DE69613352T2 - Aus mehreren lagen bestehende kollimatoranordnung für verbesserte höhenunterschiedbeschichtung und gleichmässigkeit - Google Patents

Aus mehreren lagen bestehende kollimatoranordnung für verbesserte höhenunterschiedbeschichtung und gleichmässigkeit

Info

Publication number
DE69613352T2
DE69613352T2 DE69613352T DE69613352T DE69613352T2 DE 69613352 T2 DE69613352 T2 DE 69613352T2 DE 69613352 T DE69613352 T DE 69613352T DE 69613352 T DE69613352 T DE 69613352T DE 69613352 T2 DE69613352 T2 DE 69613352T2
Authority
DE
Germany
Prior art keywords
evaluation
multiple layer
height differential
collimator arrangement
improved height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69613352T
Other languages
English (en)
Other versions
DE69613352D1 (de
Inventor
Zoran Krivokapic
S Bang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Application granted granted Critical
Publication of DE69613352D1 publication Critical patent/DE69613352D1/de
Publication of DE69613352T2 publication Critical patent/DE69613352T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3447—Collimators, shutters, apertures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
DE69613352T 1995-02-01 1996-01-11 Aus mehreren lagen bestehende kollimatoranordnung für verbesserte höhenunterschiedbeschichtung und gleichmässigkeit Expired - Fee Related DE69613352T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/382,366 US5643428A (en) 1995-02-01 1995-02-01 Multiple tier collimator system for enhanced step coverage and uniformity
PCT/US1996/000572 WO1996024155A1 (en) 1995-02-01 1996-01-11 Multiple tier collimator system for enhanced step coverage and uniformity

Publications (2)

Publication Number Publication Date
DE69613352D1 DE69613352D1 (de) 2001-07-19
DE69613352T2 true DE69613352T2 (de) 2002-04-25

Family

ID=23508642

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69613352T Expired - Fee Related DE69613352T2 (de) 1995-02-01 1996-01-11 Aus mehreren lagen bestehende kollimatoranordnung für verbesserte höhenunterschiedbeschichtung und gleichmässigkeit

Country Status (5)

Country Link
US (1) US5643428A (de)
EP (1) EP0809859B1 (de)
DE (1) DE69613352T2 (de)
TW (1) TW436895B (de)
WO (1) WO1996024155A1 (de)

