DE69512519T2 - Oberflächenmontierte sicherungsvorrichtung - Google Patents

Oberflächenmontierte sicherungsvorrichtung

Info

Publication number
DE69512519T2
DE69512519T2 DE69512519T DE69512519T DE69512519T2 DE 69512519 T2 DE69512519 T2 DE 69512519T2 DE 69512519 T DE69512519 T DE 69512519T DE 69512519 T DE69512519 T DE 69512519T DE 69512519 T2 DE69512519 T2 DE 69512519T2
Authority
DE
Germany
Prior art keywords
locking device
surface mounted
mounted locking
locking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69512519T
Other languages
English (en)
Other versions
DE69512519D1 (de
Inventor
Vladimir Blecha
Katherine M Mcguire
Andrew J Neuhalfen
Daniel B Onken
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Littelfuse Inc
Original Assignee
Littelfuse Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22935472&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69512519(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Littelfuse Inc filed Critical Littelfuse Inc
Application granted granted Critical
Publication of DE69512519D1 publication Critical patent/DE69512519D1/de
Publication of DE69512519T2 publication Critical patent/DE69512519T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
    • H01C17/08—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by vapour deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/006—Thin film resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/1013—Thin film varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H01H69/022—Manufacture of fuses of printed circuit fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H01H2085/0414—Surface mounted fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/08—Fusible members characterised by the shape or form of the fusible member
    • H01H85/11—Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49107—Fuse making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
DE69512519T 1994-05-27 1995-05-23 Oberflächenmontierte sicherungsvorrichtung Expired - Fee Related DE69512519T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/247,584 US5552757A (en) 1994-05-27 1994-05-27 Surface-mounted fuse device
PCT/US1995/006568 WO1995033276A1 (en) 1994-05-27 1995-05-23 Surface-mounted fuse device

Publications (2)

Publication Number Publication Date
DE69512519D1 DE69512519D1 (de) 1999-11-04
DE69512519T2 true DE69512519T2 (de) 2000-01-13

Family

ID=22935472

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69512519T Expired - Fee Related DE69512519T2 (de) 1994-05-27 1995-05-23 Oberflächenmontierte sicherungsvorrichtung

Country Status (9)

Country Link
US (4) US5552757A (de)
EP (1) EP0761012B1 (de)
JP (1) JP3160294B2 (de)
KR (1) KR100238986B1 (de)
CN (1) CN1189913C (de)
AU (1) AU691620B2 (de)
CA (1) CA2191346A1 (de)
DE (1) DE69512519T2 (de)
WO (1) WO1995033276A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004033251B3 (de) * 2004-07-08 2006-03-09 Vishay Bccomponents Beyschlag Gmbh Schmelzsicherung für einem Chip

Families Citing this family (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5790008A (en) * 1994-05-27 1998-08-04 Littlefuse, Inc. Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces
US6191928B1 (en) * 1994-05-27 2001-02-20 Littelfuse, Inc. Surface-mountable device for protection against electrostatic damage to electronic components
US5552757A (en) * 1994-05-27 1996-09-03 Littelfuse, Inc. Surface-mounted fuse device
CN1191623A (zh) * 1995-06-07 1998-08-26 保险丝公司 保护电子部件免受静电损伤的表面安装装置所用方法和设备
DK0830704T3 (da) * 1995-06-07 1999-07-26 Littelfuse Inc Forbedret fremgangsmåde og apparatur til en overflademonteret sikringsindretning
US5699607A (en) * 1996-01-22 1997-12-23 Littelfuse, Inc. Process for manufacturing an electrical device comprising a PTC element
US5907272A (en) * 1996-01-22 1999-05-25 Littelfuse, Inc. Surface mountable electrical device comprising a PTC element and a fusible link
AU1953697A (en) * 1996-01-22 1997-08-22 Littelfuse, Inc. Surface mountable electrical device comprising a ptc element
US5884391A (en) * 1996-01-22 1999-03-23 Littelfuse, Inc. Process for manufacturing an electrical device comprising a PTC element
US5900800A (en) * 1996-01-22 1999-05-04 Littelfuse, Inc. Surface mountable electrical device comprising a PTC element
US6023403A (en) * 1996-05-03 2000-02-08 Littlefuse, Inc. Surface mountable electrical device comprising a PTC and fusible element
US5699032A (en) * 1996-06-07 1997-12-16 Littelfuse, Inc. Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material
US5977860A (en) * 1996-06-07 1999-11-02 Littelfuse, Inc. Surface-mount fuse and the manufacture thereof
DE29616063U1 (de) * 1996-09-14 1996-10-31 Wickmann Werke Gmbh Elektrische Sicherung
US6013358A (en) * 1997-11-18 2000-01-11 Cooper Industries, Inc. Transient voltage protection device with ceramic substrate
US5812046A (en) * 1997-01-30 1998-09-22 Cooper Technologies, Inc. Subminiature fuse and method for making a subminiature fuse
US6782604B2 (en) * 1997-07-07 2004-08-31 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a chip PTC thermistor
US5939969A (en) * 1997-08-29 1999-08-17 Microelectronic Modules Corporation Preformed thermal fuse
US6373371B1 (en) * 1997-08-29 2002-04-16 Microelectronic Modules Corp. Preformed thermal fuse
US5923239A (en) * 1997-12-02 1999-07-13 Littelfuse, Inc. Printed circuit board assembly having an integrated fusible link
US5982268A (en) * 1998-03-31 1999-11-09 Uchihashi Estec Co., Ltd Thin type fuses
US6002322A (en) * 1998-05-05 1999-12-14 Littelfuse, Inc. Chip protector surface-mounted fuse device
JP4396787B2 (ja) * 1998-06-11 2010-01-13 内橋エステック株式会社 薄型温度ヒュ−ズ及び薄型温度ヒュ−ズの製造方法
US6331735B1 (en) * 1998-09-25 2001-12-18 Advanced Micro Devices, Inc. Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts
US6034589A (en) * 1998-12-17 2000-03-07 Aem, Inc. Multi-layer and multi-element monolithic surface mount fuse and method of making the same
US6078245A (en) * 1998-12-17 2000-06-20 Littelfuse, Inc. Containment of tin diffusion bar
US6201679B1 (en) * 1999-06-04 2001-03-13 California Micro Devices Corporation Integrated electrical overload protection device and method of formation
US6144284A (en) * 1999-06-07 2000-11-07 Santa Cruz; Cathy D. Blown fuse indicator cap and method of use
US20100044080A1 (en) * 1999-08-27 2010-02-25 Lex Kosowsky Metal Deposition
US7825491B2 (en) * 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
US20080035370A1 (en) * 1999-08-27 2008-02-14 Lex Kosowsky Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material
US7446030B2 (en) * 1999-08-27 2008-11-04 Shocking Technologies, Inc. Methods for fabricating current-carrying structures using voltage switchable dielectric materials
WO2001017320A1 (en) * 1999-08-27 2001-03-08 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US7695644B2 (en) * 1999-08-27 2010-04-13 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
US20100044079A1 (en) * 1999-08-27 2010-02-25 Lex Kosowsky Metal Deposition
US6456186B1 (en) 1999-10-27 2002-09-24 Motorola, Inc. Multi-terminal fuse device
US6794082B2 (en) * 2000-09-08 2004-09-21 Sony Corporation Alkaline battery
US6873027B2 (en) 2001-10-26 2005-03-29 International Business Machines Corporation Encapsulated energy-dissipative fuse for integrated circuits and method of making the same
US7570148B2 (en) * 2002-01-10 2009-08-04 Cooper Technologies Company Low resistance polymer matrix fuse apparatus and method
US7436284B2 (en) 2002-01-10 2008-10-14 Cooper Technologies Company Low resistance polymer matrix fuse apparatus and method
CN100408382C (zh) * 2003-11-26 2008-08-06 力特保险丝有限公司 交通工具电气保护装置及利用该装置的系统
US7885083B2 (en) * 2003-12-31 2011-02-08 Honeywell International, Inc. Input transient protection for electronic devices
CN1957434B (zh) 2004-03-05 2010-05-12 力特保险丝有限公司 汽车用叶片式熔断器
US20060128072A1 (en) * 2004-12-13 2006-06-15 Lsi Logic Corporation Method of protecting fuses in an integrated circuit die
US7477130B2 (en) * 2005-01-28 2009-01-13 Littelfuse, Inc. Dual fuse link thin film fuse
CN100390934C (zh) * 2005-04-12 2008-05-28 大毅科技股份有限公司 芯片保险丝的制造方法及其成品
DE102005024347B8 (de) * 2005-05-27 2010-07-08 Infineon Technologies Ag Elektrisches Bauteil mit abgesichertem Stromzuführungsanschluss
WO2007032240A1 (ja) * 2005-09-13 2007-03-22 Matsushita Electric Industrial Co., Ltd. 静電気対策部品
CN101313382A (zh) 2005-10-03 2008-11-26 保险丝公司 具有空腔形成外壳的熔丝
WO2007062122A2 (en) 2005-11-22 2007-05-31 Shocking Technologies, Inc. Semiconductor devices including voltage switchable materials for over-voltage protection
US20100263200A1 (en) * 2005-11-22 2010-10-21 Lex Kosowsky Wireless communication device using voltage switchable dielectric material
US20080032049A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having high aspect ratio particles
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
US7968010B2 (en) * 2006-07-29 2011-06-28 Shocking Technologies, Inc. Method for electroplating a substrate
US7710236B2 (en) * 2006-08-01 2010-05-04 Delphi Technologies, Inc. Fuse systems with serviceable connections
EP2084748A4 (de) 2006-09-24 2011-09-28 Shocking Technologies Inc Formulierungen für ein spannungsumschaltbares dielektrisches material mit einem abgestuften spannungsansprechverhalten und herstellungsverfahren dafür
US20120119168A9 (en) * 2006-11-21 2012-05-17 Robert Fleming Voltage switchable dielectric materials with low band gap polymer binder or composite
DE102007014334A1 (de) * 2007-03-26 2008-10-02 Robert Bosch Gmbh Schmelzlegierungselement, Thermosicherung mit einem Schmelzlegierungselement sowie Verfahren zum Herstellen einer Thermosicherung
US7983024B2 (en) 2007-04-24 2011-07-19 Littelfuse, Inc. Fuse card system for automotive circuit protection
US7793236B2 (en) * 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US20090009281A1 (en) * 2007-07-06 2009-01-08 Cyntec Company Fuse element and manufacturing method thereof
JP4510858B2 (ja) * 2007-08-08 2010-07-28 釜屋電機株式会社 チップヒューズ及びその製造方法
US9190235B2 (en) * 2007-12-29 2015-11-17 Cooper Technologies Company Manufacturability of SMD and through-hole fuses using laser process
TWI421996B (zh) 2008-01-10 2014-01-01 Ind Tech Res Inst 靜電放電防護架構
US8077007B2 (en) 2008-01-14 2011-12-13 Littlelfuse, Inc. Blade fuse
US8206614B2 (en) * 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
KR20090090161A (ko) * 2008-02-20 2009-08-25 삼성전자주식회사 전기적 퓨즈 소자
CN101527236B (zh) * 2008-03-03 2011-07-27 邱鸿智 压模式保险丝结构及其制造方法
US8203421B2 (en) * 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US8525633B2 (en) * 2008-04-21 2013-09-03 Littelfuse, Inc. Fusible substrate
KR100994978B1 (ko) * 2008-07-23 2010-11-18 (주) 이피웍스 입체형 반도체 디바이스, 그 제조방법 및 입체형 반도체디바이스의 퓨즈 패턴을 이용한 전기적 차단 방법
US20100047535A1 (en) * 2008-08-22 2010-02-25 Lex Kosowsky Core layer structure having voltage switchable dielectric material
WO2010033635A1 (en) * 2008-09-17 2010-03-25 Shocking Technologies, Inc. Voltage switchable dielectric material containing boron compound
US9208930B2 (en) * 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductive core shelled particles
US9208931B2 (en) * 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
US8362871B2 (en) * 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
EP2412212A1 (de) 2009-03-26 2012-02-01 Shocking Technologies Inc Komponenten mit spannungsumschaltbaren dielektrischen materialien
US9053844B2 (en) * 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
US20110198544A1 (en) * 2010-02-18 2011-08-18 Lex Kosowsky EMI Voltage Switchable Dielectric Materials Having Nanophase Materials
US9320135B2 (en) * 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US9224728B2 (en) * 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
PL2408277T3 (pl) * 2010-07-16 2016-08-31 Schurter Ag Element bezpiecznikowy
US9847203B2 (en) * 2010-10-14 2017-12-19 Avx Corporation Low current fuse
US9558905B2 (en) 2011-10-27 2017-01-31 Littelfuse, Inc. Fuse with insulated plugs
US9202656B2 (en) 2011-10-27 2015-12-01 Littelfuse, Inc. Fuse with cavity block
US9673012B2 (en) * 2012-05-16 2017-06-06 Littelfuse, Inc. Low-current fuse stamping method
CN104813433B (zh) * 2012-09-28 2017-10-24 釜屋电机株式会社 片式熔断器和片式熔断器的制造方法
CN103035623B (zh) * 2012-12-03 2015-04-22 Aem科技(苏州)股份有限公司 静电保护器及制作方法
JP5939311B2 (ja) * 2013-01-11 2016-06-22 株式会社村田製作所 ヒューズ
US20150102896A1 (en) * 2013-10-11 2015-04-16 Littelfuse, Inc. Barrier layer for electrical fuses utilizing the metcalf effect
KR101533996B1 (ko) * 2014-10-23 2015-07-06 주식회사 에스엠하이테크 온도 퓨즈 기능을 가진 smd형 마이크로 복합 퓨즈 및 그 제조방법
US9953749B2 (en) * 2016-08-30 2018-04-24 Samsung Electro-Mechanics Co., Ltd. Resistor element and resistor element assembly
DE102016220058A1 (de) * 2016-10-14 2018-04-19 Continental Automotive Gmbh Schaltungsanordnung mit einer Schmelzsicherung, Kraftfahrzeug und Verfahren zum Herstellen der Schaltungsanordnung
WO2018112753A1 (en) * 2016-12-20 2018-06-28 Dow Global Technologies Llc Multicolor paint composition

Family Cites Families (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3500276A (en) * 1967-10-25 1970-03-10 Texas Instruments Inc Electrical fuse and heater units
US3619725A (en) * 1970-04-08 1971-11-09 Rca Corp Electrical fuse link
US3913219A (en) * 1974-05-24 1975-10-21 Lichtblau G J Planar circuit fabrication process
GB1477572A (en) * 1975-01-10 1977-06-22 Krasnodar Z Elektroizmeritel P Printed resistor and method of manufacturing thereof
US4164725A (en) * 1977-08-01 1979-08-14 Wiebe Gerald L Three-piece solderless plug-in electrically conducting component
US4278706A (en) * 1977-12-15 1981-07-14 Trx, Inc. Method for making discrete electrical components
GB1604820A (en) * 1978-05-30 1981-12-16 Laur Knudson Nordisk Elektrici Electrical safety fuses
US4198744A (en) * 1978-08-16 1980-04-22 Harris Corporation Process for fabrication of fuse and interconnects
DE3033323A1 (de) * 1979-09-11 1981-03-26 Rohm Co. Ltd., Kyoto Schutzvorrichtung fuer eine halbleitervorrichtung
JPS5716292A (en) * 1980-07-01 1982-01-27 Sanden Corp Scroll type compressor
DE3044711A1 (de) * 1980-11-27 1982-07-01 Wickmann-Werke GmbH, 5810 Witten Schmelzsicherung
FR2513032B1 (fr) * 1981-09-14 1985-12-13 Carreras Michelle Dispositif de protection integre contre les surtensions d'un circuit electronique, et circuit electronique protege par ce dispositif
US4554732A (en) * 1982-02-16 1985-11-26 General Electric Company High reliability electrical components
US4503415A (en) * 1983-06-06 1985-03-05 Commercial Enclosed Fuse Co. Of Nj Encapsulated hot spot fuse link
US4540969A (en) * 1983-08-23 1985-09-10 Hughes Aircraft Company Surface-metalized, bonded fuse with mechanically-stabilized end caps
US4626818A (en) * 1983-11-28 1986-12-02 Centralab, Inc. Device for programmable thick film networks
US4533896A (en) * 1983-11-28 1985-08-06 Northern Telecom Limited Fuse for thick film device
US4514718A (en) * 1983-12-02 1985-04-30 Emerson Electric Co. Thermal cutoff construction, member therefor and methods of making the same
US4612529A (en) * 1985-03-25 1986-09-16 Cooper Industries, Inc. Subminiature fuse
US4837520A (en) * 1985-03-29 1989-06-06 Honeywell Inc. Fuse status detection circuit
DE3530354A1 (de) * 1985-08-24 1987-03-05 Opel Adam Ag Elektrische sicherungsanordnung
US4792781A (en) * 1986-02-21 1988-12-20 Tdk Corporation Chip-type resistor
US4652848A (en) * 1986-06-06 1987-03-24 Northern Telecom Limited Fusible link
US4726991A (en) * 1986-07-10 1988-02-23 Eos Technologies Inc. Electrical overstress protection material and process
JPH0831303B2 (ja) * 1986-12-01 1996-03-27 オムロン株式会社 チツプ型ヒユ−ズ
US5155462A (en) * 1987-01-22 1992-10-13 Morrill Glasstek, Inc. Sub-miniature electrical component, particularly a fuse
US4720402A (en) * 1987-01-30 1988-01-19 American Telephone And Telegraph Company Method for dispensing viscous material
US4924203A (en) * 1987-03-24 1990-05-08 Cooper Industries, Inc. Wire bonded microfuse and method of making
US4771260A (en) * 1987-03-24 1988-09-13 Cooper Industries, Inc. Wire bonded microfuse and method of making
DE3743857A1 (de) * 1987-07-30 1989-02-09 Wickmann Werke Gmbh Elektrische sicherung und verfahren zu ihrer herstellung
DE3728489A1 (de) * 1987-08-26 1989-03-09 Siemens Ag Elektrische schmelzsicherung
JPH0766734B2 (ja) * 1987-09-01 1995-07-19 矢崎総業株式会社 ヒューズの製造方法
US5165166A (en) * 1987-09-29 1992-11-24 Microelectronics And Computer Technology Corporation Method of making a customizable circuitry
US4788523A (en) * 1987-12-10 1988-11-29 United States Of America Viad chip resistor
US4977357A (en) * 1988-01-11 1990-12-11 Shrier Karen P Overvoltage protection device and material
US4873506A (en) * 1988-03-09 1989-10-10 Cooper Industries, Inc. Metallo-organic film fractional ampere fuses and method of making
JP2964478B2 (ja) * 1988-08-03 1999-10-18 コーア株式会社 表面実装型チップ状ヒューズ抵抗器とその製造方法
WO1990014342A1 (en) * 1989-05-24 1990-11-29 Pharmacia Ab Substituted isoxazolidines and isoxazolines
GB8913450D0 (en) * 1989-06-12 1989-08-02 Philips Electronic Associated Electrical device manufacture,particularly infrared detector arrays
US4975551A (en) * 1989-12-22 1990-12-04 S & C Electric Company Arc-extinguishing composition and articles manufactured therefrom
US5102712A (en) * 1990-02-13 1992-04-07 Conductive Containers, Inc. Process for conformal coating of printed circuit boards
ATE113755T1 (de) * 1990-03-13 1994-11-15 Morrill Glasstek Inc Elektrisches bauteil (sicherung) und dessen herstellungsverfahren.
US5097246A (en) * 1990-04-16 1992-03-17 Cooper Industries, Inc. Low amperage microfuse
CH682959A5 (fr) * 1990-05-04 1993-12-15 Battelle Memorial Institute Fusible.
JPH0433230A (ja) * 1990-05-29 1992-02-04 Mitsubishi Materials Corp チップ型ヒューズ
US5232758A (en) * 1990-09-04 1993-08-03 Motorola, Inc. Non-hardening solvent removable hydrophobic conformal coatings
US5084691A (en) * 1990-10-01 1992-01-28 Motorola, Inc. Controllable fuse
US5148141A (en) * 1991-01-03 1992-09-15 Gould Inc. Fuse with thin film fusible element supported on a substrate
US5115220A (en) * 1991-01-03 1992-05-19 Gould, Inc. Fuse with thin film fusible element supported on a substrate
JPH04242036A (ja) * 1991-01-16 1992-08-28 Hitachi Chem Co Ltd チップ型ヒューズの製造法
JPH04248221A (ja) * 1991-01-23 1992-09-03 Hitachi Chem Co Ltd チップ型ヒューズの製造法
JPH04245132A (ja) * 1991-01-30 1992-09-01 Hitachi Chem Co Ltd チップヒューズ用基板及びそれを用いたチップヒューズ
JPH04254302A (ja) * 1991-01-30 1992-09-09 Matsushita Electric Ind Co Ltd 機能修正用角形チップ抵抗器およびそのトリミング方法
JPH04245129A (ja) * 1991-01-30 1992-09-01 Hitachi Chem Co Ltd チップ型ヒューズ
JPH04254132A (ja) * 1991-02-05 1992-09-09 Matsushita Electric Ind Co Ltd 調理装置
JPH04255627A (ja) * 1991-02-08 1992-09-10 Hitachi Chem Co Ltd チップ型ヒューズの製造法
US5102506A (en) * 1991-04-10 1992-04-07 The Boeing Company Zinc-based microfuse
US5095297A (en) * 1991-05-14 1992-03-10 Gould Inc. Thin film fuse construction
US5097247A (en) * 1991-06-03 1992-03-17 North American Philips Corporation Heat actuated fuse apparatus with solder link
JPH05166454A (ja) * 1991-12-11 1993-07-02 Hitachi Chem Co Ltd チップ型ヒューズ
US5166656A (en) * 1992-02-28 1992-11-24 Avx Corporation Thin film surface mount fuses
JPH05314888A (ja) * 1992-05-08 1993-11-26 Towa Electron Kk 金属箔ヒューズの製造法
JPH0636672A (ja) * 1992-07-16 1994-02-10 Sumitomo Wiring Syst Ltd カード型ヒューズおよびその製造方法
JP2754124B2 (ja) * 1992-09-18 1998-05-20 富士通東和エレクトロン株式会社 金属箔ヒューズの製造法
US5262754A (en) * 1992-09-23 1993-11-16 Electromer Corporation Overvoltage protection element
US5285099A (en) * 1992-12-15 1994-02-08 International Business Machines Corporation SiCr microfuses
US5374590A (en) * 1993-04-28 1994-12-20 International Business Machines Corporation Fabrication and laser deletion of microfuses
US5363082A (en) * 1993-10-27 1994-11-08 Rapid Development Services, Inc. Flip chip microfuse
US5537108A (en) * 1994-02-08 1996-07-16 Prolinx Labs Corporation Method and structure for programming fuses
US5552757A (en) * 1994-05-27 1996-09-03 Littelfuse, Inc. Surface-mounted fuse device
US5592016A (en) * 1995-04-14 1997-01-07 Actel Corporation Antifuse with improved antifuse material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004033251B3 (de) * 2004-07-08 2006-03-09 Vishay Bccomponents Beyschlag Gmbh Schmelzsicherung für einem Chip

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CN1153577A (zh) 1997-07-02
US6023028A (en) 2000-02-08
EP0761012A1 (de) 1997-03-12
JP3160294B2 (ja) 2001-04-25
US5552757A (en) 1996-09-03
WO1995033276A1 (en) 1995-12-07
CN1189913C (zh) 2005-02-16
AU2602495A (en) 1995-12-21
EP0761012B1 (de) 1999-09-29
CA2191346A1 (en) 1995-12-07
US5844477A (en) 1998-12-01
AU691620B2 (en) 1998-05-21
DE69512519D1 (de) 1999-11-04
US5943764A (en) 1999-08-31
JPH09510824A (ja) 1997-10-28

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