DE69523991T2 - Löt-Anschlusskontakt und Verfahren zu seiner Herstellung - Google Patents

Löt-Anschlusskontakt und Verfahren zu seiner Herstellung

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Publication number
DE69523991T2
DE69523991T2 DE69523991T DE69523991T DE69523991T2 DE 69523991 T2 DE69523991 T2 DE 69523991T2 DE 69523991 T DE69523991 T DE 69523991T DE 69523991 T DE69523991 T DE 69523991T DE 69523991 T2 DE69523991 T2 DE 69523991T2
Authority
DE
Germany
Prior art keywords
layer
solder
crcu
improved
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69523991T
Other languages
English (en)
Other versions
DE69523991D1 (de
Inventor
Nye Atkinson Iii
Jeffrey Frederick Roeder
Ho-Ming Tong
Paul Anthony Totta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69523991D1 publication Critical patent/DE69523991D1/de
Publication of DE69523991T2 publication Critical patent/DE69523991T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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DE69523991T 1994-06-28 1995-05-19 Löt-Anschlusskontakt und Verfahren zu seiner Herstellung Expired - Lifetime DE69523991T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/267,339 US5503286A (en) 1994-06-28 1994-06-28 Electroplated solder terminal

Publications (2)

Publication Number Publication Date
DE69523991D1 DE69523991D1 (de) 2002-01-03
DE69523991T2 true DE69523991T2 (de) 2002-08-01

Family

ID=23018386

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69523991T Expired - Lifetime DE69523991T2 (de) 1994-06-28 1995-05-19 Löt-Anschlusskontakt und Verfahren zu seiner Herstellung

Country Status (11)

Country Link
US (2) US5503286A (de)
EP (1) EP0690504B1 (de)
JP (1) JP3210547B2 (de)
KR (1) KR100213152B1 (de)
CN (1) CN1126170C (de)
AT (1) ATE209397T1 (de)
BR (1) BR9502623A (de)
DE (1) DE69523991T2 (de)
ES (1) ES2165902T3 (de)
MY (1) MY115355A (de)
TW (1) TW344888B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015012766A1 (de) * 2014-12-22 2016-06-23 Stmicroelectronics S.R.L. Elektrische Kontaktstruktur mit Diffusionsbarriere für eine elektronische Vorrichtung und Verfahren zum Herstellen der elektrischen Kontaktstruktur

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996029735A1 (en) * 1995-03-20 1996-09-26 Philips Electronics N.V. Semiconductor device of the type sealed in glass comprising a semiconductor body connected to slugs by means of a silver-aluminium bonding layer
EP1134805B1 (de) 1995-03-20 2004-07-21 Unitive International Limited Löthöcker-Herstellungsverfahren und Strukturen mit einer Titan-Sperrschicht
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CN1117655A (zh) 1996-02-28
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