DE69330711D1 - Elektronikgehäuse mit leiterrahmen mit verbesserter adhaesion - Google Patents

Elektronikgehäuse mit leiterrahmen mit verbesserter adhaesion

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Publication number
DE69330711D1
DE69330711D1 DE69330711T DE69330711T DE69330711D1 DE 69330711 D1 DE69330711 D1 DE 69330711D1 DE 69330711 T DE69330711 T DE 69330711T DE 69330711 T DE69330711 T DE 69330711T DE 69330711 D1 DE69330711 D1 DE 69330711D1
Authority
DE
Germany
Prior art keywords
adhaesion
improved
ladder frame
electronic housing
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69330711T
Other languages
English (en)
Other versions
DE69330711T2 (de
Inventor
Arvind Parthasarathi
Deepak Mahulikar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of DE69330711D1 publication Critical patent/DE69330711D1/de
Application granted granted Critical
Publication of DE69330711T2 publication Critical patent/DE69330711T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01083Bismuth [Bi]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/156Material
    • H01L2924/157Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747Copper [Cu] as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20Parameters
    • H01L2924/207Diameter ranges
    • H01L2924/20752Diameter ranges larger or equal to 20 microns less than 30 microns
DE69330711T 1992-01-17 1993-01-08 Elektronikgehäuse mit leiterrahmen mit verbesserter adhaesion Expired - Lifetime DE69330711T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US82237392A 1992-01-17 1992-01-17
US08/001,014 US5343073A (en) 1992-01-17 1993-01-06 Lead frames having a chromium and zinc alloy coating
PCT/US1993/000393 WO1993014518A1 (en) 1992-01-17 1993-01-08 Lead frames with improved adhesion

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DE69330711D1 true DE69330711D1 (de) 2001-10-11
DE69330711T2 DE69330711T2 (de) 2002-07-04

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EP (1) EP0621981B1 (de)
JP (2) JP3070862B2 (de)
KR (1) KR100286631B1 (de)
AU (1) AU3475893A (de)
DE (1) DE69330711T2 (de)
WO (1) WO1993014518A1 (de)

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KR940704060A (ko) 1994-12-12
US5343073A (en) 1994-08-30
JP3070862B2 (ja) 2000-07-31
EP0621981A4 (de) 1995-05-17
DE69330711T2 (de) 2002-07-04
KR100286631B1 (ko) 2001-04-16
JPH09172125A (ja) 1997-06-30
US5449951A (en) 1995-09-12
WO1993014518A1 (en) 1993-07-22
JPH07503103A (ja) 1995-03-30
AU3475893A (en) 1993-08-03
EP0621981A1 (de) 1994-11-02
EP0621981B1 (de) 2001-09-05

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