DE69404002D1 - Goldpaste für keramische Leiterplatte. - Google Patents
Goldpaste für keramische Leiterplatte.Info
- Publication number
- DE69404002D1 DE69404002D1 DE69404002T DE69404002T DE69404002D1 DE 69404002 D1 DE69404002 D1 DE 69404002D1 DE 69404002 T DE69404002 T DE 69404002T DE 69404002 T DE69404002 T DE 69404002T DE 69404002 D1 DE69404002 D1 DE 69404002D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- ceramic circuit
- gold paste
- paste
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2804—Next to metal
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9944093 | 1993-04-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69404002D1 true DE69404002D1 (de) | 1997-08-07 |
DE69404002T2 DE69404002T2 (de) | 1997-10-16 |
Family
ID=14247471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69404002T Expired - Fee Related DE69404002T2 (de) | 1993-04-26 | 1994-02-11 | Goldpaste für keramische Leiterplatte. |
Country Status (3)
Country | Link |
---|---|
US (3) | US5429670A (de) |
EP (1) | EP0625000B1 (de) |
DE (1) | DE69404002T2 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5765279A (en) * | 1995-05-22 | 1998-06-16 | Fujitsu Limited | Methods of manufacturing power supply distribution structures for multichip modules |
JP3165779B2 (ja) * | 1995-07-18 | 2001-05-14 | 株式会社トクヤマ | サブマウント |
US6830823B1 (en) | 1997-02-24 | 2004-12-14 | Superior Micropowders Llc | Gold powders, methods for producing powders and devices fabricated from same |
EP1007308B1 (de) * | 1997-02-24 | 2003-11-12 | Superior Micropowders LLC | Aerosolverfahren und -gerät, teilchenförmige produkte, und daraus hergestellte elektronische geräte |
US5915160A (en) * | 1998-02-17 | 1999-06-22 | Rockwell International | High strength gold wire for microelectronics miniaturization and method of making the same |
US20050097987A1 (en) * | 1998-02-24 | 2005-05-12 | Cabot Corporation | Coated copper-containing powders, methods and apparatus for producing such powders, and copper-containing devices fabricated from same |
JP2001007472A (ja) * | 1999-06-17 | 2001-01-12 | Sony Corp | 電子回路装置およびその製造方法 |
US6077766A (en) * | 1999-06-25 | 2000-06-20 | International Business Machines Corporation | Variable thickness pads on a substrate surface |
US6989108B2 (en) | 2001-08-30 | 2006-01-24 | Micron Technology, Inc. | Etchant gas composition |
US7083744B2 (en) * | 2003-01-24 | 2006-08-01 | E. I. Du Pont De Nemours And Company | Terminal electrode compositions for multilayer ceramic capacitors |
CN101341803A (zh) * | 2005-12-22 | 2009-01-07 | 皇家飞利浦电子股份有限公司 | 用于led基台的多孔电路材料 |
JP2007335241A (ja) * | 2006-06-15 | 2007-12-27 | Canon Inc | 配線基板、電子源、画像表示装置及び画像再生装置 |
US8362368B2 (en) * | 2009-04-27 | 2013-01-29 | Ultrasource, Inc. | Method and apparatus for an improved filled via |
EP3465189A1 (de) * | 2016-05-27 | 2019-04-10 | Carrier Corporation | Gasdetektionsvorrichtung und verfahren zur herstellung davon |
DE102021131618A1 (de) | 2021-12-01 | 2023-06-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Verfahren zum Überführen von Metalltintenschichten in elektrisch leitfähige Strukturen |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2525209A (en) * | 1947-07-03 | 1950-10-10 | Luther C Davis | Toilet case |
US3021233A (en) * | 1959-05-22 | 1962-02-13 | Honeywell Regulator Co | Method of applying an electrically conductive contact material and resulting coated article |
DE1646882B1 (de) * | 1965-07-29 | 1970-11-19 | Du Pont | Edelmetallmasse zum Aufbrennen auf keramische Traeger |
US3480566A (en) * | 1965-10-22 | 1969-11-25 | Du Pont | Low melting glass and compositions containing the same |
US3516949A (en) * | 1966-10-10 | 1970-06-23 | Du Pont | Copper/vanadium oxide compositions |
US3969570A (en) * | 1972-03-08 | 1976-07-13 | Smith Baynard R | Composition and method of bonding gold to a ceramic substrate and a bonded gold article |
US3960777A (en) * | 1975-06-23 | 1976-06-01 | E. I. Du Pont De Nemours And Company | Gold compositions |
US4004057A (en) * | 1975-06-23 | 1977-01-18 | E. I. Dupont De Nemours And Company | Gold conductor compositions |
FR2525209B1 (fr) * | 1982-04-16 | 1986-08-22 | Thomson Csf | Procede de realisation d'une couche composite metallique sur un substrat ceramique, et couche metallique obtenue par ce procede |
JPS62265796A (ja) * | 1986-05-14 | 1987-11-18 | 株式会社住友金属セラミックス | セラミツク多層配線基板およびその製造法 |
JPS63102103A (ja) * | 1986-10-17 | 1988-05-07 | 昭和電工株式会社 | 導電ペ−スト |
JPH0629232B2 (ja) * | 1987-04-03 | 1994-04-20 | 日本ポリウレタン工業株式会社 | 有機ジイソシアネートの異性体を分離する方法 |
JPH0298187A (ja) * | 1988-10-04 | 1990-04-10 | Nippon Chemicon Corp | 厚膜集積回路およびその製造方法 |
US5066620A (en) * | 1989-01-31 | 1991-11-19 | Asahi Glass Company Ltd. | Conductive paste compositions and ceramic substrates |
-
1994
- 1994-02-10 US US08/194,423 patent/US5429670A/en not_active Expired - Fee Related
- 1994-02-11 EP EP94102169A patent/EP0625000B1/de not_active Expired - Lifetime
- 1994-02-11 DE DE69404002T patent/DE69404002T2/de not_active Expired - Fee Related
-
1995
- 1995-02-10 US US08/386,823 patent/US5714241A/en not_active Expired - Fee Related
-
1997
- 1997-07-07 US US08/888,916 patent/US6090436A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5429670A (en) | 1995-07-04 |
EP0625000B1 (de) | 1997-07-02 |
DE69404002T2 (de) | 1997-10-16 |
EP0625000A1 (de) | 1994-11-17 |
US6090436A (en) | 2000-07-18 |
US5714241A (en) | 1998-02-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |