DE69432460T2 - Struktur zur montage eines halbleiters- und eines fluessigkristallanzeigeapparates - Google Patents

Struktur zur montage eines halbleiters- und eines fluessigkristallanzeigeapparates Download PDF

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Publication number
DE69432460T2
DE69432460T2 DE69432460T DE69432460T DE69432460T2 DE 69432460 T2 DE69432460 T2 DE 69432460T2 DE 69432460 T DE69432460 T DE 69432460T DE 69432460 T DE69432460 T DE 69432460T DE 69432460 T2 DE69432460 T2 DE 69432460T2
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Prior art keywords
assembling
semiconductor
liquid crystal
crystal display
display apparatus
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DE69432460T
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DE69432460D1 (de
Inventor
Eiji Muramatsu
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Seiko Epson Corp
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Seiko Epson Corp
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
DE69432460T 1993-11-12 1994-11-09 Struktur zur montage eines halbleiters- und eines fluessigkristallanzeigeapparates Expired - Lifetime DE69432460T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28369493 1993-11-12
PCT/JP1994/001887 WO1995013625A1 (en) 1993-11-12 1994-11-09 Structure and method for mounting semiconductor device and liquid crystal display device

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DE69432460D1 DE69432460D1 (de) 2003-05-15
DE69432460T2 true DE69432460T2 (de) 2004-01-15

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DE69432460T Expired - Lifetime DE69432460T2 (de) 1993-11-12 1994-11-09 Struktur zur montage eines halbleiters- und eines fluessigkristallanzeigeapparates

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Country Link
US (1) US5893623A (de)
EP (1) EP0680082B1 (de)
JP (1) JP3579903B2 (de)
KR (1) KR100321883B1 (de)
DE (1) DE69432460T2 (de)
SG (1) SG63572A1 (de)
TW (1) TW285751B (de)
WO (1) WO1995013625A1 (de)

Families Citing this family (37)

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Publication number Priority date Publication date Assignee Title
US5814529A (en) 1995-01-17 1998-09-29 Semiconductor Energy Laboratory Co., Ltd. Method for producing a semiconductor integrated circuit including a thin film transistor and a capacitor
US5757456A (en) * 1995-03-10 1998-05-26 Semiconductor Energy Laboratory Co., Ltd. Display device and method of fabricating involving peeling circuits from one substrate and mounting on other
JP3284262B2 (ja) * 1996-09-05 2002-05-20 セイコーエプソン株式会社 液晶表示装置及びそれを用いた電子機器
US6525718B1 (en) * 1997-02-05 2003-02-25 Sharp Kabushiki Kaisha Flexible circuit board and liquid crystal display device incorporating the same
US6292248B1 (en) * 1997-08-09 2001-09-18 Lg. Philips Lcd Co., Ltd. COG type liquid crystal panel and fabrication method thereof having first and second conductive bumps in different planes
US6069679A (en) * 1997-09-04 2000-05-30 Motorola, Inc. Selective call receiver having a display module with integrated circuits and method therefor
JP3873478B2 (ja) * 1997-12-25 2007-01-24 セイコーエプソン株式会社 液晶表示装置、電子機器及び液晶表示装置の製造方法
US6781662B1 (en) 1998-04-09 2004-08-24 Seiko Epson Corporation Compression-bond connection substrate, liquid crystal device, and electronic equipment
US6825836B1 (en) 1998-05-16 2004-11-30 Thomson Licensing S.A. Bus arrangement for a driver of a matrix display
TWI226478B (en) * 1998-07-31 2005-01-11 Toshiba Corp Flat panel display device
JP2000172193A (ja) 1998-12-08 2000-06-23 Fujitsu Ltd マトリックス表示装置及びその製造方法並びに熱圧着接続用ヘッド
JP3209219B2 (ja) 1999-01-18 2001-09-17 セイコーエプソン株式会社 電気光学装置および電子機器
JP2000250425A (ja) * 1999-02-25 2000-09-14 Fujitsu Ltd ドライバｉｃ実装モジュール
EP1078426B1 (de) * 1999-03-09 2004-11-24 Koninklijke Philips Electronics N.V. Anzeigevorrichtung
US6556268B1 (en) * 1999-03-31 2003-04-29 Industrial Technology Research Institute Method for forming compact LCD packages and devices formed in which first bonding PCB to LCD panel and second bonding driver chip to PCB
JP2001077501A (ja) * 1999-09-03 2001-03-23 Seiko Epson Corp フレキシブル配線基板、電気光学装置および電子機器
US20010029966A1 (en) 1999-12-10 2001-10-18 Arthur Wong Non-apertured cleaning sheets having non-random macroscopic three-dimensional character
SE516936C2 (sv) * 1999-12-10 2002-03-26 Ericsson Telefon Ab L M Flytande-kristalldisplay, LCD
KR100690002B1 (ko) * 2000-06-12 2007-03-08 엘지.필립스 엘시디 주식회사 유기발광소자
US7038239B2 (en) 2002-04-09 2006-05-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element and display device using the same
JP3989761B2 (ja) 2002-04-09 2007-10-10 株式会社半導体エネルギー研究所 半導体表示装置
JP3989763B2 (ja) 2002-04-15 2007-10-10 株式会社半導体エネルギー研究所 半導体表示装置
JP4463493B2 (ja) 2002-04-15 2010-05-19 株式会社半導体エネルギー研究所 表示装置及びその作製方法
US7256421B2 (en) 2002-05-17 2007-08-14 Semiconductor Energy Laboratory, Co., Ltd. Display device having a structure for preventing the deterioration of a light emitting device
JP4144436B2 (ja) 2003-06-02 2008-09-03 セイコーエプソン株式会社 電気光学モジュール及び電子機器
JP3979405B2 (ja) * 2004-07-13 2007-09-19 セイコーエプソン株式会社 電気光学装置、実装構造体及び電子機器
JP4736614B2 (ja) * 2005-08-12 2011-07-27 セイコーエプソン株式会社 信号伝送回路及び電気光学装置並びに電子機器
DE102006005677B4 (de) * 2006-01-30 2015-12-31 E.G.O. Elektro-Gerätebau GmbH Kochfeld
US20090040450A1 (en) * 2006-02-10 2009-02-12 Sharp Kabushiki Kaisha Circuit board, a liquid crystal display module having the same, and a display device having the same
US7663728B2 (en) * 2006-03-28 2010-02-16 Tpo Displays Corp. Systems for providing conducting pad and fabrication method thereof
TWI351670B (en) * 2006-05-18 2011-11-01 Au Optronics Corp Signal transmission assembly and display panel app
BE1019392A3 (fr) * 2010-06-29 2012-06-05 Agc Glass Europe Panneau de vitrage comprenant une premiere feuille de verre, au moins un circuit electrique interne et un connecteur.
KR101061531B1 (ko) * 2010-12-17 2011-09-01 테세라 리써치 엘엘씨 중앙 콘택을 구비하며 접지 또는 배전을 개선한 적층형 마이크로전자 조립체
BE1019812A3 (fr) * 2011-03-14 2013-01-08 Agc Glass Europe Panneau de vitrage comprenant une premiere feuille de verre, au moins un circuit electrique interne et un connecteur.
US9423906B2 (en) 2011-05-17 2016-08-23 Ching-Yang Chang Drive system adaptable to a matrix scanning device
JP6098457B2 (ja) 2013-09-18 2017-03-22 株式会社デンソー 点灯装置及び点灯装置を備えた灯具
CN105261602A (zh) * 2015-09-16 2016-01-20 京东方科技集团股份有限公司 一种显示面板的封装结构、转接板、封装方法及显示装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0339154B1 (de) * 1988-04-26 1994-11-17 Citizen Watch Co. Ltd. Speicherkarte
DE3910963A1 (de) * 1989-04-05 1990-10-11 Licentia Gmbh Schaltungsanordnung
JPH04147221A (ja) * 1990-10-11 1992-05-20 Casio Comput Co Ltd 液晶表示装置
JP2657429B2 (ja) * 1990-04-09 1997-09-24 株式会社ミクロ技術研究所 基板の回路実装方法及びその方法に使用する回路基板
JPH0420933A (ja) * 1990-05-16 1992-01-24 Hitachi Ltd 液晶表示装置
JPH04274413A (ja) * 1991-03-01 1992-09-30 Hitachi Ltd 配線基板
US5239448A (en) * 1991-10-28 1993-08-24 International Business Machines Corporation Formulation of multichip modules
TW232065B (de) * 1992-04-16 1994-10-11 Sharp Kk
JP2801487B2 (ja) * 1992-04-30 1998-09-21 シャープ株式会社 パネルの実装構造および実装方法並びに樹脂供給硬化方法
EP0587144B1 (de) * 1992-09-08 1999-06-09 Seiko Epson Corporation Flüssigkristallanzeigevorrichtung, Vorrichtung und Verfahren zum Montieren von Halbleiterelementen und elektronisches Druckgerät
US5592199A (en) * 1993-01-27 1997-01-07 Sharp Kabushiki Kaisha Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same
US5467210A (en) * 1993-02-16 1995-11-14 Casio Computer Co., Ltd. Arrangement of bonding IC chip to liquid crystal display device
JP3186925B2 (ja) * 1994-08-04 2001-07-11 シャープ株式会社 パネルの実装構造並びに集積回路搭載テープおよびその製造方法

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EP0680082A4 (de) 1997-04-02
KR100321883B1 (ko) 2002-06-20
JP3579903B2 (ja) 2004-10-20
EP0680082B1 (de) 2003-04-09
SG63572A1 (en) 1999-03-30
EP0680082A1 (de) 1995-11-02
KR960700524A (ko) 1996-01-20
US5893623A (en) 1999-04-13
WO1995013625A1 (en) 1995-05-18
DE69432460D1 (de) 2003-05-15

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