DE69706734D1 - Aluminiumnitrid-Sinterkörper, eingebetteter Metallgegenstand, Elektronikfunktionsmaterial und elektrostatische Einspannvorrichtung - Google Patents
Aluminiumnitrid-Sinterkörper, eingebetteter Metallgegenstand, Elektronikfunktionsmaterial und elektrostatische EinspannvorrichtungInfo
- Publication number
- DE69706734D1 DE69706734D1 DE69706734T DE69706734T DE69706734D1 DE 69706734 D1 DE69706734 D1 DE 69706734D1 DE 69706734 T DE69706734 T DE 69706734T DE 69706734 T DE69706734 T DE 69706734T DE 69706734 D1 DE69706734 D1 DE 69706734D1
- Authority
- DE
- Germany
- Prior art keywords
- sintered body
- aluminum nitride
- electrostatic chuck
- functional material
- nitride sintered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/23—Chucks or sockets with magnetic or electrostatic means
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9955796 | 1996-03-29 | ||
JP07279997A JP3457495B2 (ja) | 1996-03-29 | 1997-03-11 | 窒化アルミニウム焼結体、金属埋設品、電子機能材料および静電チャック |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69706734D1 true DE69706734D1 (de) | 2001-10-25 |
DE69706734T2 DE69706734T2 (de) | 2002-07-04 |
Family
ID=26413933
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69706734T Expired - Lifetime DE69706734T2 (de) | 1996-03-29 | 1997-03-26 | Aluminiumnitrid-Sinterkörper, eingebetteter Metallgegenstand, Elektronikfunktionsmaterial und elektrostatische Einspannvorrichtung |
DE69736205T Expired - Lifetime DE69736205T2 (de) | 1996-03-29 | 1997-03-26 | Aluminumnitridsinterkörper, Gegenstand mit eingebettetem Metall, elektronisch funktionalem Material und elektrostatische Einspannvorrichtung |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69736205T Expired - Lifetime DE69736205T2 (de) | 1996-03-29 | 1997-03-26 | Aluminumnitridsinterkörper, Gegenstand mit eingebettetem Metall, elektronisch funktionalem Material und elektrostatische Einspannvorrichtung |
Country Status (6)
Country | Link |
---|---|
US (1) | US6001760A (de) |
EP (2) | EP1128425B1 (de) |
JP (1) | JP3457495B2 (de) |
KR (1) | KR100268481B1 (de) |
DE (2) | DE69706734T2 (de) |
TW (1) | TW561138B (de) |
Families Citing this family (86)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3670416B2 (ja) | 1995-11-01 | 2005-07-13 | 日本碍子株式会社 | 金属包含材および静電チャック |
US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
JP4236292B2 (ja) * | 1997-03-06 | 2009-03-11 | 日本碍子株式会社 | ウエハー吸着装置およびその製造方法 |
JPH10275524A (ja) * | 1997-03-31 | 1998-10-13 | Kyocera Corp | 耐プラズマ部材 |
JP3670444B2 (ja) * | 1997-06-06 | 2005-07-13 | 日本碍子株式会社 | 窒化アルミニウム基複合体、電子機能材料、静電チャックおよび窒化アルミニウム基複合体の製造方法 |
JP3318514B2 (ja) * | 1997-08-06 | 2002-08-26 | 日本碍子株式会社 | 半導体支持装置 |
JP3433063B2 (ja) * | 1997-09-29 | 2003-08-04 | 日本碍子株式会社 | 窒化アルミニウム焼結体、電子機能材料および静電チャック |
CA2252113A1 (en) * | 1997-10-29 | 1999-04-29 | Yoshihiko Numata | Substrate and process for producing the same |
US5909355A (en) * | 1997-12-02 | 1999-06-01 | Applied Materials, Inc. | Ceramic electrostatic chuck and method of fabricating same |
JPH11209182A (ja) * | 1998-01-22 | 1999-08-03 | Sumitomo Metal Ind Ltd | プラズマ耐食部材 |
JPH11214491A (ja) * | 1998-01-22 | 1999-08-06 | Toshiba Ceramics Co Ltd | ウエハ保持装置及びその製造方法 |
JP3527840B2 (ja) * | 1998-01-28 | 2004-05-17 | 京セラ株式会社 | 静電チャック |
JP4013386B2 (ja) * | 1998-03-02 | 2007-11-28 | 住友電気工業株式会社 | 半導体製造用保持体およびその製造方法 |
JP4003907B2 (ja) * | 1998-07-08 | 2007-11-07 | コバレントマテリアル株式会社 | 窒化アルミニウム焼結体からなる半導体製造装置関連製品及びその製造方法並びに静電チャック、サセプタ、ダミーウエハ、クランプリング及びパーティクルキャッチャー |
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JP3273773B2 (ja) | 1999-08-12 | 2002-04-15 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ、半導体製造・検査装置用静電チャックおよびウエハプローバ用チャックトップ |
JP2001064079A (ja) * | 1999-08-25 | 2001-03-13 | Sumitomo Electric Ind Ltd | 窒化アルミニウム焼結体及びその製造方法 |
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JP4447750B2 (ja) * | 1999-09-30 | 2010-04-07 | 日本碍子株式会社 | 窒化アルミニウム焼結体および半導体製造用部材 |
US20040222211A1 (en) * | 1999-12-28 | 2004-11-11 | Ibiden Co., Ltd. | Carbon-containing aluminum nitride sintered body, and ceramic substrate for a semiconductor producing/examining device |
JP3228924B2 (ja) | 2000-01-21 | 2001-11-12 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ |
US6888236B2 (en) * | 2000-03-07 | 2005-05-03 | Ibiden Co., Ltd. | Ceramic substrate for manufacture/inspection of semiconductor |
JP2001278665A (ja) * | 2000-03-29 | 2001-10-10 | Kyocera Corp | セラミック抵抗体及び基板支持体 |
TWI254403B (en) * | 2000-05-19 | 2006-05-01 | Ngk Insulators Ltd | Electrostatic clamper, and electrostatic attracting structures |
JP2001342070A (ja) * | 2000-05-29 | 2001-12-11 | Kyocera Corp | セラミック抵抗体及び保持部材 |
JP3605347B2 (ja) * | 2000-06-27 | 2004-12-22 | 京セラ株式会社 | 電極内蔵セラミックスの製造方法、吸着装置及び半導体製造装置 |
TW512645B (en) | 2000-07-25 | 2002-12-01 | Ibiden Co Ltd | Ceramic substrate for semiconductor manufacture/inspection apparatus, ceramic heater, electrostatic clamp holder, and substrate for wafer prober |
JP2002047067A (ja) * | 2000-07-31 | 2002-02-12 | Kyocera Corp | 電極内蔵セラミックス及びその製造方法 |
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DE20114544U1 (de) | 2000-12-04 | 2002-02-21 | Cascade Microtech Inc | Wafersonde |
TWI243158B (en) * | 2000-12-21 | 2005-11-11 | Ngk Insulators Ltd | Aluminum nitride sintered bodies |
JP4514379B2 (ja) * | 2000-12-21 | 2010-07-28 | 日本碍子株式会社 | 窒化アルミニウム焼結体及び半導体製造装置用部材 |
JP3740383B2 (ja) * | 2001-05-28 | 2006-02-01 | 京セラ株式会社 | 保持装置 |
JP2003012376A (ja) * | 2001-06-27 | 2003-01-15 | Kyocera Corp | 抵抗体及びその製造方法並びに保持装置 |
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JP4243943B2 (ja) | 2002-04-22 | 2009-03-25 | 日本碍子株式会社 | 窒化アルミニウム材料および半導体製造用部材 |
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JP3214890B2 (ja) * | 1991-05-30 | 2001-10-02 | 京セラ株式会社 | 窒化アルミニウム焼結体およびその製法、並びにそれを用いた焼成用治具 |
JP3447305B2 (ja) * | 1991-07-30 | 2003-09-16 | 京セラ株式会社 | 静電チャック |
US5413360A (en) * | 1992-12-01 | 1995-05-09 | Kyocera Corporation | Electrostatic chuck |
JP3670416B2 (ja) * | 1995-11-01 | 2005-07-13 | 日本碍子株式会社 | 金属包含材および静電チャック |
-
1997
- 1997-03-11 JP JP07279997A patent/JP3457495B2/ja not_active Expired - Lifetime
- 1997-03-25 TW TW086103801A patent/TW561138B/zh not_active IP Right Cessation
- 1997-03-25 US US08/824,560 patent/US6001760A/en not_active Expired - Lifetime
- 1997-03-26 DE DE69706734T patent/DE69706734T2/de not_active Expired - Lifetime
- 1997-03-26 EP EP01103195A patent/EP1128425B1/de not_active Expired - Lifetime
- 1997-03-26 DE DE69736205T patent/DE69736205T2/de not_active Expired - Lifetime
- 1997-03-26 EP EP97302083A patent/EP0798278B1/de not_active Expired - Lifetime
- 1997-03-29 KR KR1019970011434A patent/KR100268481B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US6001760A (en) | 1999-12-14 |
DE69736205D1 (de) | 2006-08-03 |
EP0798278B1 (de) | 2001-09-19 |
KR100268481B1 (ko) | 2000-10-16 |
EP0798278A3 (de) | 1998-03-04 |
TW561138B (en) | 2003-11-11 |
EP0798278A2 (de) | 1997-10-01 |
EP1128425B1 (de) | 2006-06-21 |
DE69736205T2 (de) | 2007-05-16 |
JP3457495B2 (ja) | 2003-10-20 |
JPH09315867A (ja) | 1997-12-09 |
DE69706734T2 (de) | 2002-07-04 |
KR19980023985A (ko) | 1998-07-06 |
EP1128425A1 (de) | 2001-08-29 |
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