DE69419479D1 - Verfahren zum Schleifen von Halbleiterwafern und Gerät dafür - Google Patents

Verfahren zum Schleifen von Halbleiterwafern und Gerät dafür

Info

Publication number
DE69419479D1
DE69419479D1 DE69419479T DE69419479T DE69419479D1 DE 69419479 D1 DE69419479 D1 DE 69419479D1 DE 69419479 T DE69419479 T DE 69419479T DE 69419479 T DE69419479 T DE 69419479T DE 69419479 D1 DE69419479 D1 DE 69419479D1
Authority
DE
Germany
Prior art keywords
semiconductor wafers
device therefor
grinding semiconductor
grinding
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69419479T
Other languages
English (en)
Other versions
DE69419479T2 (de
Inventor
Kouichi Tanaka
Hiromasa Hashimoto
Fumio Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP28439393A external-priority patent/JP2891068B2/ja
Priority claimed from JP29133093A external-priority patent/JP2757112B2/ja
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Application granted granted Critical
Publication of DE69419479D1 publication Critical patent/DE69419479D1/de
Publication of DE69419479T2 publication Critical patent/DE69419479T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
DE69419479T 1993-10-18 1994-08-31 Verfahren zum Schleifen von Halbleiterwafern und Gerät dafür Expired - Fee Related DE69419479T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28439393A JP2891068B2 (ja) 1993-10-18 1993-10-18 ウエーハの研磨方法および研磨装置
JP29133093A JP2757112B2 (ja) 1993-10-27 1993-10-27 ウエーハ研磨装置

Publications (2)

Publication Number Publication Date
DE69419479D1 true DE69419479D1 (de) 1999-08-19
DE69419479T2 DE69419479T2 (de) 2000-04-27

Family

ID=26555451

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69419479T Expired - Fee Related DE69419479T2 (de) 1993-10-18 1994-08-31 Verfahren zum Schleifen von Halbleiterwafern und Gerät dafür

Country Status (3)

Country Link
US (1) US5584746A (de)
EP (1) EP0653270B1 (de)
DE (1) DE69419479T2 (de)

Families Citing this family (111)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5643053A (en) * 1993-12-27 1997-07-01 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved polishing control
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
GB9512262D0 (en) 1995-06-16 1995-08-16 Bingham Richard G Tool for computer-controlled machine for optical polishing and figuring
GB2317131B (en) * 1995-06-16 1999-12-22 Optical Generics Ltd Method and apparatus for optical polishing
JPH09225819A (ja) * 1996-02-21 1997-09-02 Shin Etsu Handotai Co Ltd 被加工物の保持機構
US5876273A (en) * 1996-04-01 1999-03-02 Kabushiki Kaisha Toshiba Apparatus for polishing a wafer
JP3183388B2 (ja) * 1996-07-12 2001-07-09 株式会社東京精密 半導体ウェーハ研磨装置
US6036587A (en) * 1996-10-10 2000-03-14 Applied Materials, Inc. Carrier head with layer of conformable material for a chemical mechanical polishing system
US5830806A (en) * 1996-10-18 1998-11-03 Micron Technology, Inc. Wafer backing member for mechanical and chemical-mechanical planarization of substrates
US6146259A (en) 1996-11-08 2000-11-14 Applied Materials, Inc. Carrier head with local pressure control for a chemical mechanical polishing apparatus
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US5941758A (en) * 1996-11-13 1999-08-24 Intel Corporation Method and apparatus for chemical-mechanical polishing
DE19651761A1 (de) * 1996-12-12 1998-06-18 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US6056632A (en) * 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US6048254A (en) * 1997-03-06 2000-04-11 Keltech Engineering Lapping apparatus and process with annular abrasive area
US6120352A (en) * 1997-03-06 2000-09-19 Keltech Engineering Lapping apparatus and lapping method using abrasive sheets
US6149506A (en) * 1998-10-07 2000-11-21 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
US5993298A (en) * 1997-03-06 1999-11-30 Keltech Engineering Lapping apparatus and process with controlled liquid flow across the lapping surface
US5967882A (en) * 1997-03-06 1999-10-19 Keltech Engineering Lapping apparatus and process with two opposed lapping platens
US5910041A (en) * 1997-03-06 1999-06-08 Keltech Engineering Lapping apparatus and process with raised edge on platen
KR100475845B1 (ko) * 1997-04-04 2005-06-17 도쿄 세이미츄 코퍼레이션 리미티드 연마장치
US6244946B1 (en) 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US6425812B1 (en) 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
US6398621B1 (en) 1997-05-23 2002-06-04 Applied Materials, Inc. Carrier head with a substrate sensor
US5957751A (en) * 1997-05-23 1999-09-28 Applied Materials, Inc. Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
US5964653A (en) 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US5916015A (en) * 1997-07-25 1999-06-29 Speedfam Corporation Wafer carrier for semiconductor wafer polishing machine
US5931719A (en) * 1997-08-25 1999-08-03 Lsi Logic Corporation Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing
US5888120A (en) * 1997-09-29 1999-03-30 Lsi Logic Corporation Method and apparatus for chemical mechanical polishing
US6033293A (en) * 1997-10-08 2000-03-07 Lucent Technologies Inc. Apparatus for performing chemical-mechanical polishing
JPH11226865A (ja) * 1997-12-11 1999-08-24 Speedfam Co Ltd キャリア及びｃｍｐ装置
US6068548A (en) * 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US6080050A (en) * 1997-12-31 2000-06-27 Applied Materials, Inc. Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
US6142857A (en) * 1998-01-06 2000-11-07 Speedfam-Ipec Corporation Wafer polishing with improved backing arrangement
US6531397B1 (en) 1998-01-09 2003-03-11 Lsi Logic Corporation Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
EP2221852B1 (de) * 1998-01-15 2012-05-09 Cornell Research Foundation, Inc. Grabenisolation für mikromechanische Bauelemente
US6102777A (en) * 1998-03-06 2000-08-15 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
US6030275A (en) * 1998-03-17 2000-02-29 International Business Machines Corporation Variable control of carrier curvature with direct feedback loop
JPH11285966A (ja) * 1998-04-02 1999-10-19 Speedfam-Ipec Co Ltd キャリア及びｃｍｐ装置
JP2000015572A (ja) * 1998-04-29 2000-01-18 Speedfam Co Ltd キャリア及び研磨装置
FR2778129B1 (fr) * 1998-05-04 2000-07-21 St Microelectronics Sa Disque support de membrane d'une machine de polissage et procede de fonctionnement d'une telle machine
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
US6143127A (en) * 1998-05-14 2000-11-07 Applied Materials, Inc. Carrier head with a retaining ring for a chemical mechanical polishing system
US6436228B1 (en) * 1998-05-15 2002-08-20 Applied Materials, Inc. Substrate retainer
US6174221B1 (en) * 1998-09-01 2001-01-16 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
US6422927B1 (en) 1998-12-30 2002-07-23 Applied Materials, Inc. Carrier head with controllable pressure and loading area for chemical mechanical polishing
US6402594B1 (en) * 1999-01-18 2002-06-11 Shin-Etsu Handotai Co., Ltd. Polishing method for wafer and holding plate
JP3623122B2 (ja) * 1999-02-12 2005-02-23 信越半導体株式会社 研磨用ワーク保持盤およびワークの研磨装置ならびにワークの研磨方法
JP4122103B2 (ja) * 1999-02-17 2008-07-23 不二越機械工業株式会社 ウェーハの研磨装置
US6491570B1 (en) 1999-02-25 2002-12-10 Applied Materials, Inc. Polishing media stabilizer
US6176764B1 (en) 1999-03-10 2001-01-23 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, simiconductor wafer polishing methods, and methods of forming polishing chucks
US6196899B1 (en) * 1999-06-21 2001-03-06 Micron Technology, Inc. Polishing apparatus
US6494774B1 (en) * 1999-07-09 2002-12-17 Applied Materials, Inc. Carrier head with pressure transfer mechanism
US6383056B1 (en) 1999-12-02 2002-05-07 Yin Ming Wang Plane constructed shaft system used in precision polishing and polishing apparatuses
US6386947B2 (en) 2000-02-29 2002-05-14 Applied Materials, Inc. Method and apparatus for detecting wafer slipouts
US6450868B1 (en) 2000-03-27 2002-09-17 Applied Materials, Inc. Carrier head with multi-part flexible membrane
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
US6447379B1 (en) 2000-03-31 2002-09-10 Speedfam-Ipec Corporation Carrier including a multi-volume diaphragm for polishing a semiconductor wafer and a method therefor
US7140956B1 (en) 2000-03-31 2006-11-28 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6336853B1 (en) 2000-03-31 2002-01-08 Speedfam-Ipec Corporation Carrier having pistons for distributing a pressing force on the back surface of a workpiece
US6390905B1 (en) 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
US6540592B1 (en) 2000-06-29 2003-04-01 Speedfam-Ipec Corporation Carrier head with reduced moment wear ring
US6722965B2 (en) 2000-07-11 2004-04-20 Applied Materials Inc. Carrier head with flexible membranes to provide controllable pressure and loading area
US6857945B1 (en) 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
US7198561B2 (en) 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
US6561884B1 (en) 2000-08-29 2003-05-13 Applied Materials, Inc. Web lift system for chemical mechanical planarization
US6527625B1 (en) * 2000-08-31 2003-03-04 Multi-Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a soft backed polishing head
TWI246448B (en) * 2000-08-31 2006-01-01 Multi Planar Technologies Inc Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby
US6540590B1 (en) 2000-08-31 2003-04-01 Multi-Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a rotating retaining ring
US7497767B2 (en) * 2000-09-08 2009-03-03 Applied Materials, Inc. Vibration damping during chemical mechanical polishing
US6676497B1 (en) * 2000-09-08 2004-01-13 Applied Materials Inc. Vibration damping in a chemical mechanical polishing system
US7255637B2 (en) * 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
US6848980B2 (en) 2001-10-10 2005-02-01 Applied Materials, Inc. Vibration damping in a carrier head
US6485359B1 (en) 2000-09-15 2002-11-26 Applied Materials, Inc. Platen arrangement for a chemical-mechanical planarization apparatus
US6592439B1 (en) 2000-11-10 2003-07-15 Applied Materials, Inc. Platen for retaining polishing material
US6447368B1 (en) 2000-11-20 2002-09-10 Speedfam-Ipec Corporation Carriers with concentric balloons supporting a diaphragm
US6468131B1 (en) 2000-11-28 2002-10-22 Speedfam-Ipec Corporation Method to mathematically characterize a multizone carrier
US6509270B1 (en) * 2001-03-30 2003-01-21 Cypress Semiconductor Corp. Method for polishing a semiconductor topography
US6582277B2 (en) 2001-05-01 2003-06-24 Speedfam-Ipec Corporation Method for controlling a process in a multi-zonal apparatus
US6761619B1 (en) 2001-07-10 2004-07-13 Cypress Semiconductor Corp. Method and system for spatial uniform polishing
US6503131B1 (en) 2001-08-16 2003-01-07 Applied Materials, Inc. Integrated platen assembly for a chemical mechanical planarization system
US6739958B2 (en) 2002-03-19 2004-05-25 Applied Materials Inc. Carrier head with a vibration reduction feature for a chemical mechanical polishing system
TWI274393B (en) * 2002-04-08 2007-02-21 Acm Res Inc Electropolishing and/or electroplating apparatus and methods
US7018268B2 (en) * 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
US6790123B2 (en) 2002-05-16 2004-09-14 Speedfam-Ipec Corporation Method for processing a work piece in a multi-zonal processing apparatus
US6866571B1 (en) 2002-05-21 2005-03-15 Cypress Semiconductor Corp. Boltless carrier ring/carrier plate attachment assembly
US7001245B2 (en) * 2003-03-07 2006-02-21 Applied Materials Inc. Substrate carrier with a textured membrane
US7055229B2 (en) * 2003-12-31 2006-06-06 Intel Corporation Support system for semiconductor wafers and methods thereof
US7255771B2 (en) 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
JP2006305713A (ja) * 2005-03-28 2006-11-09 Nikon Corp 吸着装置、研磨装置、半導体デバイス及び半導体デバイス製造方法
KR100898793B1 (ko) * 2005-12-29 2009-05-20 엘지디스플레이 주식회사 액정표시소자용 기판 합착 장치
US7364496B2 (en) * 2006-03-03 2008-04-29 Inopla Inc. Polishing head for polishing semiconductor wafers
JP5009101B2 (ja) * 2006-10-06 2012-08-22 株式会社荏原製作所 基板研磨装置
WO2009066351A1 (ja) * 2007-11-20 2009-05-28 Shin-Etsu Handotai Co., Ltd. 研磨ヘッド及び研磨装置
US8192248B2 (en) 2008-05-30 2012-06-05 Memc Electronic Materials, Inc. Semiconductor wafer polishing apparatus and method of polishing
KR101607099B1 (ko) * 2008-08-29 2016-03-29 신에쯔 한도타이 가부시키가이샤 연마 헤드 및 연마 장치
DE102009044305A1 (de) * 2009-10-21 2011-05-05 Fooke Gmbh Verfahren zum Halten und Bearbeiten eines Werkstückes mit Spannplatte, sowie Vorrichtung zum Aussteifen eines Werkstückes mit Spannplatte
US20120267423A1 (en) * 2011-04-19 2012-10-25 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and Apparatus for Thin Die Processing
TWI656944B (zh) * 2014-05-14 2019-04-21 日商荏原製作所股份有限公司 研磨裝置
JP6380333B2 (ja) * 2015-10-30 2018-08-29 株式会社Sumco ウェーハ研磨装置およびこれに用いる研磨ヘッド
US9873179B2 (en) * 2016-01-20 2018-01-23 Applied Materials, Inc. Carrier for small pad for chemical mechanical polishing
US9962805B2 (en) * 2016-04-22 2018-05-08 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing apparatus and method
US11602820B2 (en) 2018-03-06 2023-03-14 Ntt Advanced Technology Corporation Optical connector polishing jig
KR102607586B1 (ko) * 2018-11-05 2023-11-30 삼성디스플레이 주식회사 기판 지지 장치 및 이를 이용한 기판 연마 방법
JP7300297B2 (ja) * 2019-04-02 2023-06-29 株式会社荏原製作所 積層メンブレン、積層メンブレンを備える基板保持装置および基板処理装置
US11199562B2 (en) 2019-08-08 2021-12-14 Western Digital Technologies, Inc. Wafer testing system including a wafer-flattening multi-zone vacuum chuck and method for operating the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4508161A (en) * 1982-05-25 1985-04-02 Varian Associates, Inc. Method for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer
US4671145A (en) * 1983-12-23 1987-06-09 Basf Aktiengesellschaft Method and apparatus for the surface machining of substrate plates for magnetic memory plates
US4918869A (en) * 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
JPH079896B2 (ja) * 1988-10-06 1995-02-01 信越半導体株式会社 研磨装置
US5029418A (en) * 1990-03-05 1991-07-09 Eastman Kodak Company Sawing method for substrate cutting operations
US5036630A (en) * 1990-04-13 1991-08-06 International Business Machines Corporation Radial uniformity control of semiconductor wafer polishing
JPH0569310A (ja) * 1991-04-23 1993-03-23 Mitsubishi Materials Corp ウエーハの鏡面研磨装置
US5205082A (en) * 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
JP3370112B2 (ja) * 1992-10-12 2003-01-27 不二越機械工業株式会社 ウエハーの研磨装置
US5398459A (en) * 1992-11-27 1995-03-21 Kabushiki Kaisha Toshiba Method and apparatus for polishing a workpiece
US5423558A (en) * 1994-03-24 1995-06-13 Ipec/Westech Systems, Inc. Semiconductor wafer carrier and method

Also Published As

Publication number Publication date
DE69419479T2 (de) 2000-04-27
EP0653270B1 (de) 1999-07-14
EP0653270A1 (de) 1995-05-17
US5584746A (en) 1996-12-17

Similar Documents

Publication Publication Date Title
DE69419479T2 (de) Verfahren zum Schleifen von Halbleiterwafern und Gerät dafür
DE69607547D1 (de) Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
DE59704120D1 (de) Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
DE69308482D1 (de) Vorrichtung zum Polieren von Halbleiterscheiben
DE19580932T1 (de) Verfahren und Vorrichtung zum Polieren von Wafern
DE59802824D1 (de) Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
DE69415298T2 (de) Verfahren und einrichtung zum ätzen von halbleiterwarfern
DE69205255T2 (de) Verfahren zum Aufspannen und Fixieren von Halbleiter-Plättchen.
DE69615603T2 (de) Vorrichtung und Verfahren zum Reinigen von Halbleiterplättchen
DE69713108D1 (de) Schleifvorrichtung zum modifizieren von halbleiterwafer
DE69509561D1 (de) Verfahren und Vorrichtung zum Abfasen von Halbleiterscheiben
DE69709934D1 (de) Verfahren und vorrichtung zum polieren von halbleiterscheiben
DE60014994D1 (de) Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
DE69024077D1 (de) Einrichtung und Verfahren zur Behandlung von Halbleiterscheiben
DE69307157T2 (de) Methode und Vorrichtung zum Polieren der Rundkanten von Wafern
DE69904074T2 (de) Verfahren und vorrichtung zum polieren von halbleiterscheiben
DE69618433T2 (de) Verfahren und Gerät zur Werskstückzufuhr zum Gerät zur Serienverarbeitung von Halbleiterplatten
DE69711994D1 (de) Verfahren und Vorrichtung zum Regeln der Planheit von polierten Halbleiterscheiben
DE69504549T2 (de) Gerät zum Polieren von Wafers
DE69618882D1 (de) Verfahren und Vorrichtung zum Polieren von Halbleitersubstraten
DE59506147D1 (de) Verfahren zum Reinigen von Halbleiterscheiben
DE19882439T1 (de) Verfahren und Vorrichtungen zum Aufbereiten von Schleifsteinen
DE69703312T2 (de) Vorrichtung und Verfahren zum Polieren von Halbleiterscheiben
DE69607123T2 (de) Gerät zum Polieren von Wafers
DE69409412D1 (de) Verfahren und Gerät zum Schleifen von Laufflächenseiten

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee