DE69632490D1 - Verfahren und Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen - Google Patents
Verfahren und Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen PlaniervorgängenInfo
- Publication number
- DE69632490D1 DE69632490D1 DE69632490T DE69632490T DE69632490D1 DE 69632490 D1 DE69632490 D1 DE 69632490D1 DE 69632490 T DE69632490 T DE 69632490T DE 69632490 T DE69632490 T DE 69632490T DE 69632490 D1 DE69632490 D1 DE 69632490D1
- Authority
- DE
- Germany
- Prior art keywords
- determination
- chemical
- situ control
- mechanical leveling
- leveling processes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0683—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating measurement during deposition or removal of the layer
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41398295A | 1995-03-28 | 1995-03-28 | |
US413982 | 1995-03-28 | ||
US605769 | 1996-02-22 | ||
US08/605,769 US5964643A (en) | 1995-03-28 | 1996-02-22 | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69632490D1 true DE69632490D1 (de) | 2004-06-17 |
DE69632490T2 DE69632490T2 (de) | 2005-05-12 |
Family
ID=23639462
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69635816T Expired - Lifetime DE69635816T2 (de) | 1995-03-28 | 1996-03-28 | Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen |
DE69632490T Expired - Fee Related DE69632490T2 (de) | 1995-03-28 | 1996-03-28 | Verfahren und Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen |
DE69618698T Expired - Lifetime DE69618698T2 (de) | 1995-03-28 | 1996-03-28 | Verfahren und Vorrichtung zur In-Situ-Kontroll und Bestimmung des Endes von chemisch-mechanischen Planiervorgänge |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69635816T Expired - Lifetime DE69635816T2 (de) | 1995-03-28 | 1996-03-28 | Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69618698T Expired - Lifetime DE69618698T2 (de) | 1995-03-28 | 1996-03-28 | Verfahren und Vorrichtung zur In-Situ-Kontroll und Bestimmung des Endes von chemisch-mechanischen Planiervorgänge |
Country Status (5)
Country | Link |
---|---|
US (5) | US7731566B2 (de) |
EP (1) | EP0738561B1 (de) |
JP (3) | JP3431115B2 (de) |
KR (1) | KR100542474B1 (de) |
DE (3) | DE69635816T2 (de) |
Families Citing this family (125)
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---|---|---|---|---|
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US7037403B1 (en) | 1992-12-28 | 2006-05-02 | Applied Materials Inc. | In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization |
US6676717B1 (en) * | 1995-03-28 | 2004-01-13 | Applied Materials Inc | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
US6537133B1 (en) | 1995-03-28 | 2003-03-25 | Applied Materials, Inc. | Method for in-situ endpoint detection for chemical mechanical polishing operations |
US5964643A (en) * | 1995-03-28 | 1999-10-12 | Applied Materials, Inc. | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
US6876454B1 (en) | 1995-03-28 | 2005-04-05 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
DE69635816T2 (de) | 1995-03-28 | 2006-10-12 | Applied Materials, Inc., Santa Clara | Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen |
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-
1996
- 1996-03-28 DE DE69635816T patent/DE69635816T2/de not_active Expired - Lifetime
- 1996-03-28 EP EP96302176A patent/EP0738561B1/de not_active Expired - Lifetime
- 1996-03-28 JP JP07497696A patent/JP3431115B2/ja not_active Expired - Lifetime
- 1996-03-28 DE DE69632490T patent/DE69632490T2/de not_active Expired - Fee Related
- 1996-03-28 DE DE69618698T patent/DE69618698T2/de not_active Expired - Lifetime
-
2002
- 2002-12-26 KR KR1020020083942A patent/KR100542474B1/ko not_active IP Right Cessation
-
2003
- 2003-02-19 JP JP2003041566A patent/JP3510622B2/ja not_active Expired - Lifetime
- 2003-09-18 JP JP2003326193A patent/JP2004048051A/ja active Pending
-
2007
- 2007-08-14 US US11/838,808 patent/US7731566B2/en not_active Expired - Fee Related
-
2010
- 2010-06-03 US US12/793,438 patent/US7841926B2/en not_active Expired - Fee Related
- 2010-11-29 US US12/955,690 patent/US8092274B2/en not_active Expired - Fee Related
-
2012
- 2012-01-06 US US13/345,487 patent/US8556679B2/en not_active Expired - Fee Related
-
2013
- 2013-10-10 US US14/051,308 patent/US20140038501A1/en not_active Abandoned
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US20120107971A1 (en) | 2012-05-03 |
EP0738561A1 (de) | 1996-10-23 |
DE69635816D1 (de) | 2006-04-20 |
KR100542474B1 (ko) | 2006-01-11 |
US8556679B2 (en) | 2013-10-15 |
US20140038501A1 (en) | 2014-02-06 |
DE69618698T2 (de) | 2002-08-14 |
US20110070808A1 (en) | 2011-03-24 |
JP3431115B2 (ja) | 2003-07-28 |
US8092274B2 (en) | 2012-01-10 |
DE69632490T2 (de) | 2005-05-12 |
JP2004048051A (ja) | 2004-02-12 |
JPH097985A (ja) | 1997-01-10 |
DE69635816T2 (de) | 2006-10-12 |
JP3510622B2 (ja) | 2004-03-29 |
EP0738561B1 (de) | 2002-01-23 |
DE69618698D1 (de) | 2002-03-14 |
JP2004006663A (ja) | 2004-01-08 |
US7731566B2 (en) | 2010-06-08 |
US20080227367A1 (en) | 2008-09-18 |
US20100240281A1 (en) | 2010-09-23 |
US7841926B2 (en) | 2010-11-30 |
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