DE69329916T2 - Herstellungsverfahren elektronischer Komponenten für Schaltungsanordnung - Google Patents

Herstellungsverfahren elektronischer Komponenten für Schaltungsanordnung

Info

Publication number
DE69329916T2
DE69329916T2 DE69329916T DE69329916T DE69329916T2 DE 69329916 T2 DE69329916 T2 DE 69329916T2 DE 69329916 T DE69329916 T DE 69329916T DE 69329916 T DE69329916 T DE 69329916T DE 69329916 T2 DE69329916 T2 DE 69329916T2
Authority
DE
Germany
Prior art keywords
manufacturing process
electronic components
circuit arrangement
arrangement
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69329916T
Other languages
English (en)
Other versions
DE69329916D1 (de
Inventor
Patrizio Vinciarelli
Seller, Iii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vicor Corp
Original Assignee
VLT Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VLT Corp filed Critical VLT Corp
Application granted granted Critical
Publication of DE69329916D1 publication Critical patent/DE69329916D1/de
Publication of DE69329916T2 publication Critical patent/DE69329916T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
DE69329916T 1992-07-21 1993-07-21 Herstellungsverfahren elektronischer Komponenten für Schaltungsanordnung Expired - Fee Related DE69329916T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US91648092A 1992-07-21 1992-07-21
US07/947,937 US5443534A (en) 1992-07-21 1992-09-21 Providing electronic components for circuity assembly

Publications (2)

Publication Number Publication Date
DE69329916D1 DE69329916D1 (de) 2001-03-15
DE69329916T2 true DE69329916T2 (de) 2001-06-21

Family

ID=27129696

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69329916T Expired - Fee Related DE69329916T2 (de) 1992-07-21 1993-07-21 Herstellungsverfahren elektronischer Komponenten für Schaltungsanordnung

Country Status (4)

Country Link
US (1) US5443534A (de)
EP (1) EP0580390B1 (de)
JP (1) JP2542163B2 (de)
DE (1) DE69329916T2 (de)

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US7236086B1 (en) 1993-06-14 2007-06-26 Vlt, Inc. Power converter configuration, control, and construction
JP3552791B2 (ja) * 1995-06-13 2004-08-11 松下電器産業株式会社 電子部品実装方法及び装置
US5946210A (en) * 1996-04-19 1999-08-31 Vlt Corporation Configuring power converters
US6868603B2 (en) 1996-08-27 2005-03-22 Matsushita Electric Industrial Co., Ltd. Method of mounting component on circuit board
JPH1070395A (ja) 1996-08-27 1998-03-10 Matsushita Electric Ind Co Ltd 部品装着装置
US6026378A (en) * 1996-12-05 2000-02-15 Cnet Co., Ltd. Warehouse managing system
US5862040A (en) * 1997-02-03 1999-01-19 A.I.M., Inc. Smart pallet for burn-in testing of computers
US5838557A (en) * 1997-07-28 1998-11-17 Altor, Inc. Circuit for use in a DC-DC converter having a booster module
US6110213A (en) * 1997-11-06 2000-08-29 Vlt Coporation Fabrication rules based automated design and manufacturing system and method
US6167401A (en) * 1998-02-09 2000-12-26 Ciena Corporation Manufacturing control network having a relational database
DE19901540A1 (de) * 1999-01-16 2000-07-20 Philips Corp Intellectual Pty Verfahren zur Feinabstimmung eines passiven, elektronischen Bauelementes
EP2204186B1 (de) 1999-02-17 2016-04-06 CSL Limited Immunogene Komplexe und damit zusammenhängende Verfahren
US6388853B1 (en) * 1999-09-28 2002-05-14 Power Integrations, Inc. Method and apparatus providing final test and trimming for a power supply controller
JP2001313493A (ja) * 2000-04-27 2001-11-09 Sony Corp 電子部品の実装システム
US6816749B2 (en) 2000-12-22 2004-11-09 Fuji Photo Film Co., Ltd. Method of and apparatus for manufacturing rolled medium products
WO2002067650A1 (de) * 2001-02-23 2002-08-29 Siemens Aktiengesellschaft Verfahren zum übertragen von software an programmierbare bauelemente und bestückanlage zum bestücken von bauelementen auf substrate
WO2003055051A2 (en) * 2001-12-21 2003-07-03 Delta Energy Systems (Switzerland) Ag A forward converter with controlled reset
US6875950B2 (en) * 2002-03-22 2005-04-05 Gsi Lumonics Corporation Automated laser trimming of resistors
US6972391B2 (en) * 2002-11-21 2005-12-06 Hadco Santa Clara, Inc. Laser trimming of annular passive components
JP5091406B2 (ja) * 2002-11-21 2012-12-05 ハドコ サンタ クララ，インコーポレイテッド レジスタのレーザトリミング
US7297896B2 (en) * 2002-11-21 2007-11-20 Hadco Santa Clara, Inc. Laser trimming of resistors
US6879869B2 (en) * 2003-03-28 2005-04-12 Accu-Assembly Incorporated Placement of electronic components
US7202646B2 (en) * 2004-08-02 2007-04-10 Vlt, Inc. Control interface with droop compensation
KR100688356B1 (ko) * 2004-11-08 2007-02-28 미래산업 주식회사 마운터의 가상 정비 시스템, 그 제어 방법
CN101046859A (zh) * 2006-03-29 2007-10-03 鸿富锦精密工业（深圳）有限公司 工单开立系统及方法
US20070276624A1 (en) * 2006-05-26 2007-11-29 Inventec Corporation Method for improving test suggestion report on electronic parts
US20070285105A1 (en) * 2006-06-02 2007-12-13 Steven Wayne Bergstedt Methods and Apparatuses for Trimming Circuits
US9099248B2 (en) * 2007-06-29 2015-08-04 Corporation for National Research Iniatives Variable capacitor tuned using laser micromachining
US20090120916A1 (en) * 2007-11-12 2009-05-14 L3 Communications Corporation Through-Via Laser Reflow Systems And Methods For Surface Mount Components
DE102009013353B3 (de) * 2009-03-16 2010-10-07 Siemens Aktiengesellschaft Verfahren zur Bestimmung von Rüstungen für konstante Tische von Bestückautomaten
US8793642B2 (en) * 2009-12-23 2014-07-29 Biosense Webster (Israel), Ltd Component selection for circuit assembly
EP3712627B1 (de) * 2013-03-29 2023-05-24 FUJI Corporation Maschine zur montage von elektronischen komponenten und messverfahren
CN107869919A (zh) * 2017-12-12 2018-04-03 湖南湘中光华微波科技有限公司 窑炉控制开关电路

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US3699649A (en) * 1969-11-05 1972-10-24 Donald A Mcwilliams Method of and apparatus for regulating the resistance of film resistors
US4284872A (en) * 1978-01-13 1981-08-18 Burr-Brown Research Corporation Method for thermal testing and compensation of integrated circuits
US4381441A (en) * 1980-10-30 1983-04-26 Western Electric Company, Inc. Methods of and apparatus for trimming film resistors
DE3242711A1 (de) * 1982-11-19 1984-05-24 Bayer Ag, 5090 Leverkusen Mischungen spezieller cycloaliphatischer 1,2-diepoxide und ihre verwendung
US4563564A (en) * 1984-01-30 1986-01-07 Tektronix, Inc. Film resistors
IN163064B (de) * 1984-03-22 1988-08-06 Siemens Ag
SE451948B (sv) * 1985-05-02 1987-11-09 Hedemora Ab Filter for kontinuerlig filtrering under tryck av en suspension
US4626822A (en) * 1985-05-02 1986-12-02 Motorola, Inc. Thick film resistor element with coarse and fine adjustment provision
US4610083A (en) * 1985-08-26 1986-09-09 Zenith Electronics Corporation Method and apparatus for electronic component matching
JPH0734519B2 (ja) * 1986-10-06 1995-04-12 松下電器産業株式会社 電子回路基板の製造方法
JPH0639515Y2 (ja) * 1988-06-17 1994-10-12 富士通テン株式会社 回路部品の取付装置
US4877174A (en) * 1988-12-21 1989-10-31 International Business Machines Corporation Tab device excise and lead form apparatus
JPH03150804A (ja) * 1989-11-07 1991-06-27 Matsushita Electric Ind Co Ltd 電子回路調整装置
US5166492A (en) * 1991-03-27 1992-11-24 Motorola, Inc. Laser power correlation system
US5208976A (en) * 1991-06-05 1993-05-11 At&T Bell Laboratories Apparatus and method for assembling circuit structures

Also Published As

Publication number Publication date
DE69329916D1 (de) 2001-03-15
JP2542163B2 (ja) 1996-10-09
EP0580390A2 (de) 1994-01-26
US5443534A (en) 1995-08-22
JPH06216570A (ja) 1994-08-05
EP0580390A3 (en) 1997-05-28
EP0580390B1 (de) 2001-02-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: VLT, INC., SUNNYVALE, CALIF., US

8328 Change in the person/name/address of the agent

Representative=s name: PATENTANWAELTE REICHEL UND REICHEL, 60322 FRANKFURT

8339 Ceased/non-payment of the annual fee