DE69620037D1 - VORRICHTUNG ZUR aBGABE VON ZWEI CHEMISCHEN PRODUKTEN DURCH EINE BÜRSTE - Google Patents
VORRICHTUNG ZUR aBGABE VON ZWEI CHEMISCHEN PRODUKTEN DURCH EINE BÜRSTEInfo
- Publication number
- DE69620037D1 DE69620037D1 DE69620037T DE69620037T DE69620037D1 DE 69620037 D1 DE69620037 D1 DE 69620037D1 DE 69620037 T DE69620037 T DE 69620037T DE 69620037 T DE69620037 T DE 69620037T DE 69620037 D1 DE69620037 D1 DE 69620037D1
- Authority
- DE
- Germany
- Prior art keywords
- dispensing
- brush
- chemical products
- products
- chemical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools, brushes, or analogous members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B11/00—Brushes with reservoir or other means for applying substances, e.g. paints, pastes, water
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B11/00—Brushes with reservoir or other means for applying substances, e.g. paints, pastes, water
- A46B11/06—Brushes with reservoir or other means for applying substances, e.g. paints, pastes, water connected to supply pipe or to other external supply means
-
- B08B1/32—
-
- B08B1/50—
-
- B08B1/52—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US54253195A | 1995-10-13 | 1995-10-13 | |
PCT/US1996/016330 WO1997013590A1 (en) | 1995-10-13 | 1996-10-11 | Method and apparatus for chemical delivery through the brush |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69620037D1 true DE69620037D1 (de) | 2002-04-25 |
DE69620037T2 DE69620037T2 (de) | 2002-11-07 |
Family
ID=24164230
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69620037T Expired - Lifetime DE69620037T2 (de) | 1995-10-13 | 1996-10-11 | VORRICHTUNG ZUR aBGABE VON ZWEI CHEMISCHEN PRODUKTEN DURCH EINE BÜRSTE |
DE1996631258 Expired - Lifetime DE69631258T2 (de) | 1995-10-13 | 1996-10-11 | Verfahren zum Entfernen von Verunreinigungen durch Bürsten |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1996631258 Expired - Lifetime DE69631258T2 (de) | 1995-10-13 | 1996-10-11 | Verfahren zum Entfernen von Verunreinigungen durch Bürsten |
Country Status (6)
Country | Link |
---|---|
US (5) | US5868863A (de) |
EP (2) | EP0914216B1 (de) |
KR (1) | KR100392828B1 (de) |
AU (1) | AU7264596A (de) |
DE (2) | DE69620037T2 (de) |
WO (1) | WO1997013590A1 (de) |
Families Citing this family (104)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2722511B1 (fr) * | 1994-07-15 | 1999-04-02 | Ontrak Systems Inc | Procede pour enlever les metaux dans un dispositif de recurage |
DE69620037T2 (de) * | 1995-10-13 | 2002-11-07 | Lam Res Corp | VORRICHTUNG ZUR aBGABE VON ZWEI CHEMISCHEN PRODUKTEN DURCH EINE BÜRSTE |
US5645737A (en) * | 1996-02-21 | 1997-07-08 | Micron Technology, Inc. | Wet clean for a surface having an exposed silicon/silica interface |
US6103627A (en) | 1996-02-21 | 2000-08-15 | Micron Technology, Inc. | Treatment of a surface having an exposed silicon/silica interface |
JP3590470B2 (ja) * | 1996-03-27 | 2004-11-17 | アルプス電気株式会社 | 洗浄水生成方法および洗浄方法ならびに洗浄水生成装置および洗浄装置 |
US5875507A (en) | 1996-07-15 | 1999-03-02 | Oliver Design, Inc. | Wafer cleaning apparatus |
US6230753B1 (en) | 1996-07-15 | 2001-05-15 | Lam Research Corporation | Wafer cleaning apparatus |
US5924154A (en) * | 1996-08-29 | 1999-07-20 | Ontrak Systems, Inc. | Brush assembly apparatus |
JP3403108B2 (ja) * | 1999-02-26 | 2003-05-06 | アイオン株式会社 | 洗浄用スポンジローラ |
US6502273B1 (en) | 1996-11-08 | 2003-01-07 | Kanebo, Ltd. | Cleaning sponge roller |
JPH10321572A (ja) * | 1997-05-15 | 1998-12-04 | Toshiba Corp | 半導体ウェーハの両面洗浄装置及び半導体ウェーハのポリッシング方法 |
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US6479443B1 (en) | 1997-10-21 | 2002-11-12 | Lam Research Corporation | Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film |
US6165956A (en) * | 1997-10-21 | 2000-12-26 | Lam Research Corporation | Methods and apparatus for cleaning semiconductor substrates after polishing of copper film |
US6303551B1 (en) | 1997-10-21 | 2001-10-16 | Lam Research Corporation | Cleaning solution and method for cleaning semiconductor substrates after polishing of cooper film |
US6593282B1 (en) | 1997-10-21 | 2003-07-15 | Lam Research Corporation | Cleaning solutions for semiconductor substrates after polishing of copper film |
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US6261378B1 (en) * | 1998-03-23 | 2001-07-17 | Tokyo Electron Limited | Substrate cleaning unit and cleaning method |
US6158448A (en) * | 1998-03-27 | 2000-12-12 | Rippey Corporation | System for cleaning sponge or porous polymeric products |
US6120616A (en) * | 1998-03-27 | 2000-09-19 | Rippey Corporation | Microcleaning process for sponge or porous polymeric products |
WO1999049995A1 (en) * | 1998-03-27 | 1999-10-07 | Rippey Corporation | A microcleaning process for sponge or porous polymeric products |
US6176067B1 (en) | 1998-03-27 | 2001-01-23 | Rippey Corporation | Method for packaging sponge or porous polymeric products |
US6182323B1 (en) | 1998-03-27 | 2001-02-06 | Rippey Corporation | Ultraclean surface treatment device |
US6076217A (en) * | 1998-04-06 | 2000-06-20 | Micron Technology, Inc. | Brush alignment platform |
WO1999053531A2 (en) * | 1998-04-10 | 1999-10-21 | Speedfam-Ipec Corporation | Post-cmp wet-hf cleaning station |
JP3185753B2 (ja) * | 1998-05-22 | 2001-07-11 | 日本電気株式会社 | 半導体装置の製造方法 |
US6090214A (en) * | 1998-06-22 | 2000-07-18 | Fujitsu Limited | Cleaning method using ammonium persulphate to remove slurry particles from CMP substrates |
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US6093254A (en) * | 1998-10-30 | 2000-07-25 | Lam Research Corporation | Method of HF-HF Cleaning |
US6150175A (en) * | 1998-12-15 | 2000-11-21 | Lsi Logic Corporation | Copper contamination control of in-line probe instruments |
JP4011218B2 (ja) * | 1999-01-04 | 2007-11-21 | 株式会社東芝 | 基板処理装置及び基板処理方法 |
US6140208A (en) * | 1999-02-05 | 2000-10-31 | International Business Machines Corporation | Shallow trench isolation (STI) with bilayer of oxide-nitride for VLSI applications |
US6248009B1 (en) | 1999-02-18 | 2001-06-19 | Ebara Corporation | Apparatus for cleaning substrate |
US6358847B1 (en) * | 1999-03-31 | 2002-03-19 | Lam Research Corporation | Method for enabling conventional wire bonding to copper-based bond pad features |
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US5662769A (en) * | 1995-02-21 | 1997-09-02 | Advanced Micro Devices, Inc. | Chemical solutions for removing metal-compound contaminants from wafers after CMP and the method of wafer cleaning |
US5639311A (en) * | 1995-06-07 | 1997-06-17 | International Business Machines Corporation | Method of cleaning brushes used in post CMP semiconductor wafer cleaning operations |
DE69620037T2 (de) * | 1995-10-13 | 2002-11-07 | Lam Res Corp | VORRICHTUNG ZUR aBGABE VON ZWEI CHEMISCHEN PRODUKTEN DURCH EINE BÜRSTE |
US5745945A (en) * | 1996-06-28 | 1998-05-05 | International Business Machines Corporation | Brush conditioner for a semiconductor cleaning brush |
US5870793A (en) * | 1997-05-02 | 1999-02-16 | Integrated Process Equipment Corp. | Brush for scrubbing semiconductor wafers |
-
1996
- 1996-10-11 DE DE69620037T patent/DE69620037T2/de not_active Expired - Lifetime
- 1996-10-11 EP EP96934167A patent/EP0914216B1/de not_active Expired - Lifetime
- 1996-10-11 KR KR10-1998-0702707A patent/KR100392828B1/ko not_active IP Right Cessation
- 1996-10-11 EP EP00116480A patent/EP1046433B1/de not_active Expired - Lifetime
- 1996-10-11 WO PCT/US1996/016330 patent/WO1997013590A1/en active IP Right Grant
- 1996-10-11 AU AU72645/96A patent/AU7264596A/en not_active Abandoned
- 1996-10-11 DE DE1996631258 patent/DE69631258T2/de not_active Expired - Lifetime
-
1997
- 1997-01-30 US US08/791,688 patent/US5868863A/en not_active Expired - Lifetime
- 1997-01-31 US US08/792,093 patent/US5858109A/en not_active Expired - Lifetime
- 1997-09-17 US US08/932,292 patent/US5806126A/en not_active Expired - Lifetime
-
1999
- 1999-01-07 US US09/227,499 patent/US6145148A/en not_active Expired - Fee Related
- 1999-01-07 US US09/227,273 patent/US6324715B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR100392828B1 (ko) | 2003-10-17 |
US6145148A (en) | 2000-11-14 |
DE69631258D1 (de) | 2004-02-05 |
EP0914216A1 (de) | 1999-05-12 |
EP1046433B1 (de) | 2004-01-02 |
DE69631258T2 (de) | 2004-11-18 |
AU7264596A (en) | 1997-04-30 |
KR19990064221A (ko) | 1999-07-26 |
US5806126A (en) | 1998-09-15 |
DE69620037T2 (de) | 2002-11-07 |
US6324715B1 (en) | 2001-12-04 |
WO1997013590A1 (en) | 1997-04-17 |
US5858109A (en) | 1999-01-12 |
EP1046433A1 (de) | 2000-10-25 |
EP0914216A4 (de) | 1999-05-12 |
US5868863A (en) | 1999-02-09 |
EP0914216B1 (de) | 2002-03-20 |
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