086578U patent/JP2588281Y2/ja not_active Expired - Fee Related
-
1993
- 1993-11-24 KR KR1019950701881A patent/KR950704081A/ko active IP Right Grant
- 1993-11-24 EP EP94900998A patent/EP0671238B1/de not_active Expired - Lifetime
- 1993-11-24 DE DE69323762T patent/DE69323762T2/de not_active Expired - Fee Related
- 1993-11-24 US US08/433,416 patent/US5587094A/en not_active Expired - Fee Related
- 1993-11-24 WO PCT/JP1993/001717 patent/WO1994012309A1/ja active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP0671238B1 (de) | 1999-03-03 |
DE69323762T2 (de) | 1999-07-01 |
WO1994012309A1 (en) | 1994-06-09 |
US5587094A (en) | 1996-12-24 |
JPH0641982U (ja) | 1994-06-03 |
EP0671238A1 (de) | 1995-09-13 |
KR950704081A (ko) | 1995-11-17 |
JP2588281Y2 (ja) | 1999-01-06 |
EP0671238A4 (de) | 1996-08-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |