DE69409586T2 - Verpacken von Hochleistungshalbleiterlasern - Google Patents

Verpacken von Hochleistungshalbleiterlasern

Info

Publication number
DE69409586T2
DE69409586T2 DE69409586T DE69409586T DE69409586T2 DE 69409586 T2 DE69409586 T2 DE 69409586T2 DE 69409586 T DE69409586 T DE 69409586T DE 69409586 T DE69409586 T DE 69409586T DE 69409586 T2 DE69409586 T2 DE 69409586T2
Authority
DE
Germany
Prior art keywords
packaging
high power
power semiconductor
semiconductor lasers
lasers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69409586T
Other languages
English (en)
Other versions
DE69409586D1 (de
Inventor
Douglas Warren Hall
Julia Alyson Sharps
Paul Anthony Jakobson
Roger Frank Cornin Bartholomew
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/091,657 external-priority patent/US5392305A/en
Application filed by Corning Inc filed Critical Corning Inc
Application granted granted Critical
Publication of DE69409586D1 publication Critical patent/DE69409586D1/de
Publication of DE69409586T2 publication Critical patent/DE69409586T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/0014—Measuring characteristics or properties thereof
    • H01S5/0021—Degradation or life time measurements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H01S5/0287—Facet reflectivity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/0222—Gas-filled housings
    • H01S5/02224—Gas-filled housings the gas comprising oxygen, e.g. for avoiding contamination of the light emitting facets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02235—Getter material for absorbing contamination
DE69409586T 1993-07-14 1994-07-14 Verpacken von Hochleistungshalbleiterlasern Expired - Fee Related DE69409586T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/091,657 US5392305A (en) 1993-07-14 1993-07-14 Packaging of high power semiconductor lasers
US08/168,125 US5513198A (en) 1993-07-14 1993-12-17 Packaging of high power semiconductor lasers

Publications (2)

Publication Number Publication Date
DE69409586D1 DE69409586D1 (de) 1998-05-20
DE69409586T2 true DE69409586T2 (de) 1998-10-15

Family

ID=26784203

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69409586T Expired - Fee Related DE69409586T2 (de) 1993-07-14 1994-07-14 Verpacken von Hochleistungshalbleiterlasern

Country Status (9)

Country Link
US (3) US5513198A (de)
EP (1) EP0634822B1 (de)
JP (1) JP3452214B2 (de)
KR (1) KR100298149B1 (de)
CN (1) CN1063587C (de)
AU (1) AU672705B2 (de)
CA (1) CA2128068C (de)
DE (1) DE69409586T2 (de)
TW (1) TW291471B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022102087A1 (de) 2022-01-28 2023-08-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Laserpackage und verfahren zur herstellung eines laserpackage

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US9498846B2 (en) 2010-03-29 2016-11-22 The Aerospace Corporation Systems and methods for preventing or reducing contamination enhanced laser induced damage (C-LID) to optical components using gas phase additives
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US9859680B2 (en) 2013-12-17 2018-01-02 Lasermax, Inc. Shock resistant laser module
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JP6624899B2 (ja) * 2015-11-18 2019-12-25 住友電気工業株式会社 光モジュール及び光モジュールの製造方法
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US11119116B2 (en) 2019-04-01 2021-09-14 Honeywell International Inc. Accelerometer for determining an acceleration based on modulated optical signals
US10956768B2 (en) 2019-04-22 2021-03-23 Honeywell International Inc. Feedback cooling and detection for optomechanical devices
US10705112B1 (en) 2019-04-22 2020-07-07 Honeywell International Inc. Noise rejection for optomechanical devices
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022102087A1 (de) 2022-01-28 2023-08-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Laserpackage und verfahren zur herstellung eines laserpackage

Also Published As

Publication number Publication date
US5770473A (en) 1998-06-23
US5513198A (en) 1996-04-30
KR960016028A (ko) 1996-05-22
JP3452214B2 (ja) 2003-09-29
CN1103373A (zh) 1995-06-07
AU672705B2 (en) 1996-10-10
TW291471B (de) 1996-11-21
KR100298149B1 (ko) 2001-10-24
US5629952A (en) 1997-05-13
CA2128068C (en) 1998-12-15
AU6744094A (en) 1995-01-27
CN1063587C (zh) 2001-03-21
EP0634822A1 (de) 1995-01-18
DE69409586D1 (de) 1998-05-20
EP0634822B1 (de) 1998-04-15
JPH07147457A (ja) 1995-06-06
CA2128068A1 (en) 1995-01-15

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8339 Ceased/non-payment of the annual fee