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EP0682125A1 (de) * 1994-05-11 1995-11-15 Applied Materials, Inc. Kontrolle eines Materials, welches von einem Target zerstäubt wird
EP1643340B1 (de) 1995-02-13 2013-08-14 Intertrust Technologies Corp. Sicheres Transaktionsmanagement
US6157721A (en) 1996-08-12 2000-12-05 Intertrust Technologies Corp. Systems and methods using cryptography to protect secure computing environments
US5892900A (en) 1996-08-30 1999-04-06 Intertrust Technologies Corp. Systems and methods for secure transaction management and electronic rights protection
TW399245B (en) * 1997-10-29 2000-07-21 Nec Corp Sputtering apparatus for sputtering high melting point metal and method for manufacturing semiconductor device having high melting point metal
US6036821A (en) * 1998-01-29 2000-03-14 International Business Machines Corporation Enhanced collimated sputtering apparatus and its method of use
US6287436B1 (en) 1998-02-27 2001-09-11 Innovent, Inc. Brazed honeycomb collimator
US6482301B1 (en) 1998-06-04 2002-11-19 Seagate Technology, Inc. Target shields for improved magnetic properties of a recording medium
US6362097B1 (en) * 1998-07-14 2002-03-26 Applied Komatsu Technlology, Inc. Collimated sputtering of semiconductor and other films
US6592728B1 (en) * 1998-08-04 2003-07-15 Veeco-Cvc, Inc. Dual collimated deposition apparatus and method of use
US6365134B1 (en) 1999-07-07 2002-04-02 Scientific Pharmaceuticals, Inc. Process and composition for high efficacy teeth whitening
US7067115B2 (en) * 1999-07-07 2006-06-27 Scientific Pharmaceuticals, Inc. Process and composition for high efficacy teeth whitening
US6596598B1 (en) 2000-02-23 2003-07-22 Advanced Micro Devices, Inc. T-shaped gate device and method for making
US6521897B1 (en) * 2000-11-17 2003-02-18 The Regents Of The University Of California Ion beam collimating grid to reduce added defects
ES2269541T3 (es) * 2002-03-19 2007-04-01 Scheuten Glasgroep Dispositivo y procedimiento para la aplicacion dirigida de un material de deposito sobre un sustrato.
JP2003282981A (ja) * 2002-03-26 2003-10-03 Fujitsu Ltd ジョセフソン接合素子およびその製造方法
US20040086639A1 (en) * 2002-09-24 2004-05-06 Grantham Daniel Harrison Patterned thin-film deposition using collimating heated mask asembly
US20040202621A1 (en) * 2002-12-23 2004-10-14 Orlowski Jan A. Teeth whitening system based on the combination of hydrogen peroxide and carbamide peroxide
US20050006223A1 (en) * 2003-05-07 2005-01-13 Robert Nichols Sputter deposition masking and methods
TWI229908B (en) * 2004-03-08 2005-03-21 Univ Nat Chiao Tung Adjustable collimator and sputtering apparatus with the same
US7695590B2 (en) 2004-03-26 2010-04-13 Applied Materials, Inc. Chemical vapor deposition plasma reactor having plural ion shower grids
US7244474B2 (en) 2004-03-26 2007-07-17 Applied Materials, Inc. Chemical vapor deposition plasma process using an ion shower grid
US20050211547A1 (en) * 2004-03-26 2005-09-29 Applied Materials, Inc. Reactive sputter deposition plasma reactor and process using plural ion shower grids
US7291360B2 (en) * 2004-03-26 2007-11-06 Applied Materials, Inc. Chemical vapor deposition plasma process using plural ion shower grids
US7767561B2 (en) 2004-07-20 2010-08-03 Applied Materials, Inc. Plasma immersion ion implantation reactor having an ion shower grid
US8058156B2 (en) 2004-07-20 2011-11-15 Applied Materials, Inc. Plasma immersion ion implantation reactor having multiple ion shower grids
US7271111B2 (en) * 2005-06-08 2007-09-18 Advantech Global, Ltd Shadow mask deposition of materials using reconfigurable shadow masks
US20070012559A1 (en) * 2005-07-13 2007-01-18 Applied Materials, Inc. Method of improving magnetron sputtering of large-area substrates using a removable anode
US9194036B2 (en) * 2007-09-06 2015-11-24 Infineon Technologies Ag Plasma vapor deposition
CN103109344B (zh) * 2010-07-09 2016-02-10 欧瑞康先进科技股份公司 磁控管溅射设备
CN103814430A (zh) * 2011-08-17 2014-05-21 三星电子株式会社 溅射设备和用于形成发光器件的透射导电层的方法
CN105132861A (zh) * 2015-10-13 2015-12-09 京东方科技集团股份有限公司 一种蒸镀掩膜版以及蒸镀设备
US20180233335A1 (en) * 2016-03-14 2018-08-16 Kabushiki Kaisha Toshiba Processing device and collimator
JP6105115B1 (ja) 2016-03-14 2017-03-29 株式会社東芝 処理装置及びコリメータ
USD858468S1 (en) * 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) * 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
GB201909538D0 (en) * 2019-07-02 2019-08-14 Spts Technologies Ltd Deposition apparatus
US20210135085A1 (en) * 2019-11-06 2021-05-06 International Business Machines Corporation Cluster tool for production-worthy fabrication of dolan bridge quantum josephson junction devices
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
US20220406583A1 (en) * 2021-06-18 2022-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Deposition system and method
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber

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CA1072281A (en) * 1976-03-24 1980-02-26 Jobst U. Gellert Injection molding filter assembly
DE2841124C2 (de) * 1978-09-21 1984-09-13 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen von elektronischen Halbleiterbauelementen durch Röntgen-Lithographie
US4824544A (en) * 1987-10-29 1989-04-25 International Business Machines Corporation Large area cathode lift-off sputter deposition device
US4988424A (en) * 1989-06-07 1991-01-29 Ppg Industries, Inc. Mask and method for making gradient sputtered coatings
EP0440377B1 (de) * 1990-01-29 1998-03-18 Varian Associates, Inc. Gerät und Verfahren zur Niederschlagung durch einen Kollimator
US5223108A (en) * 1991-12-30 1993-06-29 Materials Research Corporation Extended lifetime collimator
EP0564028B1 (de) * 1992-04-02 1997-07-16 Koninklijke Philips Electronics N.V. Verfahren zum Herstellen einer zugespitzten Elektrode
CA2111536A1 (en) * 1992-12-16 1994-06-17 Geri M. Actor Collimated deposition apparatus
US5415753A (en) * 1993-07-22 1995-05-16 Materials Research Corporation Stationary aperture plate for reactive sputter deposition
EP0682125A1 (de) * 1994-05-11 1995-11-15 Applied Materials, Inc. Kontrolle eines Materials, welches von einem Target zerstäubt wird

Also Published As

Publication number Publication date
WO1996024155A1 (en) 1996-08-08
TW436895B (en) 2001-05-28
EP0809859B1 (de) 2001-06-13
US5643428A (en) 1997-07-01
DE69613352D1 (de) 2001-07-19
EP0809859A1 (de) 1997-12-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee