DE69631258D1 - Verfahren zum Entfernen von Verunreinigungen durch Bürsten - Google Patents

Verfahren zum Entfernen von Verunreinigungen durch Bürsten

Info

Publication number
DE69631258D1
DE69631258D1 DE69631258T DE69631258T DE69631258D1 DE 69631258 D1 DE69631258 D1 DE 69631258D1 DE 69631258 T DE69631258 T DE 69631258T DE 69631258 T DE69631258 T DE 69631258T DE 69631258 D1 DE69631258 D1 DE 69631258D1
Authority
DE
Germany
Prior art keywords
removal method
brush removal
brush
removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69631258T
Other languages
English (en)
Other versions
DE69631258T2 (de
Inventor
John M Delarios
G Gardner
Mikhail Ravkin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of DE69631258D1 publication Critical patent/DE69631258D1/de
Application granted granted Critical
Publication of DE69631258T2 publication Critical patent/DE69631258T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools, brushes, or analogous members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052Wet cleaning only
    • AHUMAN NECESSITIES
    • A46BRUSHWARE
    • A46BBRUSHES
    • A46B11/00Brushes with reservoir or other means for applying substances, e.g. paints, pastes, water
    • AHUMAN NECESSITIES
    • A46BRUSHWARE
    • A46BBRUSHES
    • A46B11/00Brushes with reservoir or other means for applying substances, e.g. paints, pastes, water
    • A46B11/06Brushes with reservoir or other means for applying substances, e.g. paints, pastes, water connected to supply pipe or to other external supply means
    • B08B1/32
    • B08B1/50
    • B08B1/52
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/08Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00Cleaning or pickling metallic material with solutions or molten salts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • H01L21/31105Etching inorganic layers
    • H01L21/31111Etching inorganic layers by chemical means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00Cleaning and liquid contact with solids
    • Y10S134/902Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE1996631258 1995-10-13 1996-10-11 Verfahren zum Entfernen von Verunreinigungen durch Bürsten Expired - Lifetime DE69631258T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US54253195A 1995-10-13 1995-10-13
US542531 1995-10-13

Publications (2)

Publication Number Publication Date
DE69631258D1 true DE69631258D1 (de) 2004-02-05
DE69631258T2 DE69631258T2 (de) 2004-11-18

Family

ID=24164230

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69620037T Expired - Lifetime DE69620037T2 (de) 1995-10-13 1996-10-11 VORRICHTUNG ZUR aBGABE VON ZWEI CHEMISCHEN PRODUKTEN DURCH EINE BÜRSTE
DE1996631258 Expired - Lifetime DE69631258T2 (de) 1995-10-13 1996-10-11 Verfahren zum Entfernen von Verunreinigungen durch Bürsten

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69620037T Expired - Lifetime DE69620037T2 (de) 1995-10-13 1996-10-11 VORRICHTUNG ZUR aBGABE VON ZWEI CHEMISCHEN PRODUKTEN DURCH EINE BÜRSTE

Country Status (6)

Country Link
US (5) US5868863A (de)
EP (2) EP0914216B1 (de)
KR (1) KR100392828B1 (de)
AU (1) AU7264596A (de)
DE (2) DE69620037T2 (de)
WO (1) WO1997013590A1 (de)

Families Citing this family (104)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2722511B1 (fr) * 1994-07-15 1999-04-02 Ontrak Systems Inc Procede pour enlever les metaux dans un dispositif de recurage
DE69620037T2 (de) * 1995-10-13 2002-11-07 Lam Res Corp VORRICHTUNG ZUR aBGABE VON ZWEI CHEMISCHEN PRODUKTEN DURCH EINE BÜRSTE
US5645737A (en) * 1996-02-21 1997-07-08 Micron Technology, Inc. Wet clean for a surface having an exposed silicon/silica interface
US6103627A (en) 1996-02-21 2000-08-15 Micron Technology, Inc. Treatment of a surface having an exposed silicon/silica interface
JP3590470B2 (ja) * 1996-03-27 2004-11-17 アルプス電気株式会社 洗浄水生成方法および洗浄方法ならびに洗浄水生成装置および洗浄装置
US5875507A (en) 1996-07-15 1999-03-02 Oliver Design, Inc. Wafer cleaning apparatus
US6230753B1 (en) 1996-07-15 2001-05-15 Lam Research Corporation Wafer cleaning apparatus
US5924154A (en) * 1996-08-29 1999-07-20 Ontrak Systems, Inc. Brush assembly apparatus
JP3403108B2 (ja) * 1999-02-26 2003-05-06 アイオン株式会社 洗浄用スポンジローラ
US6502273B1 (en) 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
JPH10321572A (ja) * 1997-05-15 1998-12-04 Toshiba Corp 半導体ウェーハの両面洗浄装置及び半導体ウェーハのポリッシング方法
US5966766A (en) * 1997-10-06 1999-10-19 Advanced Micro Devices, Inc. Apparatus and method for cleaning semiconductor wafer
US6479443B1 (en) 1997-10-21 2002-11-12 Lam Research Corporation Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film
US6165956A (en) * 1997-10-21 2000-12-26 Lam Research Corporation Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
US6303551B1 (en) 1997-10-21 2001-10-16 Lam Research Corporation Cleaning solution and method for cleaning semiconductor substrates after polishing of cooper film
US6593282B1 (en) 1997-10-21 2003-07-15 Lam Research Corporation Cleaning solutions for semiconductor substrates after polishing of copper film
US5968280A (en) * 1997-11-12 1999-10-19 International Business Machines Corporation Method for cleaning a surface
US5975094A (en) * 1997-11-26 1999-11-02 Speedfam Corporation Method and apparatus for enhanced cleaning of a workpiece with mechanical energy
US6475927B1 (en) * 1998-02-02 2002-11-05 Micron Technology, Inc. Method of forming a semiconductor device
US6070284A (en) * 1998-02-04 2000-06-06 Silikinetic Technology, Inc. Wafer cleaning method and system
US5954888A (en) * 1998-02-09 1999-09-21 Speedfam Corporation Post-CMP wet-HF cleaning station
US6261378B1 (en) * 1998-03-23 2001-07-17 Tokyo Electron Limited Substrate cleaning unit and cleaning method
US6158448A (en) * 1998-03-27 2000-12-12 Rippey Corporation System for cleaning sponge or porous polymeric products
US6120616A (en) * 1998-03-27 2000-09-19 Rippey Corporation Microcleaning process for sponge or porous polymeric products
WO1999049995A1 (en) * 1998-03-27 1999-10-07 Rippey Corporation A microcleaning process for sponge or porous polymeric products
US6176067B1 (en) 1998-03-27 2001-01-23 Rippey Corporation Method for packaging sponge or porous polymeric products
US6182323B1 (en) 1998-03-27 2001-02-06 Rippey Corporation Ultraclean surface treatment device
US6076217A (en) * 1998-04-06 2000-06-20 Micron Technology, Inc. Brush alignment platform
WO1999053531A2 (en) * 1998-04-10 1999-10-21 Speedfam-Ipec Corporation Post-cmp wet-hf cleaning station
JP3185753B2 (ja) * 1998-05-22 2001-07-11 日本電気株式会社 半導体装置の製造方法
US6090214A (en) * 1998-06-22 2000-07-18 Fujitsu Limited Cleaning method using ammonium persulphate to remove slurry particles from CMP substrates
US6247197B1 (en) * 1998-07-09 2001-06-19 Lam Research Corporation Brush interflow distributor
TW392241B (en) * 1998-09-15 2000-06-01 Worldwild Semiconductor Mfg Co Wafer cleaning device
US6277203B1 (en) 1998-09-29 2001-08-21 Lam Research Corporation Method and apparatus for cleaning low K dielectric and metal wafer surfaces
US6093254A (en) * 1998-10-30 2000-07-25 Lam Research Corporation Method of HF-HF Cleaning
