DE69514053T2 - Leiterplatte mit bimetallischer Wärmesenke - Google Patents

Leiterplatte mit bimetallischer Wärmesenke

Info

Publication number
DE69514053T2
DE69514053T2 DE69514053T DE69514053T DE69514053T2 DE 69514053 T2 DE69514053 T2 DE 69514053T2 DE 69514053 T DE69514053 T DE 69514053T DE 69514053 T DE69514053 T DE 69514053T DE 69514053 T2 DE69514053 T2 DE 69514053T2
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
heat sink
bimetallic heat
bimetallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69514053T
Other languages
English (en)
Other versions
DE69514053D1 (de
Inventor
Brenda J Nation
Prathap Amerwai Reddy
Larry Leroy Kneisel
Jay Deavis Baker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ford Motor Co
Original Assignee
Ford Motor Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ford Motor Co filed Critical Ford Motor Co
Publication of DE69514053D1 publication Critical patent/DE69514053D1/de
Application granted granted Critical
Publication of DE69514053T2 publication Critical patent/DE69514053T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69514053T 1994-08-08 1995-07-17 Leiterplatte mit bimetallischer Wärmesenke Expired - Fee Related DE69514053T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/287,033 US5469329A (en) 1994-08-08 1994-08-08 Printed circuit board with bi-metallic heat spreader

Publications (2)

Publication Number Publication Date
DE69514053D1 DE69514053D1 (de) 2000-01-27
DE69514053T2 true DE69514053T2 (de) 2000-04-20

Family

ID=23101188

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69514053T Expired - Fee Related DE69514053T2 (de) 1994-08-08 1995-07-17 Leiterplatte mit bimetallischer Wärmesenke

Country Status (4)

Country Link
US (1) US5469329A (de)
EP (1) EP0696882B1 (de)
JP (1) JPH0864733A (de)
DE (1) DE69514053T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10325862A1 (de) * 2003-06-06 2004-12-23 Bayerische Motoren Werke Ag Festoxid-Brennstoffzelle mit einem metallischen Trägersubstrat

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2718758B1 (fr) * 1994-04-18 1996-06-14 Aerospatiale Procédé et machine pour la réalisation d'une armature pour une pièce de matière composite.
US5955960A (en) * 1997-03-24 1999-09-21 Jean-Luc Monnier Tamper resistant electronic lock and method of using same
US6278607B1 (en) 1998-08-06 2001-08-21 Dell Usa, L.P. Smart bi-metallic heat spreader
US6212071B1 (en) * 1999-08-20 2001-04-03 Lucent Technologies, Inc. Electrical circuit board heat dissipation system
US6409930B1 (en) 1999-11-01 2002-06-25 Bmc Industries, Inc. Lamination of circuit sub-elements while assuring registration
US6365057B1 (en) 1999-11-01 2002-04-02 Bmc Industries, Inc. Circuit manufacturing using etched tri-metal media
US6468439B1 (en) 1999-11-01 2002-10-22 Bmc Industries, Inc. Etching of metallic composite articles
DE10315438A1 (de) * 2003-04-03 2004-10-14 Conti Temic Microelectronic Gmbh Anordnung von elektrischen und/oder mechanischen Komponenten auf einer großen, flexiblen Folienleiterfläche
US7906845B1 (en) 2008-04-23 2011-03-15 Amkor Technology, Inc. Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor
EP2334361A4 (de) * 2008-08-27 2011-10-26 Patrick C Melder Nasales ventilationssystem und verwendungsverfahren dafür
CN104219932A (zh) * 2013-06-03 2014-12-17 联想(北京)有限公司 一种电子设备
US20150301568A1 (en) * 2014-04-18 2015-10-22 Laird Technologies, Inc. Thermal Solutions and Methods for Dissipating Heat from Electronic Devices Using the Same Side of an Anisotropic Heat Spreader

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4034468A (en) * 1976-09-03 1977-07-12 Ibm Corporation Method for making conduction-cooled circuit package
FR2511193A1 (fr) * 1981-08-07 1983-02-11 Thomson Csf Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique
US4811166A (en) * 1986-07-02 1989-03-07 Texas Instruments Incorporated Heat dissipating member for mounting a semiconductor device and electrical circuit unit incorporating the member
DE3722119A1 (de) * 1987-07-03 1989-01-12 Siemens Ag Schaltungsmodul mit einem plattenfoermigen schaltungstraeger aus glas oder keramik
DE9007236U1 (de) * 1990-06-29 1991-10-31 Robert Bosch Gmbh, 7000 Stuttgart, De

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10325862A1 (de) * 2003-06-06 2004-12-23 Bayerische Motoren Werke Ag Festoxid-Brennstoffzelle mit einem metallischen Trägersubstrat

Also Published As

Publication number Publication date
EP0696882A1 (de) 1996-02-14
US5469329A (en) 1995-11-21
EP0696882B1 (de) 1999-12-22
DE69514053D1 (de) 2000-01-27
JPH0864733A (ja) 1996-03-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee