DE69533910D1 - Messfühlersystem und Messverfahren - Google Patents
Messfühlersystem und MessverfahrenInfo
- Publication number
- DE69533910D1 DE69533910D1 DE69533910T DE69533910T DE69533910D1 DE 69533910 D1 DE69533910 D1 DE 69533910D1 DE 69533910 T DE69533910 T DE 69533910T DE 69533910 T DE69533910 T DE 69533910T DE 69533910 D1 DE69533910 D1 DE 69533910D1
- Authority
- DE
- Germany
- Prior art keywords
- measuring method
- sensor system
- measuring
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8575994 | 1994-03-31 | ||
JP6085759A JP2986141B2 (ja) | 1994-03-31 | 1994-03-31 | プローブ装置 |
JP10461594A JP3156192B2 (ja) | 1994-04-19 | 1994-04-19 | プローブ方法及びその装置 |
JP10461594 | 1994-04-19 | ||
JP6104614A JP2986142B2 (ja) | 1994-04-19 | 1994-04-19 | プローブ方法 |
JP10461494 | 1994-04-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69533910D1 true DE69533910D1 (de) | 2005-02-17 |
DE69533910T2 DE69533910T2 (de) | 2005-12-15 |
Family
ID=27304954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69533910T Expired - Lifetime DE69533910T2 (de) | 1994-03-31 | 1995-03-31 | Messfühlersystem und Messverfahren |
Country Status (5)
Country | Link |
---|---|
US (2) | US5585738A (de) |
EP (1) | EP0675366B1 (de) |
KR (1) | KR100296646B1 (de) |
DE (1) | DE69533910T2 (de) |
TW (1) | TW278140B (de) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6104203A (en) * | 1995-05-16 | 2000-08-15 | Trio-Tech International | Test apparatus for electronic components |
US5946409A (en) * | 1995-05-31 | 1999-08-31 | Nec Corporation | Pick-up apparatus and method for semiconductor devices |
JP2993398B2 (ja) * | 1995-05-31 | 1999-12-20 | ニチデン機械株式会社 | ピックアップ装置及びピックアップ方法 |
EP0837333A3 (de) * | 1996-10-18 | 1999-06-09 | Tokyo Electron Limited | Gerät zur Ausrichtung eines Wafers mit einem Prüfkontaktfeld |
TW399279B (en) | 1997-05-08 | 2000-07-21 | Tokyo Electron Limtied | Prober and probe method |
JP3206509B2 (ja) * | 1997-08-22 | 2001-09-10 | 日本電気株式会社 | 表示パネル用プローブ装置 |
US6096567A (en) * | 1997-12-01 | 2000-08-01 | Electroglas, Inc. | Method and apparatus for direct probe sensing |
US6239590B1 (en) | 1998-05-26 | 2001-05-29 | Micron Technology, Inc. | Calibration target for calibrating semiconductor wafer test systems |
KR100319685B1 (ko) * | 1999-05-01 | 2002-01-09 | 이건환 | 웨이퍼 프로빙 방법 |
US6208375B1 (en) * | 1999-05-21 | 2001-03-27 | Elite Engineering Corporation | Test probe positioning method and system for micro-sized devices |
US6445202B1 (en) | 1999-06-30 | 2002-09-03 | Cascade Microtech, Inc. | Probe station thermal chuck with shielding for capacitive current |
JP2001144148A (ja) * | 2001-05-12 | 2001-05-25 | Advantest Corp | 半導体試験装置のウエハマップ表示装置 |
US6718227B1 (en) * | 1999-12-16 | 2004-04-06 | Texas Instruments Incorporated | System and method for determining a position error in a wafer handling device |
US6965226B2 (en) | 2000-09-05 | 2005-11-15 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US6914423B2 (en) | 2000-09-05 | 2005-07-05 | Cascade Microtech, Inc. | Probe station |
JP4689070B2 (ja) * | 2001-04-12 | 2011-05-25 | ルネサスエレクトロニクス株式会社 | 半導体素子試験装置およびこれを用いた半導体素子試験方法 |
US7071714B2 (en) | 2001-11-02 | 2006-07-04 | Formfactor, Inc. | Method and system for compensating for thermally induced motion of probe cards |
US6972578B2 (en) * | 2001-11-02 | 2005-12-06 | Formfactor, Inc. | Method and system for compensating thermally induced motion of probe cards |
AU2002237553A1 (en) * | 2002-03-07 | 2003-09-16 | Advantest Corporation | Electronic component testing apparatus |
US6794889B2 (en) * | 2002-04-26 | 2004-09-21 | Agilent Technologies, Inc. | Unified apparatus and method to assure probe card-to-wafer parallelism in semiconductor automatic wafer test, probe card measurement systems, and probe card manufacturing |
US7026832B2 (en) * | 2002-10-28 | 2006-04-11 | Dainippon Screen Mfg. Co., Ltd. | Probe mark reading device and probe mark reading method |
JP2004265895A (ja) * | 2003-01-20 | 2004-09-24 | Tokyo Electron Ltd | 光学的測長器を備えたプローブ装置及びプローブ検査方法 |
US7342402B2 (en) * | 2003-04-10 | 2008-03-11 | Formfactor, Inc. | Method of probing a device using captured image of probe structure in which probe tips comprise alignment features |
US7492172B2 (en) | 2003-05-23 | 2009-02-17 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US7250626B2 (en) | 2003-10-22 | 2007-07-31 | Cascade Microtech, Inc. | Probe testing structure |
US7187188B2 (en) | 2003-12-24 | 2007-03-06 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
JP5032170B2 (ja) * | 2007-03-23 | 2012-09-26 | 東京エレクトロン株式会社 | 検査装置 |
DE102005034475A1 (de) * | 2005-07-23 | 2007-01-25 | Atmel Germany Gmbh | Vorrichtung |
JP4908138B2 (ja) * | 2005-12-09 | 2012-04-04 | ルネサスエレクトロニクス株式会社 | プローブ検査装置 |
KR100805834B1 (ko) * | 2006-01-09 | 2008-02-21 | 삼성전자주식회사 | 수광소자의 테스트 장치 및 그 방법 |
JP4451416B2 (ja) * | 2006-05-31 | 2010-04-14 | 東京エレクトロン株式会社 | プローブ先端の検出方法、アライメント方法及びこれらの方法を記録した記憶媒体、並びにプローブ装置 |
KR100772547B1 (ko) | 2006-08-31 | 2007-11-02 | 주식회사 하이닉스반도체 | 반도체 장치 및 그의 테스트 방법 |
JP4939156B2 (ja) * | 2006-09-19 | 2012-05-23 | 東京エレクトロン株式会社 | 位置合わせ対象物の再登録方法及びその方法を記録した記録媒体 |
KR100709963B1 (ko) * | 2006-10-20 | 2007-04-25 | 주식회사 엠디플렉스 | 다수의 캐비티를 구비한 연성회로기판의 검사 시스템 및검사 방법 |
KR100790817B1 (ko) * | 2006-12-06 | 2008-01-03 | 삼성전자주식회사 | 반도체 제조관리 시스템 |
JP5018183B2 (ja) * | 2007-03-30 | 2012-09-05 | 東京エレクトロン株式会社 | プローブ装置、プロービング方法及び記憶媒体 |
JP5071131B2 (ja) | 2008-01-31 | 2012-11-14 | 東京エレクトロン株式会社 | プローブ装置 |
CN101629808B (zh) * | 2008-07-14 | 2011-05-18 | 京元电子股份有限公司 | 探针卡校正设备 |
US8319503B2 (en) | 2008-11-24 | 2012-11-27 | Cascade Microtech, Inc. | Test apparatus for measuring a characteristic of a device under test |
JP5324534B2 (ja) * | 2010-07-29 | 2013-10-23 | 株式会社日立ハイテクノロジーズ | 検査方法及び装置 |
JP5260703B2 (ja) * | 2011-06-10 | 2013-08-14 | パナソニック株式会社 | 3次元測定方法 |
US9019153B1 (en) * | 2011-12-20 | 2015-04-28 | Raytheon Company | Calibration of large phased arrays using fourier gauge |
CN102565677A (zh) * | 2012-01-19 | 2012-07-11 | 嘉兴景焱智能装备技术有限公司 | 一种芯片的测试方法及其测试装置和该装置的使用方法 |
WO2014132855A1 (ja) * | 2013-02-27 | 2014-09-04 | 株式会社東京精密 | プローブ装置 |
JP6205225B2 (ja) | 2013-03-25 | 2017-09-27 | 東京エレクトロン株式会社 | 基板検査装置及び基板温度調整方法 |
JP6137994B2 (ja) * | 2013-08-28 | 2017-05-31 | 東京エレクトロン株式会社 | デバイス検査方法 |
CN103472303B (zh) * | 2013-09-10 | 2015-12-23 | 南通大学 | 基于多功能自动四探针测试仪的样品测试方法 |
JP6415281B2 (ja) * | 2014-12-05 | 2018-10-31 | 東京エレクトロン株式会社 | プローブ装置及びプローブ方法 |
CN105445643A (zh) * | 2015-11-12 | 2016-03-30 | 杭州长川科技股份有限公司 | 一种全自动探针台图像定位系统 |
CN105486995B (zh) * | 2015-12-07 | 2018-08-17 | 杭州长川科技股份有限公司 | 全自动探针台图像定位装置及视觉对准方法 |
CN105513990B (zh) * | 2015-12-07 | 2018-02-02 | 杭州长川科技股份有限公司 | 一种探针台图像定位装置及视觉对准方法 |
TWI627414B (zh) * | 2017-03-29 | 2018-06-21 | Probe card detection method and system | |
KR102615555B1 (ko) * | 2018-03-29 | 2023-12-19 | 삼성디스플레이 주식회사 | 표시 장치의 제조 장치 및 표시 장치의 제조 방법 |
US11287475B2 (en) * | 2020-06-03 | 2022-03-29 | Mpi Corporation | Method for compensating to distance between probe tip and device under test after temperature changes |
TWI790515B (zh) * | 2020-12-21 | 2023-01-21 | 矽品精密工業股份有限公司 | 測試裝置及測試方法 |
TWI779978B (zh) * | 2021-12-29 | 2022-10-01 | 卓金星 | 載物平台裝置及包括該載物平台裝置之量測裝置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0194631A (ja) * | 1987-10-06 | 1989-04-13 | Canon Inc | ウエハプローバ |
JPH01119036A (ja) * | 1987-10-31 | 1989-05-11 | Canon Inc | ウエハプローバ |
US4929893A (en) * | 1987-10-06 | 1990-05-29 | Canon Kabushiki Kaisha | Wafer prober |
JPH03209737A (ja) * | 1990-01-11 | 1991-09-12 | Tokyo Electron Ltd | プローブ装置 |
WO1992008144A1 (en) * | 1990-10-29 | 1992-05-14 | International Business Machines Corporation | Alignment of wafer test probes |
US5321352A (en) * | 1991-08-01 | 1994-06-14 | Tokyo Electron Yamanashi Limited | Probe apparatus and method of alignment for the same |
JPH05198662A (ja) * | 1991-08-01 | 1993-08-06 | Tokyo Electron Yamanashi Kk | プローブ装置及び同装置におけるアライメント方法 |
KR100196195B1 (ko) * | 1991-11-18 | 1999-06-15 | 이노우에 쥰이치 | 프로우브 카드 |
-
1995
- 1995-03-31 EP EP95104818A patent/EP0675366B1/de not_active Expired - Lifetime
- 1995-03-31 DE DE69533910T patent/DE69533910T2/de not_active Expired - Lifetime
- 1995-03-31 US US08/414,590 patent/US5585738A/en not_active Expired - Lifetime
- 1995-03-31 KR KR1019950007253A patent/KR100296646B1/ko active IP Right Grant
- 1995-04-08 TW TW084103365A patent/TW278140B/zh not_active IP Right Cessation
-
1996
- 1996-04-18 US US08/634,675 patent/US5640101A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69533910T2 (de) | 2005-12-15 |
EP0675366B1 (de) | 2005-01-12 |
KR950033489A (ko) | 1995-12-26 |
TW278140B (de) | 1996-06-11 |
US5585738A (en) | 1996-12-17 |
KR100296646B1 (ko) | 2001-10-24 |
US5640101A (en) | 1997-06-17 |
EP0675366A3 (de) | 1996-07-24 |
EP0675366A2 (de) | 1995-10-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |