DE69325749T2 - Gestapelte Mehrchip-Module und Verfahren zur Herstellung - Google Patents

Gestapelte Mehrchip-Module und Verfahren zur Herstellung

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Publication number
DE69325749T2
DE69325749T2 DE69325749T DE69325749T DE69325749T2 DE 69325749 T2 DE69325749 T2 DE 69325749T2 DE 69325749 T DE69325749 T DE 69325749T DE 69325749 T DE69325749 T DE 69325749T DE 69325749 T2 DE69325749 T2 DE 69325749T2
Authority
DE
Germany
Prior art keywords
manufacturing processes
chip modules
stacked multi
stacked
modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69325749T
Other languages
English (en)
Other versions
DE69325749D1 (de
Inventor
Hem P Takiar
Peng-Cheng Lin
Luu T Nguyen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
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Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of DE69325749D1 publication Critical patent/DE69325749D1/de
Application granted granted Critical
Publication of DE69325749T2 publication Critical patent/DE69325749T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49121Beam lead frame or beam lead device
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US5502289A (en) 1996-03-26
US5422435A (en) 1995-06-06

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