DE69622175D1 - Sorptionspaar verwendende kälteanlage - Google Patents

Sorptionspaar verwendende kälteanlage

Info

Publication number
DE69622175D1
DE69622175D1 DE69622175T DE69622175T DE69622175D1 DE 69622175 D1 DE69622175 D1 DE 69622175D1 DE 69622175 T DE69622175 T DE 69622175T DE 69622175 T DE69622175 T DE 69622175T DE 69622175 D1 DE69622175 D1 DE 69622175D1
Authority
DE
Germany
Prior art keywords
absorbent
refrigerant
pair
sorption
cooling system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69622175T
Other languages
English (en)
Other versions
DE69622175T2 (de
Inventor
M Byrd
M Pfister
W Warriner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sun Microsystems Inc
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Publication of DE69622175D1 publication Critical patent/DE69622175D1/de
Application granted granted Critical
Publication of DE69622175T2 publication Critical patent/DE69622175T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20363—Refrigerating circuit comprising a sorber
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B17/00—Sorption machines, plants or systems, operating intermittently, e.g. absorption or adsorption type
    • F25B17/08—Sorption machines, plants or systems, operating intermittently, e.g. absorption or adsorption type the absorbent or adsorbent being a solid, e.g. salt
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B35/00—Boiler-absorbers, i.e. boilers usable for absorption or adsorption
    • F25B35/04—Boiler-absorbers, i.e. boilers usable for absorption or adsorption using a solid as sorbent
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F25B39/026—Evaporators specially adapted for sorption type systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices
    • F25B49/04—Arrangement or mounting of control or safety devices for sorption type machines, plants or systems
    • F25B49/046—Operating intermittently
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/12—Arrangements of compartments additional to cooling compartments; Combinations of refrigerators with other equipment, e.g. stove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H05B6/701—Feed lines using microwave applicators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/80—Apparatus for specific applications
    • H05B6/802—Apparatus for specific applications for heating fluids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/80—Apparatus for specific applications
    • H05B6/808—Microwave heating adapted for vending machines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2333/00—Details of boilers; Analysers; Rectifiers
    • F25B2333/005—Details of boilers; Analysers; Rectifiers the generator or boiler uses electromagnetic energy in the form of microwaves for desorbing the sorbate from the sorbate/sorbent compound
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69622175T 1995-09-20 1996-09-17 Sorptionspaar verwendende kälteanlage Expired - Fee Related DE69622175T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53315395A 1995-09-20 1995-09-20
PCT/US1996/014911 WO1997011323A1 (en) 1995-09-20 1996-09-17 Absorbent pair refrigeration system

Publications (2)

Publication Number Publication Date
DE69622175D1 true DE69622175D1 (de) 2002-08-08
DE69622175T2 DE69622175T2 (de) 2003-03-13

Family

ID=24124723

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69622175T Expired - Fee Related DE69622175T2 (de) 1995-09-20 1996-09-17 Sorptionspaar verwendende kälteanlage

Country Status (14)

Country Link
US (2) US5855121A (de)
EP (2) EP1128136A2 (de)
JP (1) JPH11512810A (de)
KR (1) KR19990045764A (de)
CN (1) CN1196788A (de)
AT (1) ATE220192T1 (de)
AU (1) AU707643B2 (de)
BR (1) BR9610753A (de)
CA (1) CA2232061A1 (de)
DE (1) DE69622175T2 (de)
IL (1) IL123603A (de)
NZ (1) NZ318696A (de)
RU (1) RU2166703C2 (de)
WO (1) WO1997011323A1 (de)

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US5916259A (en) 1995-09-20 1999-06-29 Sun Microsystems, Inc. Coaxial waveguide applicator for an electromagnetic wave-activated sorption system
US6138469A (en) 1995-09-20 2000-10-31 Sun Microsystems, Inc. Refrigeration system for electronic components having environmental isolation
US5873258A (en) 1995-09-20 1999-02-23 Sun Microsystems, Inc Sorption refrigeration appliance
DE69622175T2 (de) * 1995-09-20 2003-03-13 Sun Microsystems Inc Sorptionspaar verwendende kälteanlage
US6244056B1 (en) 1995-09-20 2001-06-12 Sun Microsystems, Inc. Controlled production of ammonia and other gases
US5855119A (en) 1995-09-20 1999-01-05 Sun Microsystems, Inc. Method and apparatus for cooling electrical components
US7003979B1 (en) 2000-03-13 2006-02-28 Sun Microsystems, Inc. Method and apparatus for making a sorber
US6502419B2 (en) 2000-04-13 2003-01-07 Sun Microsystems, Inc. Electro-desorption compressor
US6698233B2 (en) * 2001-04-12 2004-03-02 Sun Microsystems, Inc. Active sorption thermal storage container
US6834510B1 (en) * 2001-04-12 2004-12-28 Sun Microsystems, Inc. Refrigerant management system for optimal compressor performance
US20060194064A1 (en) * 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
DE102005062941A1 (de) * 2005-12-29 2007-07-05 BSH Bosch und Siemens Hausgeräte GmbH Hausgerät mit einem Adsorptionsapparat und einer Heizvorrichtung
WO2007144024A1 (fr) * 2006-06-15 2007-12-21 Sebalis Dispositif a echanges thermiques
DE102007049054A1 (de) * 2007-05-11 2008-11-13 Mecoswiss Mechanische Componenten Gmbh & Co.Kg Haushaltsmaschine mit Kühlvorrichtung
DE102008023070A1 (de) * 2007-05-11 2008-11-13 Mecoswiss Mechanische Componenten Gmbh & Co.Kg Haushaltsmaschine mit einer Kühlvorrichtung
SE532504C2 (sv) * 2007-11-29 2010-02-09 Climatewell Ab Publ Termisk solfångare för leverans av värme och/eller kyla
US8297063B2 (en) 2008-08-12 2012-10-30 General Electric Company Method for servicing a refrigeration system
JP6093565B2 (ja) * 2012-12-25 2017-03-08 株式会社デンソー ヒートポンプシステム
CN104633982B (zh) 2013-11-13 2018-09-11 马勒国际公司 优选用于热驱动的吸附装置的蒸发单元以及吸附装置
CN104634003B (zh) 2013-11-13 2018-08-03 马勒贝洱两合公司 优选用于机动车辆的吸附式换热器模块
JP6408287B2 (ja) * 2014-08-05 2018-10-17 直 岩附 冷凍、冷房、または暖房装置とその省エネ方法
CN109253559B (zh) * 2018-08-09 2020-02-11 山东大学 一种微波吸附式制冷系统及方法
CN112567889B (zh) * 2018-09-14 2023-04-11 松下知识产权经营株式会社 微波加热装置
RU2720377C2 (ru) * 2019-05-08 2020-04-29 Виктор Петрович Войтенко Способ высокоэнтропийной заморозки и устройство для его осуществления
US11719449B2 (en) 2019-09-17 2023-08-08 Mina Sagar Systems for refrigerating an enclosure

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Also Published As

Publication number Publication date
WO1997011323A1 (en) 1997-03-27
MX9802111A (es) 1998-05-31
CA2232061A1 (en) 1997-03-27
JPH11512810A (ja) 1999-11-02
IL123603A (en) 2000-07-16
EP1128136A2 (de) 2001-08-29
AU707643B2 (en) 1999-07-15
BR9610753A (pt) 1999-07-13
KR19990045764A (ko) 1999-06-25
US5855121A (en) 1999-01-05
ATE220192T1 (de) 2002-07-15
EP0851994B1 (de) 2002-07-03
RU2166703C2 (ru) 2001-05-10
IL123603A0 (en) 1998-10-30
AU7074596A (en) 1997-04-09
EP0851994A1 (de) 1998-07-08
NZ318696A (en) 1999-05-28
US6006543A (en) 1999-12-28
DE69622175T2 (de) 2003-03-13
CN1196788A (zh) 1998-10-21

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Legal Events

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8339 Ceased/non-payment of the annual fee