DE69515764T2 - Oberflächenmontierbarer Verbinder mit niedriger Impedanz zum Verbinden von Schaltungsteilen und dessen Verwendung - Google Patents

Oberflächenmontierbarer Verbinder mit niedriger Impedanz zum Verbinden von Schaltungsteilen und dessen Verwendung

Info

Publication number
DE69515764T2
DE69515764T2 DE69515764T DE69515764T DE69515764T2 DE 69515764 T2 DE69515764 T2 DE 69515764T2 DE 69515764 T DE69515764 T DE 69515764T DE 69515764 T DE69515764 T DE 69515764T DE 69515764 T2 DE69515764 T2 DE 69515764T2
Authority
DE
Germany
Prior art keywords
surface mount
low impedance
connecting circuit
circuit parts
impedance connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69515764T
Other languages
English (en)
Other versions
DE69515764D1 (de
Inventor
Ronald Leavitt Law
Steven Aubrey Shewmake
Apurba Roy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of DE69515764D1 publication Critical patent/DE69515764D1/de
Publication of DE69515764T2 publication Critical patent/DE69515764T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1084—Notched leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
DE69515764T 1994-09-08 1995-08-30 Oberflächenmontierbarer Verbinder mit niedriger Impedanz zum Verbinden von Schaltungsteilen und dessen Verwendung Expired - Fee Related DE69515764T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/302,559 US5588848A (en) 1994-09-08 1994-09-08 Low inductance surface-mount connectors for interconnecting circuit devices and method for using same

Publications (2)

Publication Number Publication Date
DE69515764D1 DE69515764D1 (de) 2000-04-27
DE69515764T2 true DE69515764T2 (de) 2000-08-31

Family

ID=23168264

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69515764T Expired - Fee Related DE69515764T2 (de) 1994-09-08 1995-08-30 Oberflächenmontierbarer Verbinder mit niedriger Impedanz zum Verbinden von Schaltungsteilen und dessen Verwendung

Country Status (8)

Country Link
US (1) US5588848A (de)
EP (1) EP0701298B1 (de)
JP (1) JP3168242B2 (de)
KR (1) KR960013144A (de)
AU (1) AU682622B2 (de)
CA (1) CA2155257C (de)
DE (1) DE69515764T2 (de)
TW (1) TW271014B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10333566A1 (de) * 2003-07-23 2005-02-10 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Verbindungsanordnung

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US6146155A (en) * 1997-09-16 2000-11-14 3M Innovative Properties Company Recyclable locater device for board mounted connectors
JPH11186688A (ja) * 1997-10-14 1999-07-09 Murata Mfg Co Ltd ハイブリッドｉｃおよびそれを用いた電子装置
US6175500B1 (en) * 1998-09-22 2001-01-16 Lucent Technologies Inc. Surface mount thermal connections
US6189203B1 (en) 1999-04-08 2001-02-20 Lucent Technologies Inc. Method of manufacturing a surface mountable power supply module
US6310301B1 (en) 1999-04-08 2001-10-30 Randy T. Heinrich Inter-substrate conductive mount for a circuit board, circuit board and power magnetic device employing the same
DE10003696A1 (de) * 2000-01-28 2001-08-09 Eupec Gmbh & Co Kg Abnahmeeinrichtung für elektrischen Strom
US6503088B2 (en) * 2000-12-15 2003-01-07 Di/Dt, Inc. I-channel surface-mount connector with extended flanges
US6750396B2 (en) * 2000-12-15 2004-06-15 Di/Dt, Inc. I-channel surface-mount connector
DE10215985A1 (de) * 2002-04-11 2003-11-06 Siemens Ag Hochstrom-Kontaktelement zur Befestigung an einer Leiterplattenanordnung und Verwendung eines Hochstrom-Kontaktelements
US6786736B2 (en) 2002-08-23 2004-09-07 Artesyn Technologies, Inc. Surface mount interconnect and device including same
US20040048498A1 (en) * 2002-09-06 2004-03-11 Hong Huang Metallic surface mount technology power connector
US7065351B2 (en) 2003-01-30 2006-06-20 Qualcomm Incorporated Event-triggered data collection
US7123928B2 (en) * 2003-07-21 2006-10-17 Qualcomm Incorporated Method and apparatus for creating and using a base station almanac for position determination
WO2005106523A1 (en) 2004-04-02 2005-11-10 Qualcomm Incorporated Methods and apparatuses for beacon assisted position determination systems
US20050277313A1 (en) * 2004-06-09 2005-12-15 Aldrin Pangilinan Surface mountable pin assembly for a printed circuit board
US20060046525A1 (en) * 2004-08-27 2006-03-02 Allan Mark Printed circuit board type connector using surface mount and through hole technologies
JP4676855B2 (ja) * 2005-10-03 2011-04-27 ローム株式会社 ハイブリッド集積回路装置とその製造方法
US7740066B2 (en) * 2008-01-25 2010-06-22 Halliburton Energy Services, Inc. Additives for high alumina cements and associated methods
US8478228B2 (en) 2008-10-20 2013-07-02 Qualcomm Incorporated Mobile receiver with location services capability
US8600297B2 (en) 2009-07-28 2013-12-03 Qualcomm Incorporated Method and system for femto cell self-timing and self-locating
USD749292S1 (en) * 2014-10-14 2016-02-16 Time And Oak, Inc. Beverage flavoring element
USD747582S1 (en) * 2015-05-01 2016-01-12 Ronald Kenneth Weller Seat belt cleaner
JP6542573B2 (ja) * 2015-05-11 2019-07-10 フジコン株式会社 基板端子
JP6572820B2 (ja) * 2016-04-25 2019-09-11 富士通株式会社 電源供給構造
JP7144245B2 (ja) * 2018-08-31 2022-09-29 日本航空電子工業株式会社 はんだ付け部品

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Publication number Priority date Publication date Assignee Title
FR2192437B1 (de) * 1972-07-10 1974-10-25 Radiotechnique Compelec
US4605278A (en) * 1985-05-24 1986-08-12 North American Specialties Corporation Solder-bearing leads
US4629267A (en) * 1984-10-12 1986-12-16 Gte Communication Systems Corporation Circuit terminating device
JPS6427293A (en) * 1987-07-22 1989-01-30 Fujitsu Ltd Method of mount chip component
US4915652A (en) * 1989-06-12 1990-04-10 Thomas & Betts Corporation Shielded electrical connector
US5256086A (en) * 1992-12-04 1993-10-26 Molex Incorporated Electrical connector shield and method of fabricating same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10333566A1 (de) * 2003-07-23 2005-02-10 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Verbindungsanordnung

Also Published As

Publication number Publication date
CA2155257C (en) 1999-12-21
EP0701298A2 (de) 1996-03-13
JP3168242B2 (ja) 2001-05-21
CA2155257A1 (en) 1996-03-09
EP0701298A3 (de) 1997-05-02
AU682622B2 (en) 1997-10-09
EP0701298B1 (de) 2000-03-22
JPH08195234A (ja) 1996-07-30
DE69515764D1 (de) 2000-04-27
TW271014B (en) 1996-02-21
US5588848A (en) 1996-12-31
KR960013144A (ko) 1996-04-20
AU3040495A (en) 1996-03-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee