DE69420499D1 - Methode zur Reduzierung des Leckstroms in Dünnfilmtransistoren - Google Patents
Methode zur Reduzierung des Leckstroms in DünnfilmtransistorenInfo
- Publication number
- DE69420499D1 DE69420499D1 DE69420499T DE69420499T DE69420499D1 DE 69420499 D1 DE69420499 D1 DE 69420499D1 DE 69420499 T DE69420499 T DE 69420499T DE 69420499 T DE69420499 T DE 69420499T DE 69420499 D1 DE69420499 D1 DE 69420499D1
- Authority
- DE
- Germany
- Prior art keywords
- thin film
- leakage current
- film transistors
- reducing leakage
- reducing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66765—Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/958—Passivation layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/130,807 US5384271A (en) | 1993-10-04 | 1993-10-04 | Method for reduction of off-current in thin film transistors |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69420499D1 true DE69420499D1 (de) | 1999-10-14 |
DE69420499T2 DE69420499T2 (de) | 2000-05-18 |
Family
ID=22446429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69420499T Expired - Fee Related DE69420499T2 (de) | 1993-10-04 | 1994-09-30 | Methode zur Reduzierung des Leckstroms in Dünnfilmtransistoren |
Country Status (4)
Country | Link |
---|---|
US (1) | US5384271A (de) |
EP (1) | EP0646953B1 (de) |
JP (1) | JPH07211919A (de) |
DE (1) | DE69420499T2 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5399884A (en) * | 1993-11-10 | 1995-03-21 | General Electric Company | Radiation imager with single passivation dielectric for transistor and diode |
JP2886066B2 (ja) * | 1993-11-16 | 1999-04-26 | 株式会社フロンテック | 薄膜トランジスタ基板およびその製造方法 |
DE19540309A1 (de) * | 1995-10-28 | 1997-04-30 | Philips Patentverwaltung | Halbleiterbauelement mit Passivierungsaufbau |
US5707895A (en) * | 1996-10-21 | 1998-01-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thin film transistor performance enhancement by water plasma treatment |
US6037609A (en) | 1997-01-17 | 2000-03-14 | General Electric Company | Corrosion resistant imager |
AT409429B (de) | 1999-07-15 | 2002-08-26 | Sez Semiconduct Equip Zubehoer | Verfahren zum ätzbehandeln von halbleitersubstraten zwecks freilegen einer metallschicht |
KR100600877B1 (ko) * | 2004-06-25 | 2006-07-14 | 삼성에스디아이 주식회사 | 반도체 소자 및 그 제조 방법 |
TWI345312B (en) * | 2004-07-26 | 2011-07-11 | Au Optronics Corp | Thin film transistor structure and method of fabricating the same |
US7382421B2 (en) * | 2004-10-12 | 2008-06-03 | Hewlett-Packard Development Company, L.P. | Thin film transistor with a passivation layer |
US8053777B2 (en) * | 2005-03-31 | 2011-11-08 | General Electric Company | Thin film transistors for imaging system and method of making the same |
TWI316274B (en) * | 2006-07-14 | 2009-10-21 | Au Optronics Corp | Method for fabricating thin film transistor |
US20080023703A1 (en) * | 2006-07-31 | 2008-01-31 | Randy Hoffman | System and method for manufacturing a thin-film device |
KR101675115B1 (ko) | 2010-01-12 | 2016-11-22 | 삼성전자주식회사 | 산화물 박막 트랜지스터 및 그 제조 방법 |
CN102148259B (zh) * | 2010-10-12 | 2014-04-16 | 京东方科技集团股份有限公司 | 薄膜晶体管、阵列基板及其制造方法和液晶显示器 |
RU2571456C1 (ru) * | 2014-07-15 | 2015-12-20 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования Кабардино-Балкарский государственный университет им. Х.М. Бербекова | Способ изготовления тонкопленочного транзистора |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0196915B1 (de) * | 1985-03-29 | 1991-08-14 | Matsushita Electric Industrial Co., Ltd. | Dünnschicht-Transistorenanordnung und Methode zu deren Herstellung |
US4704783A (en) * | 1986-05-05 | 1987-11-10 | General Electric Company | Method for passivating the back channel of amorphous silicon field effect transistors |
JPH01212450A (ja) * | 1988-02-19 | 1989-08-25 | Sanyo Electric Co Ltd | 薄膜トランジスタの製造方法 |
US5130263A (en) * | 1990-04-17 | 1992-07-14 | General Electric Company | Method for photolithographically forming a selfaligned mask using back-side exposure and a non-specular reflecting layer |
US5241192A (en) * | 1992-04-02 | 1993-08-31 | General Electric Company | Fabrication method for a self-aligned thin film transistor having reduced end leakage and device formed thereby |
US5281546A (en) * | 1992-09-02 | 1994-01-25 | General Electric Company | Method of fabricating a thin film transistor using hydrogen plasma treatment of the intrinsic silicon/doped layer interface |
-
1993
- 1993-10-04 US US08/130,807 patent/US5384271A/en not_active Expired - Fee Related
-
1994
- 1994-09-30 EP EP94307179A patent/EP0646953B1/de not_active Expired - Lifetime
- 1994-09-30 JP JP6236646A patent/JPH07211919A/ja active Pending
- 1994-09-30 DE DE69420499T patent/DE69420499T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5384271A (en) | 1995-01-24 |
EP0646953A2 (de) | 1995-04-05 |
EP0646953A3 (de) | 1997-08-27 |
JPH07211919A (ja) | 1995-08-11 |
EP0646953B1 (de) | 1999-09-08 |
DE69420499T2 (de) | 2000-05-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: ROEGER UND KOLLEGEN, 73728 ESSLINGEN |
|
8339 | Ceased/non-payment of the annual fee |