DE69414480D1 - Methode zum Polieren einer Kupferoberfläche oder einer Legierung mit Kupfer als Hauptbestandteil - Google Patents

Methode zum Polieren einer Kupferoberfläche oder einer Legierung mit Kupfer als Hauptbestandteil

Info

Publication number
DE69414480D1
DE69414480D1 DE69414480T DE69414480T DE69414480D1 DE 69414480 D1 DE69414480 D1 DE 69414480D1 DE 69414480 T DE69414480 T DE 69414480T DE 69414480 T DE69414480 T DE 69414480T DE 69414480 D1 DE69414480 D1 DE 69414480D1
Authority
DE
Germany
Prior art keywords
copper
polishing
alloy
main component
copper surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69414480T
Other languages
English (en)
Other versions
DE69414480T2 (de
Inventor
Jan Haisma
Haas Peter Wilhelmus De
Boer Dirk Kornelis Gerhardu De
Den Hoogenhof Walterus Wil Van
Lambertus Postma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Onstream Inc Longmont Col Us
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Application granted granted Critical
Publication of DE69414480D1 publication Critical patent/DE69414480D1/de
Publication of DE69414480T2 publication Critical patent/DE69414480T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
DE69414480T 1993-07-12 1994-07-07 Methode zum Polieren einer Kupferoberfläche oder einer Legierung mit Kupfer als Hauptbestandteil Expired - Fee Related DE69414480T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
BE9300716A BE1007281A3 (nl) 1993-07-12 1993-07-12 Werkwijze voor het polijsten van een oppervlak van koper of een in hoofdzaak koper bevattende legering, magneetkop vervaardigbaar met gebruikmaking van de werkwijze, röntgenstralingcollimerend element en röntgenstralingreflecterend element, beide voorzien van een volgens de werkwijze gepolijst oppervlak en polijstmiddel geschikt voor toepassing in de werkwijze.

Publications (2)

Publication Number Publication Date
DE69414480D1 true DE69414480D1 (de) 1998-12-17
DE69414480T2 DE69414480T2 (de) 1999-06-02

Family

ID=3887173

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69414480T Expired - Fee Related DE69414480T2 (de) 1993-07-12 1994-07-07 Methode zum Polieren einer Kupferoberfläche oder einer Legierung mit Kupfer als Hauptbestandteil

Country Status (10)

Country Link
US (1) US5622525A (de)
EP (1) EP0634465B1 (de)
JP (1) JPH0775943A (de)
BE (1) BE1007281A3 (de)
DE (1) DE69414480T2 (de)
HK (1) HK1013093A1 (de)
HU (1) HU217664B (de)
MY (1) MY111523A (de)
SG (1) SG48408A1 (de)
TW (1) TW346503B (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3507628B2 (ja) * 1996-08-06 2004-03-15 昭和電工株式会社 化学的機械研磨用研磨組成物
US8092707B2 (en) 1997-04-30 2012-01-10 3M Innovative Properties Company Compositions and methods for modifying a surface suited for semiconductor fabrication
US20090255189A1 (en) * 1998-08-19 2009-10-15 Nanogram Corporation Aluminum oxide particles
US20090075083A1 (en) * 1997-07-21 2009-03-19 Nanogram Corporation Nanoparticle production and corresponding structures
US20060147369A1 (en) * 1997-07-21 2006-07-06 Neophotonics Corporation Nanoparticle production and corresponding structures
JP3366256B2 (ja) * 1998-07-02 2003-01-14 アルプス電気株式会社 薄膜磁気ヘッド及びその製造方法
FR2781922B1 (fr) * 1998-07-31 2001-11-23 Clariant France Sa Procede de polissage mecano-chimique d'une couche en un materiau a base de cuivre
US6276996B1 (en) 1998-11-10 2001-08-21 Micron Technology, Inc. Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
US6206756B1 (en) 1998-11-10 2001-03-27 Micron Technology, Inc. Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
US6589872B1 (en) 1999-05-03 2003-07-08 Taiwan Semiconductor Manufacturing Company Use of low-high slurry flow to eliminate copper line damages
US6375693B1 (en) 1999-05-07 2002-04-23 International Business Machines Corporation Chemical-mechanical planarization of barriers or liners for copper metallurgy
JP2000338299A (ja) * 1999-05-28 2000-12-08 Mitsubishi Electric Corp Ｘ線露光装置、ｘ線露光方法、ｘ線マスク、ｘ線ミラー、シンクロトロン放射装置、シンクロトロン放射方法および半導体装置
US6179691B1 (en) * 1999-08-06 2001-01-30 Taiwan Semiconductor Manufacturing Company Method for endpoint detection for copper CMP
JP3492953B2 (ja) * 1999-10-05 2004-02-03 Ｔｄｋ株式会社 薄膜磁気ヘッドの製造方法
US6527817B1 (en) 1999-11-15 2003-03-04 Cabot Microelectronics Corporation Composition and method for planarizing surfaces
US6293848B1 (en) * 1999-11-15 2001-09-25 Cabot Microelectronics Corporation Composition and method for planarizing surfaces
US6319096B1 (en) 1999-11-15 2001-11-20 Cabot Corporation Composition and method for planarizing surfaces
JP3499490B2 (ja) * 2000-02-16 2004-02-23 Ｔｄｋ株式会社 薄膜磁気ヘッドの製造方法
JP2002093684A (ja) 2000-09-18 2002-03-29 Canon Inc Ｘ線露光装置、ｘ線露光方法、半導体製造装置および微細構造体
DE10060343A1 (de) * 2000-12-04 2002-06-06 Bayer Ag Polierslurry für das chemisch-mechanische Polieren von Metall- und Dielektrikastrukturen
US6589100B2 (en) 2001-09-24 2003-07-08 Cabot Microelectronics Corporation Rare earth salt/oxidizer-based CMP method
US7087529B2 (en) * 2003-10-02 2006-08-08 Amcol International Corporation Chemical-mechanical polishing (CMP) slurry and method of planarizing surfaces
US7223156B2 (en) * 2003-11-14 2007-05-29 Amcol International Corporation Method chemical-mechanical polishing and planarizing corundum, GaAs, GaP and GaAs/GaP alloy surfaces
WO2005123857A1 (en) * 2004-06-22 2005-12-29 Asahi Glass Company, Limited Polishing method for glass substrate, and glass substrate
KR101807341B1 (ko) 2010-12-08 2017-12-08 갈레온 인터내셔널 코퍼레이션 마찰 저항이 작은 경질의 질화물 코팅

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1441504A (fr) * 1965-01-22 1966-06-10 Monsanto Co Procédé de polissage
US3485608A (en) * 1968-01-02 1969-12-23 Texas Instruments Inc Slurry for polishing silicon slices
US3662500A (en) * 1971-01-28 1972-05-16 Ibm Method for polishing magnetic oxide materials
US4057939A (en) * 1975-12-05 1977-11-15 International Business Machines Corporation Silicon wafer polishing
US4358295A (en) * 1980-03-27 1982-11-09 Matsushita Electric Industrial Co., Ltd. Polishing method
JPS61136909A (ja) * 1984-12-04 1986-06-24 Mitsubishi Chem Ind Ltd 無水ケイ酸の水分散液組成物
EP0348757B1 (de) * 1988-06-28 1995-01-04 Mitsubishi Materials Silicon Corporation Verfahren zur Polierung eines Halbleiter-Plättchens
US5352277A (en) * 1988-12-12 1994-10-04 E. I. Du Pont De Nemours & Company Final polishing composition
US5230833A (en) * 1989-06-09 1993-07-27 Nalco Chemical Company Low sodium, low metals silica polishing slurries
US4959113C1 (en) * 1989-07-31 2001-03-13 Rodel Inc Method and composition for polishing metal surfaces

Also Published As

Publication number Publication date
BE1007281A3 (nl) 1995-05-09
EP0634465B1 (de) 1998-11-11
EP0634465A1 (de) 1995-01-18
HU9402034D0 (en) 1994-09-28
DE69414480T2 (de) 1999-06-02
JPH0775943A (ja) 1995-03-20
TW346503B (en) 1998-12-01
HU217664B (hu) 2000-03-28
MY111523A (en) 2000-07-31
US5622525A (en) 1997-04-22
SG48408A1 (en) 1998-04-17
HK1013093A1 (en) 1999-08-13
HUT71054A (en) 1995-11-28

Similar Documents

Publication Publication Date Title
DE69414480T2 (de) Methode zum Polieren einer Kupferoberfläche oder einer Legierung mit Kupfer als Hauptbestandteil
GB2295632B (en) Well cleaning tool with scratching elements
BR9407775A (pt) Método de tratamento de uma superfície metálica
GB2262339B (en) Method of inspecting the surface of a workpiece
DE69510630D1 (de) Leiterrahmen mit einem induktor oder einer ähnlichen magnetischen komponente
GB8417540D0 (en) Substrate having fluoropolymer coating
BR9405469A (pt) Método de fabricação de fecho de superfície
DE69709080D1 (de) Gläsernes schleifwerkzeug mit metallüberzogenem schleifmittel
DE69423641D1 (de) Reflexionsvermindernde oberflächenbeschichtungen
DE69426174T2 (de) Verfahren zum Polieren einer Edelmetalloberfläche oder einer Legierung mit Edelmetall als Hauptbestandteil
BR8907320A (pt) Protecao de superficies metalicas
IT1273630B (it) Metodo di scandire la superficie di un oggetto
GB8403162D0 (en) Treating underwater surface
AU5276490A (en) Procedure for containment of floating, polluting oil or similar contaminant on the sea surface
DE69306981D1 (de) Laminierte Metalldichtung mit Verformungsverhinderungsmechanismus
DE59905547D1 (de) Verfahren zum Unschädlichmachen von beim Beschichten mit einer Schutzschicht entstehenden Verengungen in den Kühllöchern von gasgekühlten Teilen
ATA119493A (de) Metallgebundenes abrasivwerkzeug mit füllstoff
SG52489A1 (en) Process for electroplating nonconductive surface
DE69215524D1 (de) Elektrolytische badlösung und verfahren zur erhöhung des oberflächlichen verschleisswiderstandes von werkzeugen
ZA937809B (en) Underwater surface cleaning apparatus
DE9311064U1 (de) Flächenbauelement
DE29503068U1 (de) Ausstattungsteil oder Griffteil mit Verkleidungselement
GB9317451D0 (en) Moving underwater sediment
KR950013396U (ko) 수중안경
DE9310549U1 (de) Harzverguetete phosphatierte metalloberflaeche

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ONSTREAM, INC., LONGMONT, COL., US

8328 Change in the person/name/address of the agent

Free format text: HOFFMANN * EITLE, 81925 MUENCHEN

8339 Ceased/non-payment of the annual fee