DE69616108T2 - Licht emittierende Halbleitervorrichtung - Google Patents

Licht emittierende Halbleitervorrichtung

Info

Publication number
DE69616108T2
DE69616108T2 DE69616108T DE69616108T DE69616108T2 DE 69616108 T2 DE69616108 T2 DE 69616108T2 DE 69616108 T DE69616108 T DE 69616108T DE 69616108 T DE69616108 T DE 69616108T DE 69616108 T2 DE69616108 T2 DE 69616108T2
Authority
DE
Germany
Prior art keywords
light emitting
emitting device
semiconductor light
semiconductor
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69616108T
Other languages
English (en)
Other versions
DE69616108D1 (de
Inventor
Hiroaki Okagawa
Takayuki Hashimoto
Keiji Miyashita
Tomoo Yamada
Kazuyuki Tadatomo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Cable Industries Ltd
Original Assignee
Mitsubishi Cable Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Cable Industries Ltd filed Critical Mitsubishi Cable Industries Ltd
Publication of DE69616108D1 publication Critical patent/DE69616108D1/de
Application granted granted Critical
Publication of DE69616108T2 publication Critical patent/DE69616108T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/14—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
DE69616108T 1995-02-20 1996-02-14 Licht emittierende Halbleitervorrichtung Expired - Fee Related DE69616108T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3081995A JP3122324B2 (ja) 1995-02-20 1995-02-20 半導体発光素子

Publications (2)

Publication Number Publication Date
DE69616108D1 DE69616108D1 (de) 2001-11-29
DE69616108T2 true DE69616108T2 (de) 2002-06-27

Family

ID=12314323

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69616108T Expired - Fee Related DE69616108T2 (de) 1995-02-20 1996-02-14 Licht emittierende Halbleitervorrichtung

Country Status (4)

Country Link
US (1) US5635733A (de)
EP (1) EP0727828B1 (de)
JP (1) JP3122324B2 (de)
DE (1) DE69616108T2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10223929A (ja) * 1996-12-05 1998-08-21 Showa Denko Kk ＡｌＧａＩｎＰ発光素子用基板
JP3807638B2 (ja) * 1997-01-29 2006-08-09 シャープ株式会社 半導体発光素子及びその製造方法
JP3817323B2 (ja) * 1997-03-13 2006-09-06 ローム株式会社 半導体発光素子の製法
JP3253267B2 (ja) 1997-12-05 2002-02-04 ローム株式会社 半導体発光素子
JP3472714B2 (ja) * 1999-01-25 2003-12-02 シャープ株式会社 半導体発光素子の製造方法
TW445659B (en) * 1999-04-27 2001-07-11 Hitachi Cable LED of AlGaInP system and epitaxial wafer used for same
JP2002353496A (ja) * 2001-03-14 2002-12-06 Sunx Ltd 光電センサ
JP2003282937A (ja) 2002-01-15 2003-10-03 Keyence Corp 光電センサ装置
CN100413105C (zh) * 2004-03-05 2008-08-20 昭和电工株式会社 磷化硼基半导体发光器件
JP3822624B2 (ja) * 2004-12-13 2006-09-20 ローム株式会社 半導体発光素子
KR100588377B1 (ko) 2005-05-10 2006-06-09 삼성전기주식회사 수직구조 질화갈륨계 발광다이오드 소자 및 그 제조방법
CN100392881C (zh) * 2005-06-23 2008-06-04 华南师范大学 一种GaN基LED外延片及其制备方法
KR20070012930A (ko) * 2005-07-25 2007-01-30 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
JP2010199381A (ja) * 2009-02-26 2010-09-09 Stanley Electric Co Ltd 半導体発光装置の製造方法及び半導体発光装置
JP5190411B2 (ja) * 2009-05-14 2013-04-24 スタンレー電気株式会社 半導体発光装置及び半導体発光装置の製造方法
JP2012084692A (ja) 2010-10-12 2012-04-26 Hitachi Cable Ltd 発光素子
US8957440B2 (en) * 2011-10-04 2015-02-17 Cree, Inc. Light emitting devices with low packaging factor
JP5572202B2 (ja) * 2012-11-30 2014-08-13 東芝ディスクリートテクノロジー株式会社 発光装置
KR102101356B1 (ko) * 2013-06-18 2020-04-17 엘지이노텍 주식회사 발광소자 및 조명시스템

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4124826A (en) * 1977-03-01 1978-11-07 Bell Telephone Laboratories, Incorporated Current confinement in semiconductor lasers
US4679199A (en) * 1985-09-23 1987-07-07 Gte Laboratories Incorporated High power InGaAsP/InP semiconductor laser with low-doped active layer and very low series resistance
JP3251603B2 (ja) * 1990-08-20 2002-01-28 株式会社東芝 半導体発光装置
JP3264563B2 (ja) * 1993-03-15 2002-03-11 株式会社東芝 半導体発光素子及びその製造方法
JP2900754B2 (ja) * 1993-05-31 1999-06-02 信越半導体株式会社 ＡｌＧａＩｎＰ系発光装置
DE69428835T2 (de) * 1993-06-08 2002-08-22 Rohm Co Ltd Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren
JPH0738150A (ja) * 1993-07-22 1995-02-07 Toshiba Corp 半導体発光装置
DE9319416U1 (de) * 1993-12-04 1994-04-07 Huang, Kuo-Hsin Wirksame Lichtemissionsdioden mit modifizierten Fensterschichten
US5811839A (en) * 1994-09-01 1998-09-22 Mitsubishi Chemical Corporation Semiconductor light-emitting devices
JP2871477B2 (ja) * 1994-09-22 1999-03-17 信越半導体株式会社 半導体発光装置およびその製造方法
JP3124694B2 (ja) * 1995-02-15 2001-01-15 三菱電線工業株式会社 半導体発光素子

Also Published As

Publication number Publication date
EP0727828B1 (de) 2001-10-24
US5635733A (en) 1997-06-03
EP0727828A2 (de) 1996-08-21
EP0727828A3 (de) 1997-07-30
JP3122324B2 (ja) 2001-01-09
DE69616108D1 (de) 2001-11-29
JPH08228022A (ja) 1996-09-03

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee