DE69424016T2 - Poliergerät - Google Patents
PoliergerätInfo
- Publication number
- DE69424016T2 DE69424016T2 DE69424016T DE69424016T DE69424016T2 DE 69424016 T2 DE69424016 T2 DE 69424016T2 DE 69424016 T DE69424016 T DE 69424016T DE 69424016 T DE69424016 T DE 69424016T DE 69424016 T2 DE69424016 T2 DE 69424016T2
- Authority
- DE
- Germany
- Prior art keywords
- polisher
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- B08B1/32—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25939693 | 1993-09-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69424016D1 DE69424016D1 (de) | 2000-05-25 |
DE69424016T2 true DE69424016T2 (de) | 2000-12-14 |
Family
ID=17333556
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69435110T Expired - Lifetime DE69435110D1 (de) | 1993-09-21 | 1994-09-20 | Poliergerät |
DE69433067T Expired - Lifetime DE69433067T2 (de) | 1993-09-21 | 1994-09-20 | Poliergerät |
DE69424016T Expired - Lifetime DE69424016T2 (de) | 1993-09-21 | 1994-09-20 | Poliergerät |
DE69434678T Expired - Lifetime DE69434678T2 (de) | 1993-09-21 | 1994-09-20 | Poliergerät |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69435110T Expired - Lifetime DE69435110D1 (de) | 1993-09-21 | 1994-09-20 | Poliergerät |
DE69433067T Expired - Lifetime DE69433067T2 (de) | 1993-09-21 | 1994-09-20 | Poliergerät |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69434678T Expired - Lifetime DE69434678T2 (de) | 1993-09-21 | 1994-09-20 | Poliergerät |
Country Status (4)
Country | Link |
---|---|
US (1) | US5616063A (de) |
EP (4) | EP1642679B1 (de) |
KR (3) | KR100390293B1 (de) |
DE (4) | DE69435110D1 (de) |
Families Citing this family (80)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5885138A (en) * | 1993-09-21 | 1999-03-23 | Ebara Corporation | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
US5679060A (en) * | 1994-07-14 | 1997-10-21 | Silicon Technology Corporation | Wafer grinding machine |
US20070123151A1 (en) * | 1995-05-23 | 2007-05-31 | Nova Measuring Instruments Ltd | Apparatus for optical inspection of wafers during polishing |
IL113829A (en) * | 1995-05-23 | 2000-12-06 | Nova Measuring Instr Ltd | Apparatus for optical inspection of wafers during polishing |
KR100487590B1 (ko) | 1995-08-21 | 2005-08-04 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱장치 |
US7097544B1 (en) | 1995-10-27 | 2006-08-29 | Applied Materials Inc. | Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion |
US5738574A (en) * | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
DE69709461T2 (de) * | 1996-02-05 | 2002-09-26 | Ebara Corp | Poliermaschine |
JP3580936B2 (ja) * | 1996-02-26 | 2004-10-27 | 株式会社荏原製作所 | ポリッシング装置のプッシャー及びポリッシング装置 |
US6050884A (en) * | 1996-02-28 | 2000-04-18 | Ebara Corporation | Polishing apparatus |
US5893794A (en) * | 1996-02-28 | 1999-04-13 | Ebara Corporation | Polishing apparatus having robotic transport apparatus |
JP3696690B2 (ja) * | 1996-04-23 | 2005-09-21 | 不二越機械工業株式会社 | ウェーハの研磨装置システム |
EP0803326B1 (de) | 1996-04-26 | 2002-10-02 | Ebara Corporation | Poliervorrichtung |
US5904611A (en) * | 1996-05-10 | 1999-05-18 | Canon Kabushiki Kaisha | Precision polishing apparatus |
US6413156B1 (en) * | 1996-05-16 | 2002-07-02 | Ebara Corporation | Method and apparatus for polishing workpiece |
JP3679871B2 (ja) * | 1996-09-04 | 2005-08-03 | 株式会社荏原製作所 | ポリッシング装置及び搬送ロボット |
JP3788533B2 (ja) * | 1996-09-30 | 2006-06-21 | 東京エレクトロン株式会社 | 研磨装置および研磨方法 |
US5702292A (en) * | 1996-10-31 | 1997-12-30 | Micron Technology, Inc. | Apparatus and method for loading and unloading substrates to a chemical-mechanical planarization machine |
JPH10163138A (ja) * | 1996-11-29 | 1998-06-19 | Fujitsu Ltd | 半導体装置の製造方法および研磨装置 |
DE19719503C2 (de) * | 1997-05-07 | 2002-05-02 | Wolters Peter Werkzeugmasch | Vorrichtung zum chemisch-mechanischen Polieren von Oberflächen von Halbleiterwafern und Verfahren zum Betrieb der Vorrichtung |
US6033521A (en) | 1997-06-04 | 2000-03-07 | Speedfam-Ipec Corporation | Tilt mechanism for wafer cassette |
US6139406A (en) | 1997-06-24 | 2000-10-31 | Applied Materials, Inc. | Combined slurry dispenser and rinse arm and method of operation |
US6213853B1 (en) | 1997-09-10 | 2001-04-10 | Speedfam-Ipec Corporation | Integral machine for polishing, cleaning, rinsing and drying workpieces |
TW405158B (en) * | 1997-09-17 | 2000-09-11 | Ebara Corp | Plating apparatus for semiconductor wafer processing |
KR100524054B1 (ko) * | 1997-11-21 | 2005-10-26 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱 장치와 이에 사용되는 대상물 홀더 및 폴리싱 방법 및 웨이퍼제조방법 |
JPH11204468A (ja) * | 1998-01-09 | 1999-07-30 | Speedfam Co Ltd | 半導体ウエハの表面平坦化装置 |
JPH11207606A (ja) * | 1998-01-21 | 1999-08-03 | Ebara Corp | 研磨装置 |
US6293855B1 (en) * | 1998-03-09 | 2001-09-25 | Ebara Corporation | Polishing apparatus |
FR2776552B1 (fr) * | 1998-03-31 | 2000-06-16 | Procedes & Equipement Pour Les | Machine modulaire de polissage et de planarisation de substrats |
US6132289A (en) * | 1998-03-31 | 2000-10-17 | Lam Research Corporation | Apparatus and method for film thickness measurement integrated into a wafer load/unload unit |
US6220941B1 (en) | 1998-10-01 | 2001-04-24 | Applied Materials, Inc. | Method of post CMP defect stability improvement |
US6271140B1 (en) | 1998-10-01 | 2001-08-07 | Vanguard International Semiconductor Corporation | Coaxial dressing for chemical mechanical polishing |
JP2000187832A (ja) * | 1998-10-05 | 2000-07-04 | Exclusive Design Co Inc | 磁気ディスク及び他の基板を自動研磨する方法及び装置 |
JP3045233B2 (ja) * | 1998-10-16 | 2000-05-29 | 株式会社東京精密 | ウェーハ研磨装置 |
JP3979750B2 (ja) * | 1998-11-06 | 2007-09-19 | 株式会社荏原製作所 | 基板の研磨装置 |
US6319098B1 (en) | 1998-11-13 | 2001-11-20 | Applied Materials, Inc. | Method of post CMP defect stability improvement |
US6690473B1 (en) * | 1999-02-01 | 2004-02-10 | Sensys Instruments Corporation | Integrated surface metrology |
US7177019B2 (en) * | 1999-02-01 | 2007-02-13 | Tokyo Electron Limited | Apparatus for imaging metrology |
US7042580B1 (en) * | 1999-02-01 | 2006-05-09 | Tokyo Electron Limited | Apparatus for imaging metrology |
US6309279B1 (en) * | 1999-02-19 | 2001-10-30 | Speedfam-Ipec Corporation | Arrangements for wafer polishing |
US6358128B1 (en) * | 1999-03-05 | 2002-03-19 | Ebara Corporation | Polishing apparatus |
US6354922B1 (en) | 1999-08-20 | 2002-03-12 | Ebara Corporation | Polishing apparatus |
US6955516B2 (en) * | 2001-11-02 | 2005-10-18 | Applied Materials, Inc. | Single wafer dryer and drying methods |
US6328814B1 (en) | 1999-03-26 | 2001-12-11 | Applied Materials, Inc. | Apparatus for cleaning and drying substrates |
US6217426B1 (en) | 1999-04-06 | 2001-04-17 | Applied Materials, Inc. | CMP polishing pad |
US6220942B1 (en) * | 1999-04-02 | 2001-04-24 | Applied Materials, Inc. | CMP platen with patterned surface |
US6855030B2 (en) * | 1999-10-27 | 2005-02-15 | Strasbaugh | Modular method for chemical mechanical planarization |
JP2001274122A (ja) | 2000-03-23 | 2001-10-05 | Tokyo Seimitsu Co Ltd | ウェハ研磨装置 |
JP3556148B2 (ja) * | 2000-03-23 | 2004-08-18 | 株式会社東京精密 | ウェハ研磨装置 |
JP3510177B2 (ja) | 2000-03-23 | 2004-03-22 | 株式会社東京精密 | ウェハ研磨装置 |
JP2001326201A (ja) * | 2000-05-16 | 2001-11-22 | Ebara Corp | ポリッシング装置 |
JP2004501380A (ja) * | 2000-06-26 | 2004-01-15 | ボストン メディカル テクノロジーズ インコーポレイテッド | グルコース計測システム |
WO2002015261A2 (en) * | 2000-08-11 | 2002-02-21 | Sensys Instruments Corporation | Bathless wafer measurement apparatus and method |
KR100877044B1 (ko) * | 2000-10-02 | 2008-12-31 | 도쿄엘렉트론가부시키가이샤 | 세정처리장치 |
JP4348412B2 (ja) * | 2001-04-26 | 2009-10-21 | 東京エレクトロン株式会社 | 計測システムクラスター |
US7089075B2 (en) * | 2001-05-04 | 2006-08-08 | Tokyo Electron Limited | Systems and methods for metrology recipe and model generation |
EP1263022B1 (de) * | 2001-05-31 | 2007-04-25 | S.E.S. Company Limited | Substratreinigungssystem |
US7513062B2 (en) * | 2001-11-02 | 2009-04-07 | Applied Materials, Inc. | Single wafer dryer and drying methods |
JP3920720B2 (ja) * | 2002-03-29 | 2007-05-30 | 株式会社荏原製作所 | 基板受渡し方法、基板受渡し機構及び基板研磨装置 |
US6875076B2 (en) | 2002-06-17 | 2005-04-05 | Accretech Usa, Inc. | Polishing machine and method |
DE10250856A1 (de) | 2002-10-25 | 2004-05-13 | Carl Zeiss | Verfahren und Vorrichtung zum Herstellen von optischen Gläsern |
WO2005044473A1 (de) * | 2003-11-10 | 2005-05-19 | Marlena Busarac | Vorrichtung zum reinigen von stapelbaren erzeugnissen |
WO2006014411A1 (en) * | 2004-07-02 | 2006-02-09 | Strasbaugh | Method and system for processing wafers |
KR101165379B1 (ko) * | 2004-07-15 | 2012-07-17 | 삼성전자주식회사 | 수신 성능이 향상된 지상파 디지털 방송 송수신 시스템 및그의 신호처리방법 |
JP2007111283A (ja) * | 2005-10-21 | 2007-05-10 | Timothy Tamio Nemoto | 歯冠研磨装置 |
US20070181442A1 (en) * | 2006-02-03 | 2007-08-09 | Applied Materials, Inc. | Method and apparatus for foam removal in an electrochemical mechanical substrate polishing process |
JP2011526843A (ja) * | 2008-07-01 | 2011-10-20 | アプライド マテリアルズ インコーポレイテッド | モジュール式ベースプレート半導体研磨機アーキテクチャ |
TWI550686B (zh) * | 2011-11-04 | 2016-09-21 | 東京威力科創股份有限公司 | 基板處理系統、基板運送方法及電腦記憶媒體 |
US9570311B2 (en) * | 2012-02-10 | 2017-02-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Modular grinding apparatuses and methods for wafer thinning |
CN103286676A (zh) * | 2013-05-31 | 2013-09-11 | 上海华力微电子有限公司 | 研磨液整理器 |
SG10201508119XA (en) * | 2014-10-03 | 2016-05-30 | Ebara Corp | Substrate processing apparatus and processing method |
CN106541329B (zh) * | 2015-09-16 | 2019-01-01 | 泰科电子(上海)有限公司 | 集成设备 |
KR101786485B1 (ko) * | 2016-03-08 | 2017-10-18 | 주식회사 케이씨텍 | 화학 기계적 연마시스템 |
JP6727044B2 (ja) * | 2016-06-30 | 2020-07-22 | 株式会社荏原製作所 | 基板処理装置 |
CN107009216A (zh) * | 2017-05-08 | 2017-08-04 | 重庆都英科技有限公司 | 一种毛刺打磨设备 |
CN107053001A (zh) * | 2017-05-11 | 2017-08-18 | 芜湖市华峰砂轮有限公司 | 一种半自动砂轮磨床 |
CN107662156B (zh) * | 2017-09-11 | 2019-02-26 | 山东时风(集团)有限责任公司 | 铸件后精整流水线及其精整方法 |
CN107598763A (zh) * | 2017-10-24 | 2018-01-19 | 江门市奥伦德光电有限公司 | 一种多尺寸兼容的晶圆研磨设备及其研磨方法 |
KR102612416B1 (ko) | 2018-12-24 | 2023-12-08 | 삼성전자주식회사 | 세정 장치 및 세정 장치의 구동 방법 |
CN109822419A (zh) * | 2019-03-04 | 2019-05-31 | 天通日进精密技术有限公司 | 晶圆转移装置及晶圆转移方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4141180A (en) * | 1977-09-21 | 1979-02-27 | Kayex Corporation | Polishing apparatus |
US4193226A (en) * | 1977-09-21 | 1980-03-18 | Kayex Corporation | Polishing apparatus |
US4313266A (en) * | 1980-05-01 | 1982-02-02 | The Silicon Valley Group, Inc. | Method and apparatus for drying wafers |
JPS58223561A (ja) * | 1982-06-16 | 1983-12-26 | Disco Abrasive Sys Ltd | ポリツシングマシン |
US4680893A (en) * | 1985-09-23 | 1987-07-21 | Motorola, Inc. | Apparatus for polishing semiconductor wafers |
US4653231A (en) * | 1985-11-01 | 1987-03-31 | Motorola, Inc. | Polishing system with underwater Bernoulli pickup |
JPS63207559A (ja) * | 1987-02-19 | 1988-08-26 | Disco Abrasive Syst Ltd | ウエ−ハ自動研削装置 |
US4956944A (en) * | 1987-03-19 | 1990-09-18 | Canon Kabushiki Kaisha | Polishing apparatus |
US4851101A (en) * | 1987-09-18 | 1989-07-25 | Varian Associates, Inc. | Sputter module for modular wafer processing machine |
US4984392A (en) * | 1988-09-29 | 1991-01-15 | Shin-Etsu Handotai Company Limited | Chamfering the notch of a semiconductor wafer |
US4905425A (en) * | 1988-09-30 | 1990-03-06 | Shin-Etsu Handotai Company Limited | Method for chamfering the notch of a notch-cut semiconductor wafer |
JPH0615565A (ja) * | 1991-12-18 | 1994-01-25 | Shin Etsu Handotai Co Ltd | ウエーハ自動ラッピング装置 |
US5329732A (en) * | 1992-06-15 | 1994-07-19 | Speedfam Corporation | Wafer polishing method and apparatus |
JPH0663862A (ja) * | 1992-08-22 | 1994-03-08 | Fujikoshi Mach Corp | 研磨装置 |
JP2622069B2 (ja) * | 1993-06-30 | 1997-06-18 | 三菱マテリアル株式会社 | 研磨布のドレッシング装置 |
-
1994
- 1994-09-17 KR KR1019940023793A patent/KR100390293B1/ko not_active IP Right Cessation
- 1994-09-20 DE DE69435110T patent/DE69435110D1/de not_active Expired - Lifetime
- 1994-09-20 EP EP05027667A patent/EP1642679B1/de not_active Expired - Lifetime
- 1994-09-20 US US08/309,193 patent/US5616063A/en not_active Expired - Lifetime
- 1994-09-20 DE DE69433067T patent/DE69433067T2/de not_active Expired - Lifetime
- 1994-09-20 EP EP03011138A patent/EP1338384B1/de not_active Expired - Lifetime
- 1994-09-20 EP EP99120263A patent/EP0982098B1/de not_active Expired - Lifetime
- 1994-09-20 DE DE69424016T patent/DE69424016T2/de not_active Expired - Lifetime
- 1994-09-20 EP EP94114828A patent/EP0648575B9/de not_active Expired - Lifetime
- 1994-09-20 DE DE69434678T patent/DE69434678T2/de not_active Expired - Lifetime
-
2003
- 2003-03-31 KR KR1020030020005A patent/KR100390299B1/ko not_active IP Right Cessation
- 2003-03-31 KR KR1020030020006A patent/KR100390300B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US5616063A (en) | 1997-04-01 |
KR100390299B1 (ko) | 2003-07-04 |
EP0982098A2 (de) | 2000-03-01 |
EP0648575A1 (de) | 1995-04-19 |
DE69434678D1 (de) | 2006-05-18 |
DE69435110D1 (de) | 2008-08-14 |
EP1338384A2 (de) | 2003-08-27 |
EP1642679A1 (de) | 2006-04-05 |
DE69433067T2 (de) | 2004-06-03 |
EP0648575B9 (de) | 2001-12-05 |
KR100390300B1 (ko) | 2003-07-04 |
EP1338384A3 (de) | 2003-09-10 |
KR100390293B1 (ko) | 2003-09-02 |
EP0982098B1 (de) | 2003-08-20 |
EP1642679B1 (de) | 2008-07-02 |
EP0982098A3 (de) | 2000-03-08 |
EP1338384B1 (de) | 2006-03-29 |
EP0648575B1 (de) | 2000-04-19 |
DE69424016D1 (de) | 2000-05-25 |
DE69434678T2 (de) | 2007-04-12 |
DE69433067D1 (de) | 2003-09-25 |
KR950009954A (ko) | 1995-04-26 |
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