DE69414480D1 - Methode zum Polieren einer Kupferoberfläche oder einer Legierung mit Kupfer als Hauptbestandteil - Google Patents
Methode zum Polieren einer Kupferoberfläche oder einer Legierung mit Kupfer als HauptbestandteilInfo
- Publication number
- DE69414480D1 DE69414480D1 DE69414480T DE69414480T DE69414480D1 DE 69414480 D1 DE69414480 D1 DE 69414480D1 DE 69414480 T DE69414480 T DE 69414480T DE 69414480 T DE69414480 T DE 69414480T DE 69414480 D1 DE69414480 D1 DE 69414480D1
- Authority
- DE
- Germany
- Prior art keywords
- copper
- polishing
- alloy
- main component
- copper surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Magnetic Heads (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE9300716A BE1007281A3 (nl) | 1993-07-12 | 1993-07-12 | Werkwijze voor het polijsten van een oppervlak van koper of een in hoofdzaak koper bevattende legering, magneetkop vervaardigbaar met gebruikmaking van de werkwijze, röntgenstralingcollimerend element en röntgenstralingreflecterend element, beide voorzien van een volgens de werkwijze gepolijst oppervlak en polijstmiddel geschikt voor toepassing in de werkwijze. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69414480D1 true DE69414480D1 (de) | 1998-12-17 |
DE69414480T2 DE69414480T2 (de) | 1999-06-02 |
Family
ID=3887173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69414480T Expired - Fee Related DE69414480T2 (de) | 1993-07-12 | 1994-07-07 | Methode zum Polieren einer Kupferoberfläche oder einer Legierung mit Kupfer als Hauptbestandteil |
Country Status (10)
Country | Link |
---|---|
US (1) | US5622525A (de) |
EP (1) | EP0634465B1 (de) |
JP (1) | JPH0775943A (de) |
BE (1) | BE1007281A3 (de) |
DE (1) | DE69414480T2 (de) |
HK (1) | HK1013093A1 (de) |
HU (1) | HU217664B (de) |
MY (1) | MY111523A (de) |
SG (1) | SG48408A1 (de) |
TW (1) | TW346503B (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3507628B2 (ja) * | 1996-08-06 | 2004-03-15 | 昭和電工株式会社 | 化学的機械研磨用研磨組成物 |
US8092707B2 (en) | 1997-04-30 | 2012-01-10 | 3M Innovative Properties Company | Compositions and methods for modifying a surface suited for semiconductor fabrication |
US20060147369A1 (en) * | 1997-07-21 | 2006-07-06 | Neophotonics Corporation | Nanoparticle production and corresponding structures |
US20090255189A1 (en) * | 1998-08-19 | 2009-10-15 | Nanogram Corporation | Aluminum oxide particles |
US20090075083A1 (en) * | 1997-07-21 | 2009-03-19 | Nanogram Corporation | Nanoparticle production and corresponding structures |
JP3366256B2 (ja) * | 1998-07-02 | 2003-01-14 | アルプス電気株式会社 | 薄膜磁気ヘッド及びその製造方法 |
FR2781922B1 (fr) * | 1998-07-31 | 2001-11-23 | Clariant France Sa | Procede de polissage mecano-chimique d'une couche en un materiau a base de cuivre |
US6206756B1 (en) | 1998-11-10 | 2001-03-27 | Micron Technology, Inc. | Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad |
US6276996B1 (en) | 1998-11-10 | 2001-08-21 | Micron Technology, Inc. | Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad |
US6589872B1 (en) | 1999-05-03 | 2003-07-08 | Taiwan Semiconductor Manufacturing Company | Use of low-high slurry flow to eliminate copper line damages |
US6375693B1 (en) | 1999-05-07 | 2002-04-23 | International Business Machines Corporation | Chemical-mechanical planarization of barriers or liners for copper metallurgy |
JP2000338299A (ja) * | 1999-05-28 | 2000-12-08 | Mitsubishi Electric Corp | X線露光装置、x線露光方法、x線マスク、x線ミラー、シンクロトロン放射装置、シンクロトロン放射方法および半導体装置 |
US6179691B1 (en) * | 1999-08-06 | 2001-01-30 | Taiwan Semiconductor Manufacturing Company | Method for endpoint detection for copper CMP |
JP3492953B2 (ja) * | 1999-10-05 | 2004-02-03 | Tdk株式会社 | 薄膜磁気ヘッドの製造方法 |
US6527817B1 (en) | 1999-11-15 | 2003-03-04 | Cabot Microelectronics Corporation | Composition and method for planarizing surfaces |
US6293848B1 (en) * | 1999-11-15 | 2001-09-25 | Cabot Microelectronics Corporation | Composition and method for planarizing surfaces |
US6319096B1 (en) | 1999-11-15 | 2001-11-20 | Cabot Corporation | Composition and method for planarizing surfaces |
JP3499490B2 (ja) * | 2000-02-16 | 2004-02-23 | Tdk株式会社 | 薄膜磁気ヘッドの製造方法 |
JP2002093684A (ja) | 2000-09-18 | 2002-03-29 | Canon Inc | X線露光装置、x線露光方法、半導体製造装置および微細構造体 |
DE10060343A1 (de) * | 2000-12-04 | 2002-06-06 | Bayer Ag | Polierslurry für das chemisch-mechanische Polieren von Metall- und Dielektrikastrukturen |
US6589100B2 (en) | 2001-09-24 | 2003-07-08 | Cabot Microelectronics Corporation | Rare earth salt/oxidizer-based CMP method |
US7087529B2 (en) * | 2003-10-02 | 2006-08-08 | Amcol International Corporation | Chemical-mechanical polishing (CMP) slurry and method of planarizing surfaces |
US7223156B2 (en) * | 2003-11-14 | 2007-05-29 | Amcol International Corporation | Method chemical-mechanical polishing and planarizing corundum, GaAs, GaP and GaAs/GaP alloy surfaces |
EP1758962B1 (de) * | 2004-06-22 | 2013-10-30 | Asahi Glass Company, Limited | Polierverfahren für glassubstrat sowie glassubstrat |
JP5897597B2 (ja) | 2010-12-08 | 2016-03-30 | ギャリオン インターナショナル コーポレイション | 硬質で低摩擦の金属窒化物被膜を形成する方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1441504A (fr) * | 1965-01-22 | 1966-06-10 | Monsanto Co | Procédé de polissage |
US3485608A (en) * | 1968-01-02 | 1969-12-23 | Texas Instruments Inc | Slurry for polishing silicon slices |
US3662500A (en) * | 1971-01-28 | 1972-05-16 | Ibm | Method for polishing magnetic oxide materials |
US4057939A (en) * | 1975-12-05 | 1977-11-15 | International Business Machines Corporation | Silicon wafer polishing |
US4358295A (en) * | 1980-03-27 | 1982-11-09 | Matsushita Electric Industrial Co., Ltd. | Polishing method |
JPS61136909A (ja) * | 1984-12-04 | 1986-06-24 | Mitsubishi Chem Ind Ltd | 無水ケイ酸の水分散液組成物 |
EP0348757B1 (de) * | 1988-06-28 | 1995-01-04 | Mitsubishi Materials Silicon Corporation | Verfahren zur Polierung eines Halbleiter-Plättchens |
US5352277A (en) * | 1988-12-12 | 1994-10-04 | E. I. Du Pont De Nemours & Company | Final polishing composition |
US5230833A (en) * | 1989-06-09 | 1993-07-27 | Nalco Chemical Company | Low sodium, low metals silica polishing slurries |
US4959113C1 (en) * | 1989-07-31 | 2001-03-13 | Rodel Inc | Method and composition for polishing metal surfaces |
-
1993
- 1993-07-12 BE BE9300716A patent/BE1007281A3/nl not_active IP Right Cessation
-
1994
- 1994-03-15 TW TW083102218A patent/TW346503B/zh active
- 1994-03-16 US US08/213,768 patent/US5622525A/en not_active Expired - Fee Related
- 1994-06-23 MY MYPI94001627A patent/MY111523A/en unknown
- 1994-07-06 HU HU9402034A patent/HU217664B/hu not_active IP Right Cessation
- 1994-07-07 DE DE69414480T patent/DE69414480T2/de not_active Expired - Fee Related
- 1994-07-07 EP EP94201956A patent/EP0634465B1/de not_active Expired - Lifetime
- 1994-07-07 SG SG1996009454A patent/SG48408A1/en unknown
- 1994-07-11 JP JP6158638A patent/JPH0775943A/ja active Pending
-
1998
- 1998-12-19 HK HK98114093A patent/HK1013093A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE69414480T2 (de) | 1999-06-02 |
MY111523A (en) | 2000-07-31 |
HU217664B (hu) | 2000-03-28 |
HU9402034D0 (en) | 1994-09-28 |
EP0634465B1 (de) | 1998-11-11 |
HUT71054A (en) | 1995-11-28 |
SG48408A1 (en) | 1998-04-17 |
EP0634465A1 (de) | 1995-01-18 |
TW346503B (en) | 1998-12-01 |
JPH0775943A (ja) | 1995-03-20 |
US5622525A (en) | 1997-04-22 |
BE1007281A3 (nl) | 1995-05-09 |
HK1013093A1 (en) | 1999-08-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: ONSTREAM, INC., LONGMONT, COL., US |
|
8328 | Change in the person/name/address of the agent |
Free format text: HOFFMANN * EITLE, 81925 MUENCHEN |
|
8339 | Ceased/non-payment of the annual fee |