US6150175A (en) * 1998-12-15 2000-11-21 Lsi Logic Corporation Copper contamination control of in-line probe instruments
JP4011218B2 (ja) * 1999-01-04 2007-11-21 株式会社東芝 基板処理装置及び基板処理方法
US6140208A (en) * 1999-02-05 2000-10-31 International Business Machines Corporation Shallow trench isolation (STI) with bilayer of oxide-nitride for VLSI applications
US6248009B1 (en) 1999-02-18 2001-06-19 Ebara Corporation Apparatus for cleaning substrate
US6358847B1 (en) * 1999-03-31 2002-03-19 Lam Research Corporation Method for enabling conventional wire bonding to copper-based bond pad features
US6352595B1 (en) 1999-05-28 2002-03-05 Lam Research Corporation Method and system for cleaning a chemical mechanical polishing pad
US6711775B2 (en) * 1999-06-10 2004-03-30 Lam Research Corporation System for cleaning a semiconductor wafer
US6405399B1 (en) 1999-06-25 2002-06-18 Lam Research Corporation Method and system of cleaning a wafer after chemical mechanical polishing or plasma processing
US6277799B1 (en) * 1999-06-25 2001-08-21 International Business Machines Corporation Aqueous cleaning of paste residue
US6267142B1 (en) 1999-06-25 2001-07-31 Lam Research Corporation Fluid delivery stablization for wafer preparation systems
US6368416B1 (en) * 1999-07-01 2002-04-09 Lam Research Corporation Method for validating pre-process adjustments to a wafer cleaning system
US6406358B1 (en) * 1999-08-05 2002-06-18 Micron Technology, Inc. Method and apparatus for cleaning a surface of a microelectronic substrate
FR2797895B1 (fr) * 1999-09-01 2001-11-09 Mathieu Yno S A Brosse cylindrique autolavante pour balayeuses ou autres vehicules
US6224470B1 (en) * 1999-09-29 2001-05-01 Applied Materials, Inc. Pad cleaning brush for chemical mechanical polishing apparatus and method of making the same
US6537381B1 (en) 1999-09-29 2003-03-25 Lam Research Corporation Method for cleaning and treating a semiconductor wafer after chemical mechanical polishing
US6692339B1 (en) * 1999-11-05 2004-02-17 Strasbaugh Combined chemical mechanical planarization and cleaning
US6557202B1 (en) 1999-12-03 2003-05-06 Lam Research Corporation Wafer scrubbing brush core having an internal motor and method of making the same
US6240588B1 (en) * 1999-12-03 2001-06-05 Lam Research Corporation Wafer scrubbing brush core
US6187684B1 (en) * 1999-12-09 2001-02-13 Lam Research Corporation Methods for cleaning substrate surfaces after etch operations
US6431959B1 (en) * 1999-12-20 2002-08-13 Lam Research Corporation System and method of defect optimization for chemical mechanical planarization of polysilicon
US6638143B2 (en) 1999-12-22 2003-10-28 Applied Materials, Inc. Ion exchange materials for chemical mechanical polishing
JP2001212533A (ja) * 2000-02-03 2001-08-07 Dainippon Printing Co Ltd 基板端面の洗浄装置
US6432618B1 (en) * 2000-02-11 2002-08-13 Advanced Micro Devices, Inc. Method for forming high quality multiple thickness oxide layers by reducing descum induced defects
US6523210B1 (en) * 2000-04-05 2003-02-25 Nicholas Andros Surface charge controlling apparatus for wafer cleaning
KR20030015197A (ko) * 2000-06-12 2003-02-20 일리노이즈 툴 워크스 인코포레이티드 과산화 방부제
US6540841B1 (en) * 2000-06-30 2003-04-01 Chartered Semiconductor Manufacturing Ltd. Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate
SG106613A1 (en) * 2000-06-30 2004-10-29 Chartered Semiconductor Mfg Apparatus and methods to clean copper contamination on wafer edge
US6800020B1 (en) 2000-10-02 2004-10-05 Lam Research Corporation Web-style pad conditioning system and methods for implementing the same
JP3578338B2 (ja) * 2001-04-03 2004-10-20 プロモス テクノロジーズ インコーポレイテッド 平坦化プロセス後ウェハー表面残留粒子の除去方法
US20030049935A1 (en) * 2001-05-04 2003-03-13 Promos Technologies Inc. Method for removing residual particles from a polished surface
US6949411B1 (en) 2001-12-27 2005-09-27 Lam Research Corporation Method for post-etch and strip residue removal on coral films
US6660638B1 (en) * 2002-01-03 2003-12-09 Taiwan Semiconductor Manufacturing Company CMP process leaving no residual oxide layer or slurry particles
DE20210114U1 (de) * 2002-06-29 2003-11-13 Christof Bernd Vorrichtung zur Reinigung der Außenhaut von Land- und Wasserfahrzeugen, insbesondere mit konvex oder konkav gewölbten Front-, Heck-, Seiten- und Bodenflächen
JP2004111776A (ja) * 2002-09-20 2004-04-08 Matsushita Electric Ind Co Ltd 不純物導入方法、装置および素子
US6916233B2 (en) * 2002-11-28 2005-07-12 Tsc Corporation Polishing and cleaning compound device
US20050011535A1 (en) * 2003-07-18 2005-01-20 Randy Skocypec Cleaning semiconductor wafers
US7984526B2 (en) * 2003-08-08 2011-07-26 Entegris, Inc. Methods and materials for making a monolithic porous pad cast onto a rotatable base
US7353560B2 (en) * 2003-12-18 2008-04-08 Lam Research Corporation Proximity brush unit apparatus and method
JP4053060B2 (ja) * 2003-12-26 2008-02-27 アイオン株式会社 洗浄用スポンジローラー用の中芯
US20050252547A1 (en) * 2004-05-11 2005-11-17 Applied Materials, Inc. Methods and apparatus for liquid chemical delivery
WO2006007453A1 (en) * 2004-07-01 2006-01-19 Fsi International, Inc. Cleaning process for semiconductor substrates
KR20060098206A (ko) * 2005-03-11 2006-09-18 주식회사 브러쉬텍 Pva 스폰지를 소재로 한 제품의 방부처리방법
KR100691011B1 (ko) * 2005-06-30 2007-03-09 주식회사 하이닉스반도체 반도체 소자의 제조방법
US7344989B2 (en) * 2005-08-19 2008-03-18 Nec Electronics America, Inc. CMP wafer contamination reduced by insitu clean
JP4162001B2 (ja) * 2005-11-24 2008-10-08 株式会社東京精密 ウェーハ研磨装置及びウェーハ研磨方法
US20070240734A1 (en) * 2006-04-14 2007-10-18 Ching-Wen Teng Method of cleaning post-cmp wafer
JP5168966B2 (ja) * 2007-03-20 2013-03-27 富士通セミコンダクター株式会社 研磨方法及び研磨装置
USD622920S1 (en) 2007-05-02 2010-08-31 Entegris Corporation Cleaning sponge roller
KR101507633B1 (ko) * 2008-06-06 2015-03-31 아이온 가부시키가이샤 세정용 스폰지 롤러용 중심 코어
EP2177128A1 (de) * 2008-10-16 2010-04-21 Koninklijke Philips Electronics N.V. Bürstenanordnung zur Verteilung von Flüssigkeit und Betriebsverfahren dafür
EP2387932A1 (de) * 2010-05-20 2011-11-23 Koninklijke Philips Electronics N.V. Vorrichtung zum Reinigen einer Oberfläche mit mindestens einer Drehbürste
US20130098395A1 (en) * 2011-10-21 2013-04-25 Applied Materials, Inc. Semiconductor substrate cleaning apparatus, systems, and methods
US9202723B2 (en) 2011-11-29 2015-12-01 Illinois Tool Works, Inc. Brush with cantilevered nodules
US8992692B2 (en) 2012-02-03 2015-03-31 Stmicroelectronics, Inc. Adjustable brush cleaning apparatus for semiconductor wafers and associated methods
US8778087B2 (en) 2012-04-03 2014-07-15 Illinois Tool Works Inc. Conical sponge brush for cleaning semiconductor wafers
US20140083456A1 (en) * 2012-09-26 2014-03-27 Corning Incorporated Method and apparatus for substrate edge cleaning
CN103878148A (zh) * 2012-12-20 2014-06-25 上海华虹宏力半导体制造有限公司 一种对晶圆表面硅晶渣进行清洗的方法
KR20170008270A (ko) * 2014-05-15 2017-01-23 어플라이드 머티어리얼스, 인코포레이티드 입자 제거 디바이스 및 이의 작동 방법
CN104043604A (zh) * 2014-06-26 2014-09-17 深圳市华星光电技术有限公司 清洁刷结构
US9610615B2 (en) 2015-03-31 2017-04-04 Taiwan Semiconductor Manufacturing Co., Ltd Method and system for cleansing wafer in CMP process of semiconductor manufacturing fabrication
CN104785479A (zh) * 2015-04-07 2015-07-22 温州市金瓯轻工机械有限公司 立式洗筐机
CN104785481A (zh) * 2015-04-07 2015-07-22 广东金瓯机械制造有限公司 洗筐机毛刷清洗装置
US9687885B2 (en) * 2015-07-17 2017-06-27 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-cycle wafer cleaning method
US20170092725A1 (en) * 2015-09-29 2017-03-30 International Business Machines Corporation Activated thin silicon layers
CN107221491B (zh) * 2016-03-22 2021-10-22 东京毅力科创株式会社 基板清洗装置
US10879087B2 (en) 2017-03-17 2020-12-29 Toshiba Memory Corporation Substrate treatment apparatus and manufacturing method of semiconductor device
CN107993920A (zh) * 2017-11-24 2018-05-04 长江存储科技有限责任公司 一种多晶硅化学机械研磨后的清洗方法
CN110660646A (zh) * 2019-10-01 2020-01-07 张家港市超声电气有限公司 硅片清洗方法
US11694889B2 (en) * 2020-03-02 2023-07-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing cleaning system with temperature control for defect reduction

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2860354A (en) * 1955-05-13 1958-11-18 Pittsburgh Plate Glass Co Mountings for rotary brushes
US3500490A (en) * 1967-01-30 1970-03-17 Jack Teren Rotary tool device with coactive liquid dispensing means
US4461052A (en) * 1982-09-27 1984-07-24 Mostul Thomas A Scrubbing brush, rinse and sweeping equipment
JPS5986226A (ja) * 1982-11-08 1984-05-18 Mitsubishi Electric Corp 薄板状材の洗浄装置
US4569695A (en) * 1983-04-21 1986-02-11 Nec Corporation Method of cleaning a photo-mask
US4911761A (en) * 1984-05-21 1990-03-27 Cfm Technologies Research Associates Process and apparatus for drying surfaces
JPH0695508B2 (ja) * 1986-11-28 1994-11-24 大日本スクリ−ン製造株式会社 基板の両面洗浄装置
JP2787788B2 (ja) * 1990-09-26 1998-08-20 インターナショナル・ビジネス・マシーンズ・コーポレーション 残留物除去方法
US5345639A (en) * 1992-05-28 1994-09-13 Tokyo Electron Limited Device and method for scrubbing and cleaning substrate
JP2830733B2 (ja) * 1994-03-25 1998-12-02 日本電気株式会社 電解水生成方法および電解水生成機構
JP2888412B2 (ja) * 1994-07-04 1999-05-10 信越半導体株式会社 ブラシ洗浄装置及びワーク洗浄システム
US5662769A (en) * 1995-02-21 1997-09-02 Advanced Micro Devices, Inc. Chemical solutions for removing metal-compound contaminants from wafers after CMP and the method of wafer cleaning
US5639311A (en) * 1995-06-07 1997-06-17 International Business Machines Corporation Method of cleaning brushes used in post CMP semiconductor wafer cleaning operations
DE69620037T2 (de) * 1995-10-13 2002-11-07 Lam Res Corp VORRICHTUNG ZUR aBGABE VON ZWEI CHEMISCHEN PRODUKTEN DURCH EINE BÜRSTE
US5745945A (en) * 1996-06-28 1998-05-05 International Business Machines Corporation Brush conditioner for a semiconductor cleaning brush
US5870793A (en) * 1997-05-02 1999-02-16 Integrated Process Equipment Corp. Brush for scrubbing semiconductor wafers

Also Published As

Publication number Publication date
DE69620037D1 (de) 2002-04-25
KR100392828B1 (ko) 2003-10-17
US6145148A (en) 2000-11-14
EP0914216A1 (de) 1999-05-12
EP1046433B1 (de) 2004-01-02
DE69631258T2 (de) 2004-11-18
AU7264596A (en) 1997-04-30
KR19990064221A (ko) 1999-07-26
US5806126A (en) 1998-09-15
DE69620037T2 (de) 2002-11-07
US6324715B1 (en) 2001-12-04
WO1997013590A1 (en) 1997-04-17
US5858109A (en) 1999-01-12
EP1046433A1 (de) 2000-10-25
EP0914216A4 (de) 1999-05-12
US5868863A (en) 1999-02-09
EP0914216B1 (de) 2002-03-20

Similar Documents

Publication Publication Date Title
DE69631258D1 (de) Verfahren zum Entfernen von Verunreinigungen durch Bürsten
DE69719805T2 (de) Verfahren zum erzeugen von elastischen höckern
DE69516417D1 (de) Verfahren zum lösen von geklebten scheiben
DE69508921T2 (de) Verfahren zum nachweis von staphylokokken
DE69827657D1 (de) Verfahren zum trennen von aromaten
DE69634732D1 (de) Verfahren zur reinigung von bürsten
DE59605061D1 (de) Verfahren zum ablösen von an einer oberfläche haftenden explosivstoffen
DE69522828D1 (de) Verfahren zum entmetallieren von raffinerieeizätzen
DE59601109D1 (de) Verfahren zum behandeln von hausmüll
DE69306782D1 (de) Verfahren zum verbinden von perfluorelastomeren
DE69319347D1 (de) Verfahren zum verkleben von oberflächen
DE69514807T2 (de) Verfahren zur entfernung von alkalischen sulfatablagerungen
DE59306040D1 (de) Verfahren zum reinigen von glycerinwasser
DE69727410D1 (de) Verfahren zum Entgräten von Leiterrahmen
DE69614709T2 (de) Verfahren zum waschen von flaschen
DE69413556T2 (de) Verfahren zum bürstensiegeltufting
DE69714597T2 (de) Verfahren zum manipulieren von zephalometrischen aufzeichnungen
DE59404489D1 (de) Verfahren zum abbau von polygalaktomannanen
DE69523638D1 (de) Verfahren zum Reinigen von Methacrylat
DE69530199D1 (de) Verfahren zur entfernung von erdalkalimetallablagerungen
DE69623886T2 (de) Verfahren zum Entfernen von Klebebändern
DE59602226D1 (de) Verfahren zum Reinigen von ölbenetzten Bauteilen
DE59504999D1 (de) Verfahren zum aufbereiten von emballagen
DE69610810D1 (de) Verfahren und Vorrichtung zum Abrunden von Borstenbürsten
ATA158695A (de) Verfahren zum beschichten von oberflächen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition