DE69503219D1 - Schaltschrank mit dosierten Luftkanälen zur Montage und zur Kühlung von Modulen - Google Patents

Schaltschrank mit dosierten Luftkanälen zur Montage und zur Kühlung von Modulen

Info

Publication number
DE69503219D1
DE69503219D1 DE69503219T DE69503219T DE69503219D1 DE 69503219 D1 DE69503219 D1 DE 69503219D1 DE 69503219 T DE69503219 T DE 69503219T DE 69503219 T DE69503219 T DE 69503219T DE 69503219 D1 DE69503219 D1 DE 69503219D1
Authority
DE
Germany
Prior art keywords
mounting
control cabinet
air channels
cooling modules
metered air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69503219T
Other languages
English (en)
Other versions
DE69503219T2 (de
Inventor
Guenter Schkrohowsky
Darrel W Poulter
Cliff Harrison
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE69503219D1 publication Critical patent/DE69503219D1/de
Application granted granted Critical
Publication of DE69503219T2 publication Critical patent/DE69503219T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
DE69503219T 1995-02-14 1995-10-12 Schaltschrank mit dosierten Luftkanälen zur Montage und zur Kühlung von Modulen Expired - Fee Related DE69503219T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/388,733 US5477416A (en) 1995-02-14 1995-02-14 Enclosure with metered air ducts for mounting and cooling modules

Publications (2)

Publication Number Publication Date
DE69503219D1 true DE69503219D1 (de) 1998-08-06
DE69503219T2 DE69503219T2 (de) 1999-01-21

Family

ID=23535282

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69503219T Expired - Fee Related DE69503219T2 (de) 1995-02-14 1995-10-12 Schaltschrank mit dosierten Luftkanälen zur Montage und zur Kühlung von Modulen

Country Status (4)

Country Link
US (1) US5477416A (de)
EP (1) EP0727929B1 (de)
JP (1) JPH08264983A (de)
DE (1) DE69503219T2 (de)

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JP3817010B2 (ja) * 1997-02-14 2006-08-30 富士通株式会社 通気ダクト，冷却装置および電子機器
DE19756250C2 (de) * 1997-12-17 2000-11-02 Siemens Ag Selbstgeführter Stromrichter eines spannungseinprägenden Umrichters mit Hochleistungs-Modulen
JP3517118B2 (ja) * 1998-07-24 2004-04-05 富士通株式会社 システムボード装置及びこれが組み込まれている機器
US5949646A (en) * 1998-07-31 1999-09-07 Sun Microsystems, Inc. Compact computer having a redundant air moving system and method thereof
CA2316745A1 (en) * 2000-08-24 2002-02-24 Nortel Networks Limited Telecommunications system
US6587340B2 (en) * 2001-04-10 2003-07-01 Sun Microsystems, Inc. Maintaining cooling efficiency during air mover failure
DE102004040662A1 (de) * 2004-08-20 2006-02-23 Alexander Biechteler Verfahren und Vorrichtung zur Herstellung von expandierten Nahrungsmitteln
JP2006163695A (ja) * 2004-12-06 2006-06-22 Hitachi Ltd ストレージ装置、ストレージ装置用記憶部及びダミーユニット
FR2905556B1 (fr) * 2006-08-30 2009-06-26 Thales Sa Baie electronique associant convection naturelle et circulation d'air force pour son refroidissement
US8549912B2 (en) 2007-12-18 2013-10-08 Teradyne, Inc. Disk drive transport, clamping and testing
US7996174B2 (en) 2007-12-18 2011-08-09 Teradyne, Inc. Disk drive testing
US7646600B2 (en) * 2008-04-15 2010-01-12 International Business Machines Corporation Structural support module to prevent common interface deflection
US8160739B2 (en) 2008-04-17 2012-04-17 Teradyne, Inc. Transferring storage devices within storage device testing systems
US8117480B2 (en) 2008-04-17 2012-02-14 Teradyne, Inc. Dependent temperature control within disk drive testing systems
US8102173B2 (en) 2008-04-17 2012-01-24 Teradyne, Inc. Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit
US7945424B2 (en) 2008-04-17 2011-05-17 Teradyne, Inc. Disk drive emulator and method of use thereof
US7848106B2 (en) 2008-04-17 2010-12-07 Teradyne, Inc. Temperature control within disk drive testing systems
US8238099B2 (en) 2008-04-17 2012-08-07 Teradyne, Inc. Enclosed operating area for disk drive testing systems
US8041449B2 (en) 2008-04-17 2011-10-18 Teradyne, Inc. Bulk feeding disk drives to disk drive testing systems
US8095234B2 (en) 2008-04-17 2012-01-10 Teradyne, Inc. Transferring disk drives within disk drive testing systems
US20090262455A1 (en) 2008-04-17 2009-10-22 Teradyne, Inc. Temperature Control Within Disk Drive Testing Systems
US8305751B2 (en) 2008-04-17 2012-11-06 Teradyne, Inc. Vibration isolation within disk drive testing systems
CN102112887B (zh) 2008-06-03 2015-06-10 泰拉丁公司 处理存储设备
US7826222B2 (en) * 2008-07-03 2010-11-02 Juniper Networks, Inc. Front-to-back cooling system for modular systems with orthogonal midplane configuration
US7804684B1 (en) 2008-12-22 2010-09-28 Juniper Networks, Inc. Cooling system for a data processing unit
US20100217909A1 (en) * 2009-02-24 2010-08-26 Sun Microsystems, Inc. Field replaceable unit for solid state drive system
US8535787B1 (en) 2009-06-29 2013-09-17 Juniper Networks, Inc. Heat sinks having a thermal interface for cooling electronic devices
US8687356B2 (en) 2010-02-02 2014-04-01 Teradyne, Inc. Storage device testing system cooling
US8116079B2 (en) 2009-07-15 2012-02-14 Teradyne, Inc. Storage device testing system cooling
US8628239B2 (en) 2009-07-15 2014-01-14 Teradyne, Inc. Storage device temperature sensing
US8547123B2 (en) 2009-07-15 2013-10-01 Teradyne, Inc. Storage device testing system with a conductive heating assembly
US7920380B2 (en) 2009-07-15 2011-04-05 Teradyne, Inc. Test slot cooling system for a storage device testing system
US7995349B2 (en) 2009-07-15 2011-08-09 Teradyne, Inc. Storage device temperature sensing
US8466699B2 (en) 2009-07-15 2013-06-18 Teradyne, Inc. Heating storage devices in a testing system
US8534930B1 (en) 2009-09-24 2013-09-17 Juniper Networks, Inc. Circuit boards defining openings for cooling electronic devices
US8801374B1 (en) 2009-10-07 2014-08-12 Juniper Networks, Inc. Fan trays having stator blades for improving air flow performance
US8223498B2 (en) * 2009-11-11 2012-07-17 Juniper Networks, Inc. Thermal interface members for removable electronic devices
US8279601B2 (en) * 2010-01-28 2012-10-02 Juniper Networks, Inc. Air flow ducts for cooling electronic devices within a data processing unit
US9779780B2 (en) 2010-06-17 2017-10-03 Teradyne, Inc. Damping vibrations within storage device testing systems
US8687349B2 (en) 2010-07-21 2014-04-01 Teradyne, Inc. Bulk transfer of storage devices using manual loading
US9001456B2 (en) 2010-08-31 2015-04-07 Teradyne, Inc. Engaging test slots
FR2985333B1 (fr) * 2012-01-04 2014-06-20 Thales Sa Calculateur electronique comprenant un systeme de canalisation d'air pour le refroidissement de cartes electroniques
CN103677179A (zh) * 2012-09-21 2014-03-26 英业达科技有限公司 服务器
US9253927B1 (en) 2012-09-28 2016-02-02 Juniper Networks, Inc. Removable fan tray
DE112013000026T5 (de) * 2013-01-29 2015-05-21 Mitsubishi Electric Corporation Elektronische Vorrichtung
US9459312B2 (en) 2013-04-10 2016-10-04 Teradyne, Inc. Electronic assembly test system
US9877415B2 (en) * 2016-03-08 2018-01-23 Western Digital Technologies, Inc. Cold storage server with heat dissipation
US9968009B2 (en) * 2016-05-03 2018-05-08 Quanta Computer Inc. System with fresh air flow toward downstream components for cooling
US9836102B1 (en) * 2016-08-02 2017-12-05 International Business Machines Corporation Electronic component cooling system
US9915985B1 (en) * 2017-01-03 2018-03-13 Quanta Computer Inc. Chassis for providing distributed airflow
US11226390B2 (en) 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
US10725091B2 (en) 2017-08-28 2020-07-28 Teradyne, Inc. Automated test system having multiple stages
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US10983145B2 (en) 2018-04-24 2021-04-20 Teradyne, Inc. System for testing devices inside of carriers
US10775408B2 (en) 2018-08-20 2020-09-15 Teradyne, Inc. System for testing devices inside of carriers
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system

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US3387648A (en) * 1967-02-23 1968-06-11 Navy Usa Cabinet enclosed recirculation cooling system carried on extensible chassis mountingelectronic modules
US4233644A (en) * 1979-06-28 1980-11-11 International Business Machines Corporation Dual-pull air cooling for a computer frame
US4642715A (en) * 1984-11-01 1987-02-10 Miltope Corporation Environmental conditioning and safety system for disk-type mass memories
KR900001842B1 (ko) * 1984-11-15 1990-03-24 후지쓰 가부시끼가이샤 전자장비용 랙의 냉각구조
US4672509A (en) * 1986-08-07 1987-06-09 Ncr Corporation Air cooling assembly in an electronic system enclosure
US4858070A (en) * 1987-04-24 1989-08-15 Racal Data Communications Inc. Modular expandable housing arrangement for electronic apparatus
US5101320A (en) * 1991-01-22 1992-03-31 Hayes Microcomputer Products, Inc. Apparatus for rack mounting multiple circuit boards
US5414591A (en) * 1991-04-15 1995-05-09 Hitachi, Ltd. Magnetic disk storage system

Also Published As

Publication number Publication date
EP0727929A1 (de) 1996-08-21
EP0727929B1 (de) 1998-07-01
US5477416A (en) 1995-12-19
DE69503219T2 (de) 1999-01-21
JPH08264983A (ja) 1996-10-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD CO. (N.D.GES.D.STAATES DELAWARE),

8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE

8339 Ceased/non-payment of the annual fee