DE69329502T2 - Verfahren zum Montieren von Chip-Bauteilen und Gerät dafür - Google Patents

Verfahren zum Montieren von Chip-Bauteilen und Gerät dafür

Info

Publication number
DE69329502T2
DE69329502T2 DE69329502T DE69329502T DE69329502T2 DE 69329502 T2 DE69329502 T2 DE 69329502T2 DE 69329502 T DE69329502 T DE 69329502T DE 69329502 T DE69329502 T DE 69329502T DE 69329502 T2 DE69329502 T2 DE 69329502T2
Authority
DE
Germany
Prior art keywords
chip components
device therefor
assembling chip
assembling
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69329502T
Other languages
English (en)
Other versions
DE69329502D1 (de
Inventor
Hitoshi Onodera
Hiroshi Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26450700&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69329502(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Publication of DE69329502D1 publication Critical patent/DE69329502D1/de
Application granted granted Critical
Publication of DE69329502T2 publication Critical patent/DE69329502T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
DE69329502T 1992-08-07 1993-07-26 Verfahren zum Montieren von Chip-Bauteilen und Gerät dafür Expired - Lifetime DE69329502T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21183992 1992-08-07
JP5111270A JP2554437B2 (ja) 1992-08-07 1993-05-13 部品装着方法及び同装置

Publications (2)

Publication Number Publication Date
DE69329502D1 DE69329502D1 (de) 2000-11-02
DE69329502T2 true DE69329502T2 (de) 2001-02-08

Family

ID=26450700

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69306493T Expired - Lifetime DE69306493T2 (de) 1992-08-07 1993-07-26 Verfahren zum Montieren von Chip-Bauteilen und Gerät dafür
DE69329502T Expired - Lifetime DE69329502T2 (de) 1992-08-07 1993-07-26 Verfahren zum Montieren von Chip-Bauteilen und Gerät dafür

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69306493T Expired - Lifetime DE69306493T2 (de) 1992-08-07 1993-07-26 Verfahren zum Montieren von Chip-Bauteilen und Gerät dafür

Country Status (4)

Country Link
US (1) US5570993A (de)
EP (2) EP0582171B1 (de)
JP (1) JP2554437B2 (de)
DE (2) DE69306493T2 (de)

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DE10100618C1 (de) * 2001-01-09 2002-06-13 Siemens Production & Logistics Bauelementeaufnahmeeinrichtung mit einem optischen Sensor
WO2002028161A1 (en) * 2000-09-26 2002-04-04 Matsushita Technology (S) Pte Ltd. Component placement machine and method thereof
US6678062B2 (en) * 2000-12-08 2004-01-13 Cyberoptics Corporation Automated system with improved height sensing
US6762847B2 (en) 2001-01-22 2004-07-13 Cyberoptics Corporation Laser align sensor with sequencing light sources
US6909515B2 (en) 2001-01-22 2005-06-21 Cyberoptics Corporation Multiple source alignment sensor with improved optics
JP2002299889A (ja) 2001-03-30 2002-10-11 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP3846262B2 (ja) * 2001-10-29 2006-11-15 松下電器産業株式会社 電子部品実装装置におけるノズル吸着高さの検出方法
JP4384439B2 (ja) 2002-11-21 2009-12-16 富士機械製造株式会社 対基板作業機、対基板作業システムおよび対基板作業機用作業ヘッド使用準備処理プログラム
JP2005228992A (ja) * 2004-02-13 2005-08-25 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
JP4598513B2 (ja) * 2004-12-27 2010-12-15 株式会社日立ハイテクインスツルメンツ 電子部品の装着装置
DE102005023705A1 (de) * 2005-05-23 2006-11-30 Siemens Ag Sensor und Sensorsystem zur optischen Erfassung von Objekten, Bestückkopf, Verfahren zur Bestimmung der Höhenposition eines Bauelements
KR101278010B1 (ko) * 2005-08-02 2013-06-27 파나소닉 주식회사 전자 부품 장착기 및 장착 방법
WO2008115532A1 (en) 2007-03-20 2008-09-25 Cyberoptics Corporation Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam
JP4949921B2 (ja) * 2007-04-26 2012-06-13 株式会社日立ハイテクインスツルメンツ 電子部品の装着方法及び電子部品の装着装置
WO2008153885A1 (en) 2007-06-05 2008-12-18 Cyberoptics Corporation Component sensor for pick and place machine using improved shadow imaging
JP5780712B2 (ja) * 2009-05-29 2015-09-16 富士機械製造株式会社 撮像システムおよび電子回路部品装着機
DE102009043347B4 (de) * 2009-09-29 2014-05-15 Asm Assembly Systems Gmbh & Co. Kg Verfahren zur Erkennung einer Pipettenkonfiguration für Bestückvorgänge
JP5675013B2 (ja) * 2010-06-10 2015-02-25 富士機械製造株式会社 電子回路組立方法および電子回路組立システム
JP5729724B2 (ja) * 2012-03-07 2015-06-03 ヤマハ発動機株式会社 演算装置、部品実装装置、及びプログラム
JP6021550B2 (ja) * 2012-09-26 2016-11-09 Juki株式会社 電子部品実装装置
JP5824643B2 (ja) * 2012-10-29 2015-11-25 パナソニックＩｐマネジメント株式会社 電子部品実装装置および電子部品実装装置におけるノズル認識方法
JP6134201B2 (ja) * 2013-05-22 2017-05-24 ヤマハ発動機株式会社 プリント基板用作業装置
KR101981516B1 (ko) * 2013-10-17 2019-05-23 야마하하쓰도키 가부시키가이샤 부품 실장 장치
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Also Published As

Publication number Publication date
JP2554437B2 (ja) 1996-11-13
JPH06104596A (ja) 1994-04-15
EP0582171B1 (de) 1996-12-11
EP0582171A1 (de) 1994-02-09
EP0715493A3 (de) 1996-09-18
EP0715493B1 (de) 2000-09-27
DE69306493D1 (de) 1997-01-23
US5570993A (en) 1996-11-05
DE69306493T2 (de) 1997-04-03
DE69329502D1 (de) 2000-11-02
EP0715493A2 (de) 1996-06-05

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