DE69623832T2 - Halbleiterspeicheranordnung - Google Patents
HalbleiterspeicheranordnungInfo
- Publication number
- DE69623832T2 DE69623832T2 DE69623832T DE69623832T DE69623832T2 DE 69623832 T2 DE69623832 T2 DE 69623832T2 DE 69623832 T DE69623832 T DE 69623832T DE 69623832 T DE69623832 T DE 69623832T DE 69623832 T2 DE69623832 T2 DE 69623832T2
- Authority
- DE
- Germany
- Prior art keywords
- memory device
- semiconductor memory
- semiconductor
- memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4094—Bit-line management or control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/4074—Power supply or voltage generation circuits, e.g. bias voltage generators, substrate voltage generators, back-up power, power control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/4076—Timing circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/408—Address circuits
- G11C11/4085—Word line control circuits, e.g. word line drivers, - boosters, - pull-up, - pull-down, - precharge
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29595 | 1995-01-05 | ||
JP13685795A JP3315293B2 (ja) | 1995-01-05 | 1995-06-02 | 半導体記憶装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69623832D1 DE69623832D1 (de) | 2002-10-31 |
DE69623832T2 true DE69623832T2 (de) | 2003-05-28 |
Family
ID=26333247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69623832T Expired - Fee Related DE69623832T2 (de) | 1995-01-05 | 1996-01-03 | Halbleiterspeicheranordnung |
Country Status (6)
Country | Link |
---|---|
US (1) | US5953246A (de) |
EP (1) | EP0725402B1 (de) |
JP (1) | JP3315293B2 (de) |
KR (1) | KR100236213B1 (de) |
CN (1) | CN1083607C (de) |
DE (1) | DE69623832T2 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202010010080U1 (de) | 2010-07-06 | 2011-08-23 | Quick-Mix Gruppe Gmbh & Co. Kg | Neue Baustoffmischungen |
EP2404885A2 (de) | 2010-07-06 | 2012-01-11 | Quick-Mix Gruppe Gmbh & Co. Kg | Neue Baustoffmischungen |
Families Citing this family (78)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6370057B1 (en) | 1999-02-24 | 2002-04-09 | Kabushiki Kaisha Toshiba | Semiconductor memory device having plate lines and precharge circuits |
US6038673A (en) * | 1998-11-03 | 2000-03-14 | Intel Corporation | Computer system with power management scheme for DRAM devices |
KR100295060B1 (ko) * | 1999-06-30 | 2001-07-12 | 윤종용 | 메모리 영역을 열방향으로 분할하여 리프레쉬 동작이 필요치 않는 그래픽 메모리 장치 |
DE10015278B4 (de) * | 2000-03-28 | 2004-09-23 | Infineon Technologies Ag | Halbleiterspeicher mit einem Speicherzellenfeld |
TWI230392B (en) | 2001-06-18 | 2005-04-01 | Innovative Silicon Sa | Semiconductor device |
EP1431952A4 (de) * | 2001-09-28 | 2009-12-02 | Sony Corp | Anzeigespeicher, treiberschaltung, anzeige und zellulare informationsvorrichtung |
JP4251815B2 (ja) * | 2002-04-04 | 2009-04-08 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
JP4094379B2 (ja) * | 2002-08-27 | 2008-06-04 | エルピーダメモリ株式会社 | 半導体装置及びその製造方法 |
US6757202B2 (en) * | 2002-08-29 | 2004-06-29 | Micron Technology, Inc. | Bias sensing in DRAM sense amplifiers |
JP2004185755A (ja) * | 2002-12-05 | 2004-07-02 | Sharp Corp | 不揮発性半導体記憶装置 |
DE10320874B4 (de) * | 2003-05-09 | 2014-01-09 | Qimonda Ag | Integrierter Halbleiterspeicher mit einem Transistor verringerter Gate-Oxiddicke |
US20040228168A1 (en) | 2003-05-13 | 2004-11-18 | Richard Ferrant | Semiconductor memory device and method of operating same |
US7335934B2 (en) | 2003-07-22 | 2008-02-26 | Innovative Silicon S.A. | Integrated circuit device, and method of fabricating same |
KR101218860B1 (ko) * | 2005-06-01 | 2013-01-07 | 파나소닉 주식회사 | 반도체 기억장치, 및 그것을 탑재한 반도체 집적회로 |
JP4537909B2 (ja) * | 2005-08-08 | 2010-09-08 | 株式会社東芝 | 情報記録装置 |
US7606066B2 (en) | 2005-09-07 | 2009-10-20 | Innovative Silicon Isi Sa | Memory cell and memory cell array having an electrically floating body transistor, and methods of operating same |
US7683430B2 (en) | 2005-12-19 | 2010-03-23 | Innovative Silicon Isi Sa | Electrically floating body memory cell and array, and method of operating or controlling same |
US7492632B2 (en) | 2006-04-07 | 2009-02-17 | Innovative Silicon Isi Sa | Memory array having a programmable word length, and method of operating same |
WO2007128738A1 (en) | 2006-05-02 | 2007-11-15 | Innovative Silicon Sa | Semiconductor memory cell and array using punch-through to program and read same |
US8069377B2 (en) | 2006-06-26 | 2011-11-29 | Micron Technology, Inc. | Integrated circuit having memory array including ECC and column redundancy and method of operating the same |
US7542340B2 (en) | 2006-07-11 | 2009-06-02 | Innovative Silicon Isi Sa | Integrated circuit including memory array having a segmented bit line architecture and method of controlling and/or operating same |
WO2008090475A2 (en) | 2007-01-26 | 2008-07-31 | Innovative Silicon S.A. | Floating-body dram transistor comprising source/drain regions separated from the gated body region |
US8581260B2 (en) * | 2007-02-22 | 2013-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including a memory |
US7733731B2 (en) | 2007-03-05 | 2010-06-08 | Micron Technology, Inc. | Control of inputs to a memory device |
US8518774B2 (en) | 2007-03-29 | 2013-08-27 | Micron Technology, Inc. | Manufacturing process for zero-capacitor random access memory circuits |
US8004920B2 (en) | 2007-05-29 | 2011-08-23 | Micron Technology, Inc. | Power saving memory apparatus, systems, and methods |
US8064274B2 (en) | 2007-05-30 | 2011-11-22 | Micron Technology, Inc. | Integrated circuit having voltage generation circuitry for memory cell array, and method of operating and/or controlling same |
US8085594B2 (en) | 2007-06-01 | 2011-12-27 | Micron Technology, Inc. | Reading technique for memory cell with electrically floating body transistor |
WO2009039169A1 (en) | 2007-09-17 | 2009-03-26 | Innovative Silicon S.A. | Refreshing data of memory cells with electrically floating body transistors |
US7656720B2 (en) * | 2007-11-07 | 2010-02-02 | Micron Technology, Inc. | Power-off apparatus, systems, and methods |
US8536628B2 (en) | 2007-11-29 | 2013-09-17 | Micron Technology, Inc. | Integrated circuit having memory cell array including barriers, and method of manufacturing same |
US8349662B2 (en) | 2007-12-11 | 2013-01-08 | Micron Technology, Inc. | Integrated circuit having memory cell array, and method of manufacturing same |
US8773933B2 (en) | 2012-03-16 | 2014-07-08 | Micron Technology, Inc. | Techniques for accessing memory cells |
US8014195B2 (en) | 2008-02-06 | 2011-09-06 | Micron Technology, Inc. | Single transistor memory cell |
US8189376B2 (en) | 2008-02-08 | 2012-05-29 | Micron Technology, Inc. | Integrated circuit having memory cells including gate material having high work function, and method of manufacturing same |
US7957206B2 (en) | 2008-04-04 | 2011-06-07 | Micron Technology, Inc. | Read circuitry for an integrated circuit having memory cells and/or a memory cell array, and method of operating same |
US7947543B2 (en) | 2008-09-25 | 2011-05-24 | Micron Technology, Inc. | Recessed gate silicon-on-insulator floating body device with self-aligned lateral isolation |
US7933140B2 (en) | 2008-10-02 | 2011-04-26 | Micron Technology, Inc. | Techniques for reducing a voltage swing |
US7924630B2 (en) | 2008-10-15 | 2011-04-12 | Micron Technology, Inc. | Techniques for simultaneously driving a plurality of source lines |
US8223574B2 (en) | 2008-11-05 | 2012-07-17 | Micron Technology, Inc. | Techniques for block refreshing a semiconductor memory device |
US8213226B2 (en) | 2008-12-05 | 2012-07-03 | Micron Technology, Inc. | Vertical transistor memory cell and array |
TWI394156B (zh) * | 2008-12-09 | 2013-04-21 | Winbond Electronics Corp | 更新方法 |
US8319294B2 (en) | 2009-02-18 | 2012-11-27 | Micron Technology, Inc. | Techniques for providing a source line plane |
US8710566B2 (en) | 2009-03-04 | 2014-04-29 | Micron Technology, Inc. | Techniques for forming a contact to a buried diffusion layer in a semiconductor memory device |
US8748959B2 (en) | 2009-03-31 | 2014-06-10 | Micron Technology, Inc. | Semiconductor memory device |
US8139418B2 (en) | 2009-04-27 | 2012-03-20 | Micron Technology, Inc. | Techniques for controlling a direct injection semiconductor memory device |
US8508994B2 (en) | 2009-04-30 | 2013-08-13 | Micron Technology, Inc. | Semiconductor device with floating gate and electrically floating body |
US8498157B2 (en) | 2009-05-22 | 2013-07-30 | Micron Technology, Inc. | Techniques for providing a direct injection semiconductor memory device |
US8537610B2 (en) | 2009-07-10 | 2013-09-17 | Micron Technology, Inc. | Techniques for providing a semiconductor memory device |
US9076543B2 (en) | 2009-07-27 | 2015-07-07 | Micron Technology, Inc. | Techniques for providing a direct injection semiconductor memory device |
US8199595B2 (en) | 2009-09-04 | 2012-06-12 | Micron Technology, Inc. | Techniques for sensing a semiconductor memory device |
KR101892430B1 (ko) * | 2009-10-21 | 2018-08-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
WO2011065183A1 (en) * | 2009-11-24 | 2011-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including memory cell |
US8174881B2 (en) | 2009-11-24 | 2012-05-08 | Micron Technology, Inc. | Techniques for reducing disturbance in a semiconductor device |
US8310893B2 (en) | 2009-12-16 | 2012-11-13 | Micron Technology, Inc. | Techniques for reducing impact of array disturbs in a semiconductor memory device |
US8416636B2 (en) | 2010-02-12 | 2013-04-09 | Micron Technology, Inc. | Techniques for controlling a semiconductor memory device |
US8411513B2 (en) | 2010-03-04 | 2013-04-02 | Micron Technology, Inc. | Techniques for providing a semiconductor memory device having hierarchical bit lines |
US8576631B2 (en) | 2010-03-04 | 2013-11-05 | Micron Technology, Inc. | Techniques for sensing a semiconductor memory device |
US8369177B2 (en) | 2010-03-05 | 2013-02-05 | Micron Technology, Inc. | Techniques for reading from and/or writing to a semiconductor memory device |
EP3511982A1 (de) | 2010-03-15 | 2019-07-17 | Micron Technology, Inc. | Verfahren zur bereitstellung einer halbleiterspeichervorrichtung |
WO2011114868A1 (en) * | 2010-03-19 | 2011-09-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8411524B2 (en) | 2010-05-06 | 2013-04-02 | Micron Technology, Inc. | Techniques for refreshing a semiconductor memory device |
JP2012142562A (ja) * | 2010-12-17 | 2012-07-26 | Semiconductor Energy Lab Co Ltd | 半導体記憶装置 |
KR101899880B1 (ko) | 2011-02-17 | 2018-09-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 프로그래머블 lsi |
JP6001900B2 (ja) * | 2011-04-21 | 2016-10-05 | 株式会社半導体エネルギー研究所 | 信号処理回路 |
US8531878B2 (en) | 2011-05-17 | 2013-09-10 | Micron Technology, Inc. | Techniques for providing a semiconductor memory device |
US9559216B2 (en) | 2011-06-06 | 2017-01-31 | Micron Technology, Inc. | Semiconductor memory device and method for biasing same |
CN103514103B (zh) * | 2012-06-21 | 2016-09-28 | 群联电子股份有限公司 | 数据保护方法、存储器控制器与存储器储存装置 |
JP6483402B2 (ja) | 2013-11-01 | 2019-03-13 | 株式会社半導体エネルギー研究所 | 記憶装置、及び記憶装置を有する電子機器 |
CN103648029B (zh) * | 2013-12-06 | 2016-09-28 | 乐视致新电子科技(天津)有限公司 | 智能电视的通电保护方法及系统 |
JP6038100B2 (ja) * | 2014-11-11 | 2016-12-07 | ルネサスエレクトロニクス株式会社 | 半導体集積回路 |
JP5941577B1 (ja) * | 2015-05-11 | 2016-06-29 | 力晶科技股▲ふん▼有限公司 | 半導体記憶装置 |
US9858997B2 (en) * | 2015-07-14 | 2018-01-02 | Nanya Technology Corp. | Electronic apparatus applying unified non-volatile memory and unified non-volatile memory controlling method |
GB201609704D0 (en) * | 2016-06-03 | 2016-07-20 | Surecore Ltd | Memory unit |
CN109003980A (zh) * | 2018-08-17 | 2018-12-14 | 刘文剑 | 一种具有soi结构的漏电过程自控的动态随机存储器单元 |
US11328759B2 (en) | 2020-10-02 | 2022-05-10 | Sandisk Technologies Llc | Signal preserve in MRAM during reading |
US11386945B2 (en) * | 2020-10-02 | 2022-07-12 | Sandisk Technologies Llc | Signal amplification in MRAM during reading, including a pair of complementary transistors connected to an array line |
CN114496048A (zh) * | 2022-01-12 | 2022-05-13 | 长鑫存储技术有限公司 | 存储器检测方法及其装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5399736A (en) * | 1977-02-10 | 1978-08-31 | Toshiba Corp | Semiconductor memory unit |
US5161121A (en) * | 1988-06-27 | 1992-11-03 | Oki Electric Industry Co., Ltd. | Random access memory including word line clamping circuits |
JPH0426989A (ja) * | 1990-05-18 | 1992-01-30 | Toshiba Corp | ダイナミックメモリ装置 |
JP2789931B2 (ja) * | 1991-05-27 | 1998-08-27 | 日本電気株式会社 | 半導体装置 |
KR960006283B1 (ko) * | 1991-08-26 | 1996-05-13 | 닛본덴기 가부시끼가이샤 | 반도체 디램(dram) 장치 |
US5365487A (en) * | 1992-03-24 | 1994-11-15 | Texas Instruments Incorporated | DRAM power management with self-refresh |
JPH0612896A (ja) * | 1992-04-28 | 1994-01-21 | Nec Corp | 半導体記憶装置 |
JPH06216338A (ja) * | 1992-11-27 | 1994-08-05 | Internatl Business Mach Corp <Ibm> | 半導体メモリセル及びその製造方法 |
US5373463A (en) * | 1993-07-06 | 1994-12-13 | Motorola Inc. | Ferroelectric nonvolatile random access memory having drive line segments |
-
1995
- 1995-06-02 JP JP13685795A patent/JP3315293B2/ja not_active Expired - Fee Related
-
1996
- 1996-01-03 DE DE69623832T patent/DE69623832T2/de not_active Expired - Fee Related
- 1996-01-03 EP EP96300025A patent/EP0725402B1/de not_active Expired - Lifetime
- 1996-01-04 CN CN96100612A patent/CN1083607C/zh not_active Expired - Fee Related
- 1996-01-05 KR KR1019960000069A patent/KR100236213B1/ko not_active IP Right Cessation
-
1997
- 1997-04-21 US US08/845,035 patent/US5953246A/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202010010080U1 (de) | 2010-07-06 | 2011-08-23 | Quick-Mix Gruppe Gmbh & Co. Kg | Neue Baustoffmischungen |
EP2404885A2 (de) | 2010-07-06 | 2012-01-11 | Quick-Mix Gruppe Gmbh & Co. Kg | Neue Baustoffmischungen |
DE102010027325A1 (de) | 2010-07-06 | 2012-01-12 | Quick-Mix Gruppe Gmbh & Co. Kg | Neue Baustoffmischungen |
Also Published As
Publication number | Publication date |
---|---|
US5953246A (en) | 1999-09-14 |
CN1083607C (zh) | 2002-04-24 |
JPH08241585A (ja) | 1996-09-17 |
EP0725402A3 (de) | 1999-01-07 |
KR100236213B1 (ko) | 1999-12-15 |
CN1136207A (zh) | 1996-11-20 |
EP0725402B1 (de) | 2002-09-25 |
EP0725402A2 (de) | 1996-08-07 |
DE69623832D1 (de) | 2002-10-31 |
JP3315293B2 (ja) | 2002-08-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |