DE69323762D1 - Lasermarkierungsgerät - Google Patents

Lasermarkierungsgerät

Info

Publication number
DE69323762D1
DE69323762D1 DE69323762T DE69323762T DE69323762D1 DE 69323762 D1 DE69323762 D1 DE 69323762D1 DE 69323762 T DE69323762 T DE 69323762T DE 69323762 T DE69323762 T DE 69323762T DE 69323762 D1 DE69323762 D1 DE 69323762D1
Authority
DE
Germany
Prior art keywords
marking device
laser marking
laser
marking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69323762T
Other languages
English (en)
Other versions
DE69323762T2 (de
Inventor
Koji Yoshida
Taku Yamazaki
Akina Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Komatsu Ltd
Original Assignee
Komatsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Ltd filed Critical Komatsu Ltd
Publication of DE69323762D1 publication Critical patent/DE69323762D1/de
Application granted granted Critical
Publication of DE69323762T2 publication Critical patent/DE69323762T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
DE69323762T 1992-11-25 1993-11-24 Lasermarkierungsgerät Expired - Fee Related DE69323762T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1992086578U JP2588281Y2 (ja) 1992-11-25 1992-11-25 レーザマーキング装置
PCT/JP1993/001717 WO1994012309A1 (en) 1992-11-25 1993-11-24 Laser marking apparatus

Publications (2)

Publication Number Publication Date
DE69323762D1 true DE69323762D1 (de) 1999-04-08
DE69323762T2 DE69323762T2 (de) 1999-07-01

Family

ID=13890895

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69323762T Expired - Fee Related DE69323762T2 (de) 1992-11-25 1993-11-24 Lasermarkierungsgerät

Country Status (6)

Country Link
US (1) US5587094A (de)
EP (1) EP0671238B1 (de)
JP (1) JP2588281Y2 (de)
KR (1) KR950704081A (de)
DE (1) DE69323762T2 (de)
WO (1) WO1994012309A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994029069A1 (fr) 1993-06-04 1994-12-22 Seiko Epson Corporation Appareil et procede d'usinage au laser, et panneau a cristaux liquides
JP3265553B2 (ja) * 1994-08-19 2002-03-11 株式会社小松製作所 レーザマーキング方法
JP2860765B2 (ja) * 1995-03-07 1999-02-24 株式会社小松製作所 レーザ刻印装置の制御装置
US5937270A (en) * 1996-01-24 1999-08-10 Micron Electronics, Inc. Method of efficiently laser marking singulated semiconductor devices
JPH10166167A (ja) * 1996-12-03 1998-06-23 Komatsu Ltd レーザマーキング方法及び装置
US6057871A (en) * 1998-07-10 2000-05-02 Litton Systems, Inc. Laser marking system and associated microlaser apparatus
US6262388B1 (en) 1998-12-21 2001-07-17 Micron Electronics, Inc. Laser marking station with enclosure and method of operation
US6417484B1 (en) 1998-12-21 2002-07-09 Micron Electronics, Inc. Laser marking system for dice carried in trays and method of operation
US6888096B1 (en) * 1999-09-28 2005-05-03 Sumitomo Heavy Industries, Ltd. Laser drilling method and laser drilling device
JP2001105164A (ja) * 1999-10-07 2001-04-17 Sumitomo Heavy Ind Ltd レーザ穴あけ加工方法及び加工装置
DE19955647C1 (de) * 1999-11-19 2001-06-13 Audi Ag Verfahren zum messtechnischen Erfassen einer Formänderung eines Werkstückes
JP2001166237A (ja) * 1999-12-10 2001-06-22 Canon Inc 光走査光学装置
GB0000632D0 (en) 2000-01-13 2000-03-01 Hastings Stephen A Apparatus for and method of targeting
US6528760B1 (en) 2000-07-14 2003-03-04 Micron Technology, Inc. Apparatus and method using rotational indexing for laser marking IC packages carried in trays
DE10119456C1 (de) * 2001-04-20 2003-05-08 Siemens Ag Beschriftungsverfahren für ein elektrisches Gerät
US6804269B2 (en) * 2001-06-19 2004-10-12 Hitachi Via Mechanics, Ltd. Laser beam delivery system with trepanning module
US7169685B2 (en) 2002-02-25 2007-01-30 Micron Technology, Inc. Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
US7011880B2 (en) * 2002-07-03 2006-03-14 The Gates Corporation Belt and method of marking
US6705727B1 (en) 2002-12-30 2004-03-16 Bausch & Lomb Incorporated Mechanism for rotationally moving a mirror
JP4662411B2 (ja) * 2003-03-14 2011-03-30 日立ビアメカニクス株式会社 レーザ加工装置
WO2006000549A1 (de) * 2004-06-29 2006-01-05 Hitachi Via Mechanics, Ltd. Laserbearbeitungsmaschine zum bohren von löchern in ein werkstück mit einer optischen auslenkvorrichtung und einer ablenkeinheit
CN102294906B (zh) * 2010-06-22 2013-04-17 翁希明 一种陶瓷材料表面标记制作工艺
CN107922989B (zh) * 2015-05-08 2020-11-10 爱科古恩A.I.E. 利用能量束热处理含铁材料的方法和设备
KR102075731B1 (ko) * 2018-09-27 2020-02-10 한국기계연구원 레이저 제염 시스템
CN114555277A (zh) * 2019-12-13 2022-05-27 松下知识产权经营株式会社 激光器装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5368499A (en) * 1976-11-30 1978-06-17 Komatsu Ltd Method of shaping laser beam used for machining
JPS6011325B2 (ja) * 1977-01-21 1985-03-25 キヤノン株式会社 走査装置
DD207347A1 (de) * 1982-05-03 1984-02-29 Joerg Neumann Anordnung zur materialabtragung mittels laserstrahlung
JPH0825044B2 (ja) * 1989-06-15 1996-03-13 株式会社小松製作所 レーザ印字装置
JP3126368B2 (ja) * 1990-06-22 2001-01-22 株式会社日立製作所 画像縮小拡大投影装置
JPH0494881A (ja) * 1990-08-08 1992-03-26 Nippon Denki Laser Kiki Eng Kk レーザマーキング装置
JPH04251683A (ja) * 1991-01-24 1992-09-08 Komatsu Ltd レーザマーキング装置
JP2701183B2 (ja) * 1991-08-09 1998-01-21 株式会社小松製作所 液晶マスク式レーザマーカ

Also Published As

Publication number Publication date
DE69323762T2 (de) 1999-07-01
EP0671238B1 (de) 1999-03-03
JP2588281Y2 (ja) 1999-01-06
EP0671238A1 (de) 1995-09-13
US5587094A (en) 1996-12-24
WO1994012309A1 (en) 1994-06-09
EP0671238A4 (de) 1996-08-28
KR950704081A (ko) 1995-11-17
JPH0641982U (ja) 1994-06-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee