DE69610919D1 - Methode und vorrichtung zur bestückung elektronischer bauteile - Google Patents

Methode und vorrichtung zur bestückung elektronischer bauteile

Info

Publication number
DE69610919D1
DE69610919D1 DE69610919T DE69610919T DE69610919D1 DE 69610919 D1 DE69610919 D1 DE 69610919D1 DE 69610919 T DE69610919 T DE 69610919T DE 69610919 T DE69610919 T DE 69610919T DE 69610919 D1 DE69610919 D1 DE 69610919D1
Authority
DE
Germany
Prior art keywords
electronic components
fitting electronic
fitting
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69610919T
Other languages
English (en)
Other versions
DE69610919T2 (de
Inventor
Kunio Ohe
Ryoji Inutsuka
Keiji Hanada
Naomi Nishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69610919D1 publication Critical patent/DE69610919D1/de
Application granted granted Critical
Publication of DE69610919T2 publication Critical patent/DE69610919T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/351—Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
DE69610919T 1995-06-13 1996-06-06 Methode und vorrichtung zur bestückung elektronischer bauteile Expired - Fee Related DE69610919T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14612895A JP3552791B2 (ja) 1995-06-13 1995-06-13 電子部品実装方法及び装置
PCT/JP1996/001529 WO1996042189A1 (fr) 1995-06-13 1996-06-06 Procede et dispositif de montage de pieces electroniques

Publications (2)

Publication Number Publication Date
DE69610919D1 true DE69610919D1 (de) 2000-12-14
DE69610919T2 DE69610919T2 (de) 2001-03-15

Family

ID=15400786

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69610919T Expired - Fee Related DE69610919T2 (de) 1995-06-13 1996-06-06 Methode und vorrichtung zur bestückung elektronischer bauteile

Country Status (5)

Country Link
US (1) US6256876B1 (de)
EP (1) EP0835050B1 (de)
JP (1) JP3552791B2 (de)
DE (1) DE69610919T2 (de)
WO (1) WO1996042189A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6792674B2 (en) 2000-04-28 2004-09-21 Hitachi High-Tech Instruments Company, Ltd. Apparatus for mounting electronic components
WO2002007196A1 (fr) * 2000-07-19 2002-01-24 Ibiden Co., Ltd. Dispositif chauffant ceramique pour la fabrication/verification de semi-conducteurs
WO2002007195A1 (fr) * 2000-07-19 2002-01-24 Ibiden Co., Ltd. Dispositif chauffant ceramique pour la fabrication/verification de semi-conducteurs, son procede de fabrication, et son systeme de fabrication
US20040035846A1 (en) * 2000-09-13 2004-02-26 Yasuji Hiramatsu Ceramic heater for semiconductor manufacturing and inspecting equipment
EP1282350B1 (de) * 2001-07-20 2006-04-26 Hitachi High-Tech Instruments Co., Ltd. Einrichtung zur Montage elektronischer Bauteile
US6875950B2 (en) * 2002-03-22 2005-04-05 Gsi Lumonics Corporation Automated laser trimming of resistors
JP5091406B2 (ja) * 2002-11-21 2012-12-05 ハドコ サンタ クララ，インコーポレイテッド レジスタのレーザトリミング
US7297896B2 (en) * 2002-11-21 2007-11-20 Hadco Santa Clara, Inc. Laser trimming of resistors
US6972391B2 (en) * 2002-11-21 2005-12-06 Hadco Santa Clara, Inc. Laser trimming of annular passive components
US7059195B1 (en) * 2004-12-02 2006-06-13 Honeywell International Inc. Disposable and trimmable wireless pressure sensor for medical applications
NL1029247C2 (nl) * 2005-06-14 2006-12-18 Assembleon Nv Werkwijze voor het instellen van ten minste een optionele instelling van een verwerkingseigenschap van de componentplaatsingsinrichting alsmede een dergelijke componentplaatsingsinrichting en elektronische sleutel.
JP4962635B1 (ja) * 2011-03-15 2012-06-27 オムロン株式会社 光半導体パッケージおよび光半導体モジュールならびにこれらの製造方法
CN102509600A (zh) * 2011-10-31 2012-06-20 上海交通大学 直滑式导塑电位器激光修刻机及修刻方法
JP2013115229A (ja) * 2011-11-29 2013-06-10 Panasonic Corp 部品実装方法及び部品実装システム
WO2016051533A1 (ja) * 2014-09-30 2016-04-07 富士機械製造株式会社 部品実装装置
US10631451B2 (en) * 2015-06-03 2020-04-21 Fuji Corporation Component mounting machine for preventing release fail of a component
CN111465308B (zh) * 2020-04-13 2021-04-06 温州职业技术学院 预制电路基板组装中心

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5950503A (ja) * 1982-09-16 1984-03-23 松下電器産業株式会社 電気回路調整装置
JPS60175445A (ja) * 1984-02-21 1985-09-09 Matsushita Electric Ind Co Ltd 電子回路の調整方法
US4573262A (en) * 1984-05-11 1986-03-04 Amp Incorporated Apparatus for force fitting components into a workpiece
US4998207A (en) * 1988-02-01 1991-03-05 Cooper Industries, Inc. Method of manufacture of circuit boards
JP2803221B2 (ja) * 1989-09-19 1998-09-24 松下電器産業株式会社 Ｉｃ実装装置及びその方法
US5003254A (en) * 1989-11-02 1991-03-26 Huntron, Inc. Multi-axis universal circuit board test fixture
US5209131A (en) * 1989-11-03 1993-05-11 Rank Taylor Hobson Metrology
US5166492A (en) * 1991-03-27 1992-11-24 Motorola, Inc. Laser power correlation system
TW222364B (de) 1992-05-28 1994-04-11 Digital Equipment Corp
JP3114034B2 (ja) * 1992-06-05 2000-12-04 ヤマハ発動機株式会社 部品実装方法及び部品実装装置
US5443534A (en) * 1992-07-21 1995-08-22 Vlt Corporation Providing electronic components for circuity assembly
BE1009814A5 (nl) * 1995-11-06 1997-08-05 Framatome Connectors Belgium Werkwijze en inrichting voor het aanbrengen van elektronische onderdelen in een plaat met gedrukte schakelingen.

Also Published As

Publication number Publication date
US6256876B1 (en) 2001-07-10
EP0835050A1 (de) 1998-04-08
EP0835050B1 (de) 2000-11-08
DE69610919T2 (de) 2001-03-15
JP3552791B2 (ja) 2004-08-11
JPH08340195A (ja) 1996-12-24
EP0835050A4 (de) 1998-09-23
WO1996042189A1 (fr) 1996-12-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee