DE69635397D1 - Halbleitervorrichtung mit Chipabmessungen und Herstellungsverfahren - Google Patents

Halbleitervorrichtung mit Chipabmessungen und Herstellungsverfahren

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Publication number
DE69635397D1
DE69635397D1 DE69635397T DE69635397T DE69635397D1 DE 69635397 D1 DE69635397 D1 DE 69635397D1 DE 69635397 T DE69635397 T DE 69635397T DE 69635397 T DE69635397 T DE 69635397T DE 69635397 D1 DE69635397 D1 DE 69635397D1
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DE
Germany
Prior art keywords
manufacturing
semiconductor device
chip dimensions
dimensions
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69635397T
Other languages
English (en)
Other versions
DE69635397T2 (de
Inventor
Masatoshi Akagawa
Mitsutoshi Higashi
Hajime Iizuka
Takehiro Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP22625095A external-priority patent/JP3301894B2/ja
Priority claimed from JP25986195A external-priority patent/JP3356921B2/ja
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Publication of DE69635397D1 publication Critical patent/DE69635397D1/de
Application granted granted Critical
Publication of DE69635397T2 publication Critical patent/DE69635397T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
DE69635397T 1995-03-24 1996-03-21 Halbleitervorrichtung mit Chipabmessungen und Herstellungsverfahren Expired - Lifetime DE69635397T2 (de)

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JP22625095A JP3301894B2 (ja) 1995-04-10 1995-09-04 半導体装置の製造方法
JP22625095 1995-09-04
JP25986195 1995-10-06
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US5834844A (en) 1998-11-10
US5960308A (en) 1999-09-28
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EP1335422B1 (de) 2013-01-16
DE69635397T2 (de) 2006-05-24
EP1335422A3 (de) 2003-11-26
EP0734059A2 (de) 1996-09-25

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