DE69400463D1 - Verbesserung der Haftung von Metallschichten auf Kunstharz-Teilen - Google Patents

Verbesserung der Haftung von Metallschichten auf Kunstharz-Teilen

Info

Publication number
DE69400463D1
DE69400463D1 DE69400463T DE69400463T DE69400463D1 DE 69400463 D1 DE69400463 D1 DE 69400463D1 DE 69400463 T DE69400463 T DE 69400463T DE 69400463 T DE69400463 T DE 69400463T DE 69400463 D1 DE69400463 D1 DE 69400463D1
Authority
DE
Germany
Prior art keywords
adhesion
improvement
synthetic resin
metal layers
resin parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69400463T
Other languages
English (en)
Other versions
DE69400463T2 (de
Inventor
Herbert Shin-I Chao
Carol Lynn Fasoldt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Application granted granted Critical
Publication of DE69400463D1 publication Critical patent/DE69400463D1/de
Publication of DE69400463T2 publication Critical patent/DE69400463T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/917—Treatment of workpiece between coating steps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/924—Electrolytic coating substrate predominantly comprised of specified synthetic resin
    • Y10S205/928—ABS copolymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
DE1994600463 1993-05-17 1994-05-11 Verbesserung der Haftung von Metallschichten auf Kunstharz-Teilen Expired - Fee Related DE69400463T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/062,264 US5316867A (en) 1993-05-17 1993-05-17 Method for adhering metal coatings to thermoplastic addition polymers

Publications (2)

Publication Number Publication Date
DE69400463D1 true DE69400463D1 (de) 1996-10-10
DE69400463T2 DE69400463T2 (de) 1997-03-27

Family

ID=22041324

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1994600463 Expired - Fee Related DE69400463T2 (de) 1993-05-17 1994-05-11 Verbesserung der Haftung von Metallschichten auf Kunstharz-Teilen

Country Status (5)

Country Link
US (1) US5316867A (de)
EP (1) EP0625590B1 (de)
JP (1) JPH0741956A (de)
DE (1) DE69400463T2 (de)
ES (1) ES2091668T3 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5413817A (en) * 1993-11-05 1995-05-09 General Electric Company Method for adhering metal coatings to polyphenylene ether-polystyrene articles
US6461678B1 (en) * 1997-04-29 2002-10-08 Sandia Corporation Process for metallization of a substrate by curing a catalyst applied thereto
US6723349B1 (en) * 1999-10-12 2004-04-20 Emory University Polyoxometalate materials, metal-containing materials, and methods of use thereof
US6468672B1 (en) 2000-06-29 2002-10-22 Lacks Enterprises, Inc. Decorative chrome electroplate on plastics
DE10302416A1 (de) 2003-01-21 2004-07-29 Röhm GmbH & Co. KG Matter Polymerisationsklebstoff
DE10304668B4 (de) * 2003-02-05 2006-10-19 König, Klaus-Peter Verfahren zur haftfesten, eine metallische Schicht umfassenden Beschichtung eines Substrats und seine Verwendung
JP2006028484A (ja) * 2004-06-18 2006-02-02 Mec Kk 樹脂表面処理剤および樹脂表面処理法
EP1793013B1 (de) * 2005-12-05 2017-07-19 Rohm and Haas Electronic Materials LLC Metallisierung von Dielektrika

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3847648A (en) * 1972-11-29 1974-11-12 Gen Motors Corp Plating pre-treatment in acrylonitrile butadiene styrene
US5160600A (en) * 1990-03-05 1992-11-03 Patel Gordhanbai N Chromic acid free etching of polymers for electroless plating
US5180639A (en) * 1990-10-26 1993-01-19 General Electric Company Method of preparing polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom
US5318803A (en) * 1990-11-13 1994-06-07 International Business Machines Corporation Conditioning of a substrate for electroless plating thereon

Also Published As

Publication number Publication date
EP0625590B1 (de) 1996-09-04
JPH0741956A (ja) 1995-02-10
DE69400463T2 (de) 1997-03-27
EP0625590A1 (de) 1994-11-23
ES2091668T3 (es) 1996-11-01
US5316867A (en) 1994-05-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee