DE69416550D1 - Elektronisches Vielschichtbauteil, Verfahren zu seiner Herstellung und Verfahren zur Messung seiner Charakteristiken - Google Patents

Elektronisches Vielschichtbauteil, Verfahren zu seiner Herstellung und Verfahren zur Messung seiner Charakteristiken

Info

Publication number
DE69416550D1
DE69416550D1 DE69416550T DE69416550T DE69416550D1 DE 69416550 D1 DE69416550 D1 DE 69416550D1 DE 69416550 T DE69416550 T DE 69416550T DE 69416550 T DE69416550 T DE 69416550T DE 69416550 D1 DE69416550 D1 DE 69416550D1
Authority
DE
Germany
Prior art keywords
measuring
production
multilayer component
electronic multilayer
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69416550T
Other languages
English (en)
Other versions
DE69416550T2 (de
Inventor
Norio Sakai
Kenji Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of DE69416550D1 publication Critical patent/DE69416550D1/de
Application granted granted Critical
Publication of DE69416550T2 publication Critical patent/DE69416550T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE69416550T 1993-08-05 1994-08-02 Elektronisches Vielschichtbauteil, Verfahren zu seiner Herstellung und Verfahren zur Messung seiner Charakteristiken Expired - Lifetime DE69416550T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5194863A JP2870371B2 (ja) 1993-08-05 1993-08-05 積層電子部品、その製造方法およびその特性測定方法

Publications (2)

Publication Number Publication Date
DE69416550D1 true DE69416550D1 (de) 1999-03-25
DE69416550T2 DE69416550T2 (de) 1999-07-01

Family

ID=16331554

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69416550T Expired - Lifetime DE69416550T2 (de) 1993-08-05 1994-08-02 Elektronisches Vielschichtbauteil, Verfahren zu seiner Herstellung und Verfahren zur Messung seiner Charakteristiken

Country Status (4)

Country Link
US (1) US5493769A (de)
EP (1) EP0637828B1 (de)
JP (1) JP2870371B2 (de)
DE (1) DE69416550T2 (de)

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US5587111A (en) * 1990-03-29 1996-12-24 Vacuum Metallurgical Co., Ltd. Metal paste, process for producing same and method of making a metallic thin film using the metal paste
US5703544A (en) * 1996-03-13 1997-12-30 Ericsson Inc. RF printed circuit module and method of making same
US5880011A (en) * 1996-06-19 1999-03-09 Pacific Trinetics Corporation Method and apparatus for manufacturing pre-terminated chips
DE69833193T2 (de) * 1997-08-05 2006-09-21 Koninklijke Philips Electronics N.V. Verfahren zur herstellung mehrerer elektronischer bauteile
JP3805146B2 (ja) * 1998-12-09 2006-08-02 太陽誘電株式会社 積層セラミックコンデンサの回路基板実装方法及び回路基板
JP3452028B2 (ja) 2000-05-09 2003-09-29 株式会社村田製作所 チップインダクタ及びその製造方法
JP4138211B2 (ja) * 2000-07-06 2008-08-27 株式会社村田製作所 電子部品およびその製造方法、集合電子部品、電子部品の実装構造、ならびに電子装置
US6760227B2 (en) 2000-11-02 2004-07-06 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component and manufacturing method thereof
JP2002141248A (ja) 2000-11-02 2002-05-17 Murata Mfg Co Ltd セラミック電子部品およびその製造方法
EP1610599A1 (de) * 2003-03-28 2005-12-28 TDK Corporation Mehrschichtsubstrat und verfahren zu seiner herstellung
US7612443B1 (en) 2003-09-04 2009-11-03 University Of Notre Dame Du Lac Inter-chip communication
JP2005276855A (ja) * 2004-03-22 2005-10-06 New Japan Radio Co Ltd 半導体装置の製造方法
US7135415B2 (en) * 2004-07-23 2006-11-14 Inpaq Technology Co., Ltd. Insulated structure of a chip array component and fabrication method of the same
KR100905862B1 (ko) 2007-02-26 2009-07-02 삼성전기주식회사 집적된 적층형 칩 커패시터 모듈 및 이를 구비하는 집적회로 장치
US20090126857A1 (en) * 2007-11-15 2009-05-21 Shin Hyun-Ok Manufacturing method of low temperature co-fired ceramics substrate
KR100992233B1 (ko) * 2008-09-26 2010-11-05 삼성전기주식회사 세라믹/폴리머 복합재를 이용한 칩 캐패시터 제조방법
US8797279B2 (en) 2010-05-25 2014-08-05 MCube Inc. Analog touchscreen methods and apparatus
US8486723B1 (en) 2010-08-19 2013-07-16 MCube Inc. Three axis magnetic sensor device and method
US8928602B1 (en) 2009-03-03 2015-01-06 MCube Inc. Methods and apparatus for object tracking on a hand-held device
US8477473B1 (en) 2010-08-19 2013-07-02 MCube Inc. Transducer structure and method for MEMS devices
US8823007B2 (en) 2009-10-28 2014-09-02 MCube Inc. Integrated system on chip using multiple MEMS and CMOS devices
US8710597B1 (en) 2010-04-21 2014-04-29 MCube Inc. Method and structure for adding mass with stress isolation to MEMS structures
US8421082B1 (en) 2010-01-19 2013-04-16 Mcube, Inc. Integrated CMOS and MEMS with air dielectric method and system
US8395252B1 (en) 2009-11-13 2013-03-12 MCube Inc. Integrated MEMS and CMOS package and method
US8553389B1 (en) 2010-08-19 2013-10-08 MCube Inc. Anchor design and method for MEMS transducer apparatuses
US8476129B1 (en) 2010-05-24 2013-07-02 MCube Inc. Method and structure of sensors and MEMS devices using vertical mounting with interconnections
KR101498098B1 (ko) * 2009-07-01 2015-03-03 케메트 일렉트로닉스 코포레이션 고전압 성능을 가지는 고캐패시턴스 다층레이어
US9709509B1 (en) 2009-11-13 2017-07-18 MCube Inc. System configured for integrated communication, MEMS, Processor, and applications using a foundry compatible semiconductor process
US8637943B1 (en) 2010-01-04 2014-01-28 MCube Inc. Multi-axis integrated MEMS devices with CMOS circuits and method therefor
US8794065B1 (en) 2010-02-27 2014-08-05 MCube Inc. Integrated inertial sensing apparatus using MEMS and quartz configured on crystallographic planes
US8936959B1 (en) 2010-02-27 2015-01-20 MCube Inc. Integrated rf MEMS, control systems and methods
US8367522B1 (en) 2010-04-08 2013-02-05 MCube Inc. Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads
US8928696B1 (en) 2010-05-25 2015-01-06 MCube Inc. Methods and apparatus for operating hysteresis on a hand held device
US8869616B1 (en) 2010-06-18 2014-10-28 MCube Inc. Method and structure of an inertial sensor using tilt conversion
US8652961B1 (en) 2010-06-18 2014-02-18 MCube Inc. Methods and structure for adapting MEMS structures to form electrical interconnections for integrated circuits
US8993362B1 (en) 2010-07-23 2015-03-31 MCube Inc. Oxide retainer method for MEMS devices
JP5668370B2 (ja) * 2010-08-27 2015-02-12 Tdk株式会社 セラミック電子部品、及びその製造方法
US8723986B1 (en) 2010-11-04 2014-05-13 MCube Inc. Methods and apparatus for initiating image capture on a hand-held device
US8969101B1 (en) 2011-08-17 2015-03-03 MCube Inc. Three axis magnetic sensor device and method using flex cables
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
US9620473B1 (en) 2013-01-18 2017-04-11 University Of Notre Dame Du Lac Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment

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US4821007A (en) * 1987-02-06 1989-04-11 Tektronix, Inc. Strip line circuit component and method of manufacture
JPS63265404A (ja) * 1987-04-22 1988-11-01 Murata Mfg Co Ltd 抵抗ブロツクの製造方法
JPH03225904A (ja) * 1990-01-31 1991-10-04 Taiyo Yuden Co Ltd 積層チップへの導電ペースト塗布方法
US5140745A (en) * 1990-07-23 1992-08-25 Mckenzie Jr Joseph A Method for forming traces on side edges of printed circuit boards and devices formed thereby
EP0516866A1 (de) * 1991-05-03 1992-12-09 International Business Machines Corporation Modulare mehrschichtige Verbindungsstruktur
JP3018645B2 (ja) * 1991-10-03 2000-03-13 株式会社村田製作所 チップ部品の製造方法
EP0582881B1 (de) * 1992-07-27 1997-12-29 Murata Manufacturing Co., Ltd. Elektronisches Vielschichtbauteil, Verfahren zur dessen Herstellung und Verfahren zur Messung seiner Charakteristiken

Also Published As

Publication number Publication date
JP2870371B2 (ja) 1999-03-17
EP0637828A3 (de) 1997-05-14
US5493769A (en) 1996-02-27
EP0637828B1 (de) 1999-02-17
DE69416550T2 (de) 1999-07-01
EP0637828A2 (de) 1995-02-08
JPH0750488A (ja) 1995-02-21